Patents by Inventor Jouni Tapio MÄKI

Jouni Tapio MÄKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230341900
    Abstract: An electronic device comprises a chassis module and a rolling display arrangement partially enclosing said chassis module to slide between a retracted position and an extended position. The chassis module comprises a body having a rounded edge and a first part of a magnetic pair in a mid-section of the body proximal to the rounded edge. The rolling display arrangement comprises a foldable sheet and a support arrangement arranged to support the foldable sheet. The rolling display arrangement comprises a second part of a magnetic pair in a section opposing the first part of the magnetic pair when the rolling display arrangement is in the retracted position, said first part and second part of the magnetic pair being magnetically attracted to each other.
    Type: Application
    Filed: January 31, 2020
    Publication date: October 26, 2023
    Inventors: Jouni Tapio MÄKI, Kaisla Alina MÄKINEN
  • Patent number: 11025758
    Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: June 1, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
  • Patent number: 10999683
    Abstract: A microphone assembly comprising a microphone unit secured to a mounting element. The microphone unit has a first side comprising an audio port, and the mounting element comprises a rigid body having a mounting side. The first side of the microphone unit is arranged at a right angle to the mounting side of the mounting element. The microphone unit may comprise a micro electromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side of the mounting element may be configured for being mounted or soldered to a printed circuit board. The microphone assembly may be mounted to a device printed circuit board.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 4, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Jouni Tapio Mäki, Juuso Heiskanen
  • Patent number: 10972590
    Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: April 6, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
  • Publication number: 20210055769
    Abstract: The disclosure concerns a communication device comprising a housing with a front body and a main body. The front body comprises a display unit having a plurality of layers attached to one another. The plurality of layers comprises a suspension layer and a second layer, wherein one of the layers is a display. At two opposing edges of the suspension layer, the suspension layer extends laterally beyond at least the second layer. The suspension layer is suspended by attachment of the two opposing edges to the main body. By extending the suspension layer laterally beyond at least the second layer of the plurality of layers and by attaching the suspension layer to the main body, the entire display unit is efficiently suspended and is movable up and down in a manner efficient for the emission of sound.
    Type: Application
    Filed: February 21, 2018
    Publication date: February 25, 2021
    Inventors: Ossi MAENPAA, Jouni Tapio MÄKI
  • Publication number: 20200374378
    Abstract: A method for assembling a communication device and the communication device The communication device includes a casing that houses a battery. The battery extends in a main extension plane. The casing includes a back cover to cover the battery, and the back cover extends in a second plane substantially parallel to the main extension plane. The communication device also has an electrical signal transmission line having a first portion and a second portion. The second portion is coupled to a processor of the communication device. The first portion has a longitudinal extension coupled to at least one electrical component, wherein the first portion extends alongside the battery in a third plane substantially perpendicular to the main extension plane.
    Type: Application
    Filed: June 28, 2017
    Publication date: November 26, 2020
    Inventors: Esa Maatta, Jouni Tapio Mäki, David Powney, Mikko Kylkilahti
  • Patent number: 10827618
    Abstract: An electronic device comprises a housing comprising an audio opening, a Printed Circuit Board (PCB) arranged inside the housing, a microphone mounted on the PCB, and an audio channel assembly. The audio channel assembly comprises a first opening coupled to the audio opening, and a second opening coupled to an input of the microphone, wherein an audio channel is formed between the first opening and the second opening. The audio channel assembly is mounted on the PCB using a soldering part.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: November 3, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Jouni Tapio Mäki
  • Publication number: 20200107446
    Abstract: An electronic device comprises a housing comprising an audio opening, Printed Circuit Board (PCB) arranged inside the housing, a microphone mounted on the PCB, and an audio channel assembly. The audio channel assembly comprises a first opening coupled to the audio opening, and a second opening coupled to an input of the microphone, wherein an audio channel is formed between the first opening and the second opening. The audio channel assembly is mounted on the PCB using a soldering part.
    Type: Application
    Filed: March 23, 2017
    Publication date: April 2, 2020
    Inventor: Jouni Tapio Mäki
  • Publication number: 20200037081
    Abstract: A microphone assembly (100, 200) comprising a microphone unit (101) secured to a mounting element (110,210). The microphone unit (101) has a first side (103) comprising an audio port (104), and the mounting element (110,210) comprises a rigid body having a mounting side (111,211). The first side (103) of the microphone unit (101) is arranged at a right angle to the mounting side (111,211) of the mounting element (110,210). The microphone unit may (101) comprise a microelectromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side (111,211) of the mounting element may be configured for being mounted or soldered to a printed circuit board (121). The microphone assembly (100, 200) may be mounted to a device printed circuit board.
    Type: Application
    Filed: March 21, 2017
    Publication date: January 30, 2020
    Inventors: Jouni Tapio MÄKI, Juuso HEISKANEN