Patents by Inventor Joseph J. Lynch

Joseph J. Lynch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10779392
    Abstract: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: September 15, 2020
    Assignee: Interplex Industries, Inc.
    Inventors: Richard Schneider, Joseph J. Lynch, Craig Kennedy, Vu Phan
  • Publication number: 20200060022
    Abstract: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.
    Type: Application
    Filed: September 24, 2019
    Publication date: February 20, 2020
    Inventors: Richard Schneider, Joseph J. Lynch, Craig Kennedy, Vu Phan
  • Patent number: 10485092
    Abstract: A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: November 19, 2019
    Assignee: INTERPLEX INDUSTRIES, INC.
    Inventors: Richard Schneider, Joseph J. Lynch
  • Publication number: 20180049310
    Abstract: A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.
    Type: Application
    Filed: February 16, 2016
    Publication date: February 15, 2018
    Inventors: Richard Schneider, Joseph J. Lynch
  • Patent number: 9289261
    Abstract: An electrosurgical device comprising: an electrode having a first portion whose exterior is electrically uninsulated, a second portion whose exterior is electrically insulated, and a third portion; an elongated hollow body having an internal cavity, a front end, a rear end, an external surface, and an electrical wire arranged within the body. The hollow body is configured to reversibly receive the third portion of the electrode at the front end of the body such that electrical contact is made between the electrode and the electrical wire and the second portion of the electrode is not surrounded by the hollow body. A first button is provided for controlling a current flow at a first level to the electrode and is arranged on the external surface. A vacuum tube is slidably engaged by the body and has an inlet generally facing the front end and adjacent the electrode.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: March 22, 2016
    Assignee: Buffalo Filter LLC
    Inventors: Kyrylo Shvetsov, Anthony L Lizauckas, III, Gregory J. Pepe, Daniel R Palmerton, Joseph J Lynch, Christopher A Palmerton
  • Publication number: 20110190768
    Abstract: An electrosurgical device comprising: an electrode having a first portion whose exterior is electrically uninsulated, a second portion whose exterior is electrically insulated, and a third portion; an elongated hollow body having an internal cavity, a front end, a rear end, an external surface, and an electrical wire arranged within the body. The hollow body is configured to reversibly receive the third portion of the electrode at the front end of the body such that electrical contact is made between the electrode and the electrical wire and the second portion of the electrode is not surrounded by the hollow body. A first button is provided for controlling a current flow at a first level to the electrode and is arranged on the external surface. A vacuum tube is slidably engaged by the body and has an inlet generally facing the front end and adjacent the electrode.
    Type: Application
    Filed: February 4, 2011
    Publication date: August 4, 2011
    Applicant: MEDTEK DEVICES, INC.
    Inventors: Kyrylo Shvetsov, Anthony L. Lizauckas, III, Gregory J. Pepe, Daniel R. Palmerton, Joseph J. Lynch, Christopher A. Palmerton
  • Publication number: 20090283305
    Abstract: A tin-silver coating for use with circuit boards, which can include a conductive circuit with an exposed surface disposed on a substrate. The tin-silver coating covers the exposed surface of the conductive circuit. The conductive circuit can include electrical traces, contact pads and vias, each of which may include or be formed of copper. In one embodiment, the tin-silver coating can include a tin weight percentage between 85 and 99.5%, while the silver weight percentage can be between 0.5 and 15%. In one embodiment the tin-silver coating can be between 35 and 60 millionths of an inch. A barrier plate may also be included between the conductive circuit and the tin-silver coating.
    Type: Application
    Filed: May 14, 2009
    Publication date: November 19, 2009
    Applicant: Interplex Industries, Inc.
    Inventors: Joseph J. Lynch, Richard Schneider
  • Publication number: 20090239398
    Abstract: A tin-silver press-fit interconnect which includes a press-fit terminal having a coating or finish of a tin-silver compound for use with a terminal receiving device. The tin-silver compound serves to prevent the formation of tin whiskers which appear most frequently in pure tin coated electrical components under mechanical stress and which make the electronic device susceptible to short circuits. The tin-silver compound may include between 85 and 99.5% weight of tin and between 0.5 and 15% weight of silver and is applied at a thickness range between 0.4 and 5 microns using a technique such as electroplating, hot dip or immersion.
    Type: Application
    Filed: March 20, 2009
    Publication date: September 24, 2009
    Applicant: Interplex NAS, Inc.
    Inventors: Joseph J. Lynch, Richard Schneider
  • Patent number: 6700079
    Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: March 2, 2004
    Assignee: Autosplice, Inc.
    Inventors: Robert M. Bogursky, Craig M. Kennedy, Kenneth Krone, Joseph J. Lynch
  • Patent number: 6623283
    Abstract: A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: September 23, 2003
    Assignee: Autosplice, Inc.
