Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an integrated circuit (IC) chip, an energy supply operable to electrically power the IC chip, and an energy harvesting (EH) device operable to convert non-electrical energy to electrical energy supplied to the energy supply. A material substantially encloses at least a portion of at least one of the IC chip, the energy supply, and the EH device.

Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an integrated circuit (IC) chip, an energy supply operable to electrically power the IC chip, and an energy harvesting (EH) device operable to convert non-electrical energy to electrical energy supplied to the energy supply. A material substantially encloses at least a portion of at least one of the IC chip, the energy supply, and the EH device.

Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an integrated circuit (IC) chip, an energy supply operable to electrically power the IC chip, and an energy harvesting (EH) device operable to convert non-electrical energy to electrical energy supplied to the energy supply. A material substantially encloses at least a portion of at least one of the IC chip, the energy supply, and the EH device.

Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an integrated circuit (IC) chip, an energy supply operable to electrically power the IC chip, and an energy harvesting (EH) device operable to convert non-electrical energy to electrical energy supplied to the energy supply. A material substantially encloses at least a portion of at least one of the IC chip, the energy supply, and the EH device.

Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit chip. The integrated circuit chip is electrically coupled to the antenna and the energy supply. A material substantially encloses the electronic device.

Abstract: An apparatus including an electronic device having a plurality of substantially collocated components, the plurality of components including an antenna, an energy supply and an integrated circuit chip. The integrated circuit chip is electrically coupled to the antenna and the energy supply. A material substantially encloses the electronic device.

Abstract: A data and communication system including a hand-held unit (17) and an infrared communication satellite (10) is used to provide for the interchange of data between a host computer (13), individual personal computers (15), the hand-held computing unit (17) and factory machinery, including process controllers.

Abstract: A data and communication system including a hand-held unit (17) and an infrared communication satellite (10) is used to provide for the interchange of data between a host computer (13), individual personal computers (15), the hand-held computing unit (17) and factory machinery, including process controllers.

Abstract: A data and communication system including a hand-held unit and an infrared communication satellite is used to provide for the interchange of data between a host computer, individual personal computers, the hand-held computing unit, and factory machinery, including process controllers.

Abstract: A flat geometry interconnect media connects the electrodes of a laminated power source in electrical contact with positive and negative power input terminals on a planar substrate. The interconnect media is in the form of a flexible, laminated strip having a central conductive lamina sandwiched between a pair of insulation laminae. The flexible, laminated interconnect media is folded about the anode and cathode of the laminated power source for presenting positive and negative battery terminals in substantially coplanar relation for electrical contact with substrate lands or metallization deposits situated on one side of a printed circuit board. The laminated battery supplies backup operating power to integrated circuit devices such as static random access memories.

Abstract: An integrated circuit package encapsulates a memory chip and a laminated backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a device support plate on one side of the lead frame. The laminated battery is supported beneath the device support plate on the opposite side of the lead frame. A flat geometry interconnect media connects the electrodes of the laminated backup battery for wire bond interconnection with the positive and negative power input nodes of the memory chip. The interconnect media is in the form of a flexible, laminated strip having a central conductive laminate sandwiched between a pair of insulation laminates. The integrated circuit chip, the laminated battery, the interconnected media, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.