Patents by Inventor Joseph Gene Sabia

Joseph Gene Sabia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6194024
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher
  • Patent number: 6134772
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: October 24, 2000
    Assignee: International Business Machines Corporation
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher
  • Patent number: 6106891
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: August 22, 2000
    Assignee: International Business Machines Corporation
    Inventors: Joseph Duane Kulesza, Voya Rista Markovich, Kostas Papathomas, Joseph Gene Sabia
  • Patent number: 5887345
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: March 30, 1999
    Assignee: International Business Machines Corporation
    Inventors: Joseph Duane Kulesza, Voya Rista Markovich, Kostas Papathomas, Joseph Gene Sabia
  • Patent number: 5766670
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: November 17, 1993
    Date of Patent: June 16, 1998
    Inventors: Roy Lynn Arldt, Christina Marie Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza, John Matthew Lauffer, Philip Chihchau Liu, Voya Rista Markovich, Issa Said Mahmoud, James Francis Muska, Kostas Papathomas, Joseph Gene Sabia, Richard Anthony Schumacher