Abstract: In an electronic package, improved disk shaped thermal bridge elements provide multiple conductive paths between devices to be cooled and a cold plate. The thermal bridge elements are disks progressively stacked and having bulge shapes and radial finger contacts for providing multiple compliant heat conduction paths between each device and a cold plate.

Abstract: The present invention dissipates the heat generated by high powered VLSI chips to a heat sink in a very efficient manner, providing a thermal resistance heretofore not possible in heat conduction module cold plate type systems. A finned internal thermal device having a flat bottom contacts the chips, while corresponding fins in a finned cooling hat mounted to a cold plate form gaps into which the fins of the finned internal thermal devices are slidably mounted. A preferred double cantilever spring between the finned internal thermal devices and fins of the finned cooling hat and a compliant thermally conductive interface such as synthetic oil between the chips and flat base of the finned internal devices provide efficient, non-rigid interfaces throughout the system, while assuring good thermal contact between the system components.

Abstract: An apparatus for removing heat from a heat generating device. The apparatus includes at least one heat conductive finned thermal device insert including a base having at least one first fin, and preferably haing a plurality of first fins, on a first surface and a second surface which is flat and a heat conductive second thermal device, preferably a cooling hat, having a plurality of second fins. The first fins are interspersed with the second fins. At least one of the first and second fins is of a thermally conductive, flexible material so that a gap otherwise existing between the interspersed fins is substantially eliminated. Finally, at least a portion of the first and second fins are biased against one another.

Abstract: A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions individually bonded to a surface of the package, each of the leg portions of an individual fin element being integral with different but adjacent flat base portions, in operation the heat sink preventing a build-up of stresses at the bonded interface of the base portions and package due to differential coefficient of expansions of the heat sink and package.

Abstract: A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

Abstract: A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially compressible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member and the second plate member in operative engagement.

Abstract: A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.