Patents by Inventor Joshua T. Smith
Joshua T. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11517873Abstract: Methods of liquid-phase synthesis of polymers using polymer substrates and systems for facilitating such methods allow gating of a synthetic reaction into a binary (reacted or unreacted) readout. Polymer substrates are used as carriers for molecular reagents and act as separation tags that allow them to be purified using nanoscale deterministic lateral displacement. Two polymer substrates are linked together by a bond-forming reaction to form a longer polymer that includes a synthetic product. The synthetic product can be purified away from unreacted polymers/reagents using strand-length dependent lateral displacement.Type: GrantFiled: October 29, 2019Date of Patent: December 6, 2022Assignee: International Business Machines CorporationInventors: Benjamin H. Wunsch, Stacey M. Gifford, Sung-Cheol Kim, Joshua T. Smith
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Publication number: 20220362774Abstract: Microfluidic chips that can comprise thin substrates and/or a high density of vias are described herein. An apparatus comprises: a silicon device layer comprising a plurality of vias, the plurality of vias comprising greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer, and the plurality of vias extending through the silicon device layer; and a sealing layer bonded to the silicon device layer, wherein the sealing layer has greater rigidity than the silicon device layer. In some embodiments, the silicon device layer has a thickness between about 7 micrometers and about 500 micrometers while a via of the plurality of vias has a diameter between about 5 micrometers and about 5 millimeters.Type: ApplicationFiled: July 21, 2022Publication date: November 17, 2022Inventors: Joshua T. Smith, William Francis Landers, Kevin Winstel, Teresa Jacqueline Wu
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Publication number: 20220347681Abstract: Techniques regarding microfluidic chips with one or more vias filled with sacrificial plugs and/or manufacturing methods thereof are provided herein. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a silicon device layer of a microfluidic chip comprising a plurality of vias extending through the silicon device layer. The plurality of vias comprise greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer. Additionally, the apparatus can comprise a plurality of sacrificial plugs positioned in the plurality of vias.Type: ApplicationFiled: July 19, 2022Publication date: November 3, 2022Inventors: Joshua T. Smith, Robert Bruce, Jyotica V. Patel, Benjamin Wunsch
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Patent number: 11458474Abstract: Microfluidic chips that can comprise thin substrates and/or a high density of vias are described herein. An apparatus comprises: a silicon device layer comprising a plurality of vias, the plurality of vias comprising greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer, and the plurality of vias extending through the silicon device layer; and a sealing layer bonded to the silicon device layer, wherein the sealing layer has greater rigidity than the silicon device layer. In some embodiments, the silicon device layer has a thickness between about 7 micrometers and about 500 micrometers while a via of the plurality of vias has a diameter between about 5 micrometers and about 5 millimeters.Type: GrantFiled: January 19, 2018Date of Patent: October 4, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joshua T. Smith, William Francis Landers, Kevin Winstel, Teresa Jacqueline Wu
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Patent number: 11440002Abstract: Techniques regarding microfluidic chips with one or more vias filled with sacrificial plugs and/or manufacturing methods thereof are provided herein. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a silicon device layer of a microfluidic chip comprising a plurality of vias extending through the silicon device layer. The plurality of vias comprise greater than or equal to about 100 vias per square centimeter of a surface of the silicon device layer and less than or equal to about 100,000 vias per square centimeter of the surface of the silicon device layer. Additionally, the apparatus can comprise a plurality of sacrificial plugs positioned in the plurality of vias.Type: GrantFiled: October 23, 2018Date of Patent: September 13, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joshua T. Smith, Robert Bruce, Jyotica V. Patel, Benjamin Wunsch
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Publication number: 20220281728Abstract: Systems and methods provide assistance to an operator of a material handling vehicle. A training reinforcement assistance device has a frame supporting an optical system, the optical system being configured to display virtual content on a display, and to enable viewing of at least a portion of a surrounding environment; an imager operably coupled with the frame; an accelerometer operably coupled with the frame and configured to detect an orientation of the frame; an eye-tracking unit operably coupled with the frame and configured to detect a viewing direction of an operator; and a controller operably coupled with the imager and the display. The controller receives environmental information from at least one of the imager, the accelerometer, or the eye-tracking unit and to overlay the image of the environment to assist the operator in maneuvering a material handling vehicle based on vehicle kinematics of the material handling vehicle.Type: ApplicationFiled: March 3, 2022Publication date: September 8, 2022Inventors: Joseph A. Weiss, Gregory W. Smiley, Joshua T. Smith
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Patent number: 11419656Abstract: A thermal regulation catheter system and method of use are disclosed, for moderating the temperature and other parameters of tissue surrounding a target tissue for an ablation procedure, or for performing a thermal treatment procedure. In an embodiment, the device includes a catheter having a shaft with a fluid supply line and a fluid return line disposed therein, and an inflatable heat exchange vessel at a distal end of the shaft. The fluid supply line supplies fluid to inflate the heat exchange vessel, and the fluid return line conducts fluid away from the heat exchange vessel.Type: GrantFiled: April 3, 2015Date of Patent: August 23, 2022Assignee: CPSI Holdings LLCInventors: John M. Baust, Jennie F. McKain, Anthony T. Robilotto, Joshua T. Smith
