Abstract: The invention relates to a process for attaching a demountable flexible module to a circuit board, and includes the following steps: providing a circuit board having at least one, preferably a plurality, of gold plated metal balls disposed thereon; providing a flexible module having at least one, preferably a plurality, of gold plated vias disposed therein; positioning an elastomer stop over the circuit board; positioning the flexible module over the balls; applying pressure to the flexible module for a time sufficient to form a line contact between the gold plating on the vias and the gold plating on the metal ball of the circuit board, wherein the module is removable without heating the module. The process does not use solder to attach the module to the board, and requires substantially less than 2000 psi, and preferably less than 400 psi, to attach the module which produces little, if any, deformation to the flexible module.

Abstract: The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

Abstract: The present invention relates to a circuitized board having removable flexible modules disposed thereon. The flexible modules are mechanically and electrically connected to the board to provide an apertured connect, yet may be easily removed without using heat. The invention also relates to a circuit package including a substrate and a flexible module. The substrate includes a circuit board, a plurality of pads affixed to the circuit board, and a plurality of gold plated metal balls affixed atop the pads. The flexible module includes a flexible dielectric member and gold plated vias disposed in the flexible dielectric member wherein at least some of the vias are positioned over the metal balls so that a line contact is made between the vias and the metal balls.

Abstract: The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.