    Inventors: Gregory K. Torigian, Gary L. Tomczak, Joseph J. Lynch
  • Publication number: 20030079911
    Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially round configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.
    Type: Application
    Filed: August 13, 2001
    Publication date: May 1, 2003
    Inventors: Robert M. Bogursky, Craig M. Kennedy, Kenneth Krone, Joseph J. Lynch
  • Publication number: 20030029638
    Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.
    Type: Application
    Filed: February 28, 2002
    Publication date: February 13, 2003
    Applicant: Autosplice Inc.
    Inventors: Robert M. Bogursky, Craig M. Kenndey, Kenneth Krone, Joseph J. Lynch
  • Patent number: 6380195
    Abstract: A composition for preventing and/or treating heart failure and ventricular dysfunction in a warm blooded animal comprising a therapeutically effective amount of an endothelin antagonist of the formula: is disclosed
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: April 30, 2002
    Assignee: Banyu Pharmaceutical Co., Ltd.
    Inventors: Joseph J. Lynch, Jr., You-Tang Shen
  • Patent number: 6214809
    Abstract: A method of treating or preventing supraventricular tachyarrhythmias is disclosed which comprises the use of a compound which selectively blocks the ultra-rapidly-activating delayed rectifier K+ current (IKur) of the human atrium.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: April 10, 2001
    Assignee: Merck & Co., Inc.
    Inventors: Bernard Fermini, Joseph J. Lynch, Jr., Joseph J. Salata, Richard J. Swanson
  • Patent number: 6214810
    Abstract: This application discloses a method of treating or preventing atrial arrhythmias which utilizes compounds which are blockers of the ultra-rapidly-activating delayed rectifier K+ current (IKur) of the human atrium in a use-dependent and/or rate dependent manner, and which provide the selective block preferentially at fast heart rates so that the effect is realized or maximized when required.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: April 10, 2001
    Assignee: Merck & Co., Inc.
    Inventors: Bernard Fermini, Joseph J. Lynch, Jr., Joseph J. Salata, Richard J. Swanson
  • Patent number: 6087360
    Abstract: A method for preventing and/or treating heart failure and ventricular dysfunction in a warm blooded animal comprising administering to the warm blooded animal a therapeutically effective amount of an endothelin antagonist of the formula: as defined herein.
    Type: Grant
    Filed: August 11, 1998
    Date of Patent: July 11, 2000
    Assignee: Banyu Pharmaceutical Co., Ltd.
    Inventors: Joseph J. Lynch, Jr., You-Tang Shen
  • Patent number: 6051781
    Abstract: A unitary metal clip is stamped from a flat strip of sheet metal which is bent to provide two pairs of generally V-shaped fingers which extend upwardly from a base and have opposing apexes. An L-shaped arm also extends upwardly from the base between the pairs of fingers and has a horizontal pick-up tab that is located at a height above the opposing apexes of the fingers. A pneumatic head of an automatic pick and place machine grabs the pick-up tab and removes the clip from a pocket of a supply tape unrolled from a reel. The base of the clip is positioned on a solder pad of a PC board before solder re-flow. The lower edge of the sidewall of an EMI shield may be pressed down to bend the pick-up tab downwardly and squeeze the sidewall between the apexes of the fingers.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: April 18, 2000
    Assignee: Autosplice, Inc.
    Inventors: Giuseppe Bianca, Joseph J. Lynch, Timothy Stephany, Robert M. Bogursky
  • Patent number: 5969017
    Abstract: This application discloses a method of treating or preventing atrial arrhythmias which utilizes compounds which are blockers of the ultra-rapidly-activating delayed rectifier K.sup.+ current (I.sub.Kur) of the human atrium in a use-dependent and/or rate dependent manner, and which provide the selective block preferentially at fast heart rates so that the effect is realized or maximized when required.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: October 19, 1999
    Assignee: Merck & Co., Inc.
    Inventors: Joseph J. Lynch, Jr., Richard J. Swanson, Joseph J. Salata, Bernard Fermini
  • Patent number: 5935945
    Abstract: A method of treating or preventing supraventricular tachyarrhythmias is disclosed which comprises the use of a compound which selectively blocks the ultra-rapidly-activating delayed rectifier K.sup.+ current (I.sub.Kur) of the human atrium.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: August 10, 1999
    Assignee: Merck & Co., Inc.
    Inventors: Joseph J. Lynch, Jr., Richard J. Swanson, Joseph J. Salata, Bernard Fermini
  • Patent number: 5834483
    Abstract: A method for preventing and/or treating heart failure and ventricular dysfunction in a warm blooded animal comprising administering to the warm blooded animal a therapeutically effective amount of endothelin antagonists described herein.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: November 10, 1998
    Assignee: Merck & Co., Inc.
    Inventors: Joseph J. Lynch, Jr., You-Tang Shen