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Publication number: 20220205589Abstract: A method of generating a pressurized, sub-cooled mixed-phase cryogen is disclosed, including providing a cryogenic system including a reservoir containing a liquid cryogen; and a heat exchange coil immersed in the liquid cryogen, the heat exchange coil having an input end and an output end not immersed in the liquid cryogen; introducing a pressurized gas cryogen to the input end of the heat exchange coil; cooling the pressurized gas cryogen within the heat exchange coil; and collecting the pressurized gas cryogen at an output end of the heat exchange coil.Type: ApplicationFiled: March 18, 2022Publication date: June 30, 2022Inventors: John M. Baust, Joshua T. Smith, Anthony T. Robilotto, Jennie F. McKain
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Patent number: 11338285Abstract: A technique relates to a fluidic cell configured to hold a nanofluidic chip. A first plate is configured to hold the nanofluidic chip. A second plate is configured to fit on top of the first plate, such that the nanofluidic chip is held in place. The second plate has at least one first port and at least one second port. The second plate has an entrance hole configured to communicate with an inlet hole of the nanofluidic chip. The second port is angled above the first port, such that the first port and second port intersect to form a junction. The second port is formed to have a line-of-sight to the entrance hole, such that the second port is configured to receive input for extracting air trapped at a vicinity of the entrance hole.Type: GrantFiled: May 31, 2019Date of Patent: May 24, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Pereira, Joshua T. Smith, Benjamin H. Wunsch
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Publication number: 20220143605Abstract: A method of forming a microfluidic device is disclosed. The method includes forming a first dielectric layer on a substrate, forming electrodes partially into the first dielectric layer, and forming a second dielectric layer on the electrodes. The method includes filling, with a metal material, two wells formed in the second dielectric layer such that the metal material is in direct contact with the electrodes. The method includes forming a third dielectric layer on the metal material and second dielectric layer. The method includes filling, with a structural material, a channel formed between the wells such that the structural material does not directly contact the electrodes. The method includes forming a fourth dielectric layer on the third dielectric layer and the structural material, extracting the structural material through at least one vent hole in the fourth dielectric layer, and forming a fifth dielectric layer on the fourth dielectric layer.Type: ApplicationFiled: November 11, 2020Publication date: May 12, 2022Inventors: Joshua T. Smith, Benjamin Hardy Wunsch, Adele L. Pacquette, Eugene J. O'Sullivan
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Patent number: 11320387Abstract: Techniques regarding one or more structures for checking the via formation are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise a microfluidic channel positioned on a silicon substrate. The apparatus can also comprise a pattern of material comprised within the microfluidic channel and positioned on a surface of the silicon substrate. Further, the pattern of material can define a future location of a through-silicon via. An advantage of such an apparatus can be that the pattern of material can facilitate checking whether the through-silicon via is fully or partially formed.Type: GrantFiled: November 28, 2018Date of Patent: May 3, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Benjamin Wunsch, Sung-Cheol Kim, Stacey Gifford, Joshua T. Smith
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Patent number: 11318464Abstract: A technique relates to a machine for sorting. A removable cartridge includes a nanofluidic module. The removable cartridge includes an input port and at least two output ports. The nanofluidic module is configured to sort particles in a sample fluid. A holder is configured to receive the removable cartridge. A pressurization system is configured to couple to the input port of the removable cartridge. The pressurization system is configured to drive the sample fluid into the nanofluidic module for separation to the at least two output ports.Type: GrantFiled: September 4, 2019Date of Patent: May 3, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Huan Hu, Michael A. Pereira, Joshua T. Smith, Benjamin H. Wunsch
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Patent number: 11306871Abstract: A cryogenic system as well as a method of generating a pressurized, sub-cooled mixed-phase cryogen and a method of delivering such a cryogen to a cryoprobe are disclosed. In an embodiment, the cryogenic system includes a reservoir containing a liquid cryogen and a sub-cooling coil immersed in the liquid cryogen. The cryogen is supplied to the sub-cooling coil and is cooled under pressure to produce a pressurized mixed phase cryogen within the sub-cooling coil. This pressurized mixed phase cryogen is provided via supply line to a cryo-device for use.Type: GrantFiled: July 23, 2018Date of Patent: April 19, 2022Assignee: CPSI Holdings LLCInventors: John M. Baust, Joshua T. Smith, Anthony T. Robilotto, Jennie F. McKain
