Abstract: Methods of forming mold cavities suitable for hook and loop fastening are disclosed, along with effective hook construction and hook and loop fastener products that have an ultrathin cross-section. Photochemical techniques are employed to form plates that define hook-form mold cavities, and, alternatively, chemical etching is employed following preforming of the cavities and machining. Hooks having three-dimensional tapers with enhanced loop engaging characteristics are disclosed. By utilization of special surface finishes and tolerances, hook fasteners, having ultrathin cross-sections are realized, that pave the way for practical use of touch fasteners in a wide range of new areas.

Abstract: A system and method for providing telephony and high-speed data access over a broadband access network, comprising a network interface unit (NIU) coupled to a backup local exchange carrier (LEC) line, the broadband access network coupled to the NIU, an intermediate point-of-presence (IPOP) coupled to the broadband access network, and at least one external access network coupled to the IPOP. The system also provides for a fail-safe mode in which the NIU supports the LEC line for lifeline services.

Abstract: Methods of forming mold cavities (1) suitable for hook and loop fastening (100), along with effective hook construction and hook and loop fastener products that have an ultrathin cross section (118). Photochemical techniques are employed to form plates (250) that define hook-form mold cavities (1), and, alternatively, chemical etching is employed following preforming of the cavities and machining. Included are hooks having three-dimensional tapers with enhanced loop engaging characteristics. By utilization of special surface finishes and tolerances, hook fasteners, having ultrathin cross sections (118) are realized, that pave the way for practical use of touch fasteners in a wide range of new areas.

Abstract: A method of manufacturing plates assembleable in a stack to provide a mold to form fastener elements includes applying a photoresist material to at least one side of the plate. The photoresist material is exposed to light. Portions of the photoresist material are removed based on the light exposure. Acid is applied to the plate, dissolving portions of the plate exposed to the acid and creating cavities.