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Patent number: 11266989Abstract: An apparatus is provided. The apparatus may comprise a layer of a microfluidic chip. The layer may comprise a nanoscale deterministic lateral displacement (nanoDLD) array. The nanoDLD array may comprise a plurality of pillars arranged in a plurality of columns. Further, the nanoDLD array may separate particles from a purified fluidic sample associated with a bodily materials of an organism. A method for purifying at least one target particle from a sample by utilizing a sized-based separation is provided. The method may include detecting the at least one target particle associated with the sample, by utilizing at least one detector molecule in a nanoDLD array. The method may then include separating the detected at least one target particle and the at least one detector molecule from a bump fraction in the sample based on a size of the detected at least one target particle.Type: GrantFiled: August 7, 2019Date of Patent: March 8, 2022Assignee: International Business Machines CorporationInventors: Stacey Gifford, Sung-Cheol Kim, Joshua T. Smith, Benjamin Hardy Wunsch
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Publication number: 20220055893Abstract: An exemplary method includes forming a sacrificial layer along sidewalls of an array of trenches that are indented into a substrate, depositing a fill layer over the sacrificial layer, and then creating an array of gaps between the fill layer and the substrate by removing the sacrificial layer along the sidewalls of the trenches, while maintaining a structural connection between the substrate and the fill layer at the floors of the trenches. The method further includes covering the substrate, the fill layer, and the gaps with a cap layer that seal fluid-tight against the substrate and the fill layer. The method further includes indenting a first reservoir and a second reservoir through the cap layer, and into the substrate and the fill layer, across the lengths of the array of gaps, so that the array of gaps connects the first reservoir in fluid communication with the second reservoir.Type: ApplicationFiled: November 7, 2021Publication date: February 24, 2022Inventors: Joshua T. Smith, Stacey Gifford, Sung-Cheol Kim, Benjamin Wunsch
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Publication number: 20220033878Abstract: Techniques regarding screening for mutations using nanoscale deterministic arrays are provided. For example, one or more embodiments described herein can comprise a method, which can comprise cleaving a deoxyribonucleic acid segment hybridized with a molecular probe to form a sample fluid. The cleaving can occur at a first end and a second end of the molecular probe. Also, the cleaving can comprise a cleaving agent that targets base pair mismatches. The method can also comprise supplying the sample fluid to a nanoscale deterministic lateral displacement array to screen for a single nucleotide polymorphism.Type: ApplicationFiled: October 14, 2021Publication date: February 3, 2022Inventors: Stacey Gifford, Benjamin Wunsch, Joshua T. Smith, Sung-Cheol Kim
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Patent number: 11221310Abstract: A method for forming a nanogap includes forming a knockoff feature on a dielectric layer and forming a trench in the dielectric layer on opposite sides of the knockoff feature. A noble metal is deposited in the trenches and over the knockoff feature. A top surface is polished to level the noble metal in the trenches with a top of the dielectric layer to form electrodes in the trenches and to remove the noble metal from the knockoff feature. A nanochannel is etched into the dielectric layer such that the knockoff feature is positioned within the nanochannel. The knockoff feature is removed to form a nanogap between the electrodes.Type: GrantFiled: October 31, 2018Date of Patent: January 11, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Adam M. Pyzyna, Joshua T. Smith, Benjamin H. Wunsch
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Patent number: 11192101Abstract: A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.Type: GrantFiled: May 22, 2019Date of Patent: December 7, 2021Assignee: International Business Machines CorporationInventors: Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Bassem M. Hamieh, Nelson Felix, Robert L. Bruce
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Patent number: 11185861Abstract: Multistage deterministic lateral displacement devices, methods of forming the devices, and methods of separating a fluid mixture including particles having three or more particle sizes generally include a first module and at least one additional module. Each module includes a condenser portion and a separate portion. The condenser portion is generally configured to focus a streamline of all particles to a center of a channel whereas the separator separates the streamline of all particles into two different streamlines. One of the streamlines focuses the largest particles in the fluid mixture along a sidewall of the channel and the other streamline of smaller particles is between opposing sidewalls that define the channel. Each additional module can be used to further separate the largest particles remaining in the fluid mixture from the smaller particles.Type: GrantFiled: June 13, 2018Date of Patent: November 30, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sung-Cheol Kim, Stacey Gifford, Joshua T. Smith, Benjamin Wunsch
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Patent number: 11186480Abstract: An exemplary method includes forming a sacrificial layer along sidewalls of an array of trenches that are indented into a substrate, depositing a fill layer over the sacrificial layer, and then creating an array of gaps between the fill layer and the substrate by removing the sacrificial layer along the sidewalls of the trenches, while maintaining a structural connection between the substrate and the fill layer at the floors of the trenches. The method further includes covering the substrate, the fill layer, and the gaps with a cap layer that seal fluid-tight against the substrate and the fill layer. The method further includes indenting a first reservoir and a second reservoir through the cap layer, and into the substrate and the fill layer, across the lengths of the array of gaps, so that the array of gaps connects the first reservoir in fluid communication with the second reservoir.Type: GrantFiled: February 14, 2019Date of Patent: November 30, 2021Assignee: International Business Machines CorporationInventors: Joshua T. Smith, Stacey Gifford, Sung-Cheol Kim, Benjamin Wunsch