Abstract: An active inductor capable of tuning a self-resonant frequency, an inductance, a Q factor, and a peak Q frequency by applying a tunable feedback resistor to a cascode-grounded active inductor is disclosed. The tunable active inductor includes a first transistor having a source connected to a power supply voltage and a gate connected to first bias voltage; a second transistor having a drain connected to a drain of the first transistor and a gate connected to a second bias voltage; a third transistor having a drain connected to a source of the second transistor and a source connected to a ground voltage; a fourth transistor having a drain connected to a gate of the third transistor, a source connected to the ground voltage and a gate connected to a third bias voltage; a fifth transistor having a source connected to the drain of the fourth transistor and a drain connected to the power supply voltage.

Abstract: A frequency mixing apparatus is provided. In the frequency mixing apparatus, a PMOS transistor is coupled to an NMOS transistor in a cascode configuration and an LO signal is applied to the bulks of the PMOS and NMOS transistors so that an input signal applied to their gates is mixed with the LO signal. High isolation between the bulks and gates of the transistors resulting from application of the LO signal to the bulks prevents leakage of the LO signal, thereby decreasing a DC offset voltage. This renders the frequency mixing applicable to a DCR. Also, due to the cascade configuration similar to an inverter configuration, the frequency mixing apparatus can be incorporated in an FPGA of a MODEM in SDR applications. Frequency mixing based on switching of a threshold voltage decreases a noise factor and enables frequency mixing in a low supply voltage range, thereby decreasing power consumption.

Abstract: An apparatus for generating an in-phase/quadrature-phase (I/Q) signal in a wireless transceiver is disclosed, including a local oscillator for generating a local oscillation signal, and first and second mixers for mixing the oscillation signal with a transmission/reception signal to convert the transmission/reception signal into a baseband or high-frequency signal. The apparatus includes a phase locked circuit for controlling the local oscillator, and a polyphase filter installed between the local oscillator and the mixers, for separating the oscillation signal from the local oscillator into an I signal and a Q signal depending on a control signal from the phase locked circuit, and outputting the separated I and Q signals to the first and second mixers, respectively.

Abstract: A wireless communication system can comprise two or more antennas that interfere with one another via free space coupling, surface wave crosstalk, dielectric leakage, or other interference effect. The interference effect can produce an interference signal on one of the antennas. A cancellation device can suppress antenna interference by generating an estimate of the interference signal and subtracting the estimate from the interference signal. The cancellation device can generate the estimate based on sampling signals on an antenna that generates the interference or on an antenna that receives the interference. The cancellation device can comprise a model of the crosstalk effect. Transmitting test signals on the communication system can define or refine the model.

Abstract: Provided is a multiband low noise amplifier including a first transistor, an input matching circuit, and a first capacitor. The first transistor includes a collector electrically connected to a first power supply, a grounded emitter, and a base connected to the other end of a first inductor having one end as an input end of the low noise amplifier. The input matching circuit is connected between the collector and the base of the first transistor. The first capacitor connected to the collector of the first transistior. The input matching circuit includes a varactor. The input matching circuit includes a second capacitor connected to the varactor. The input matching circuit includes a first resistor connected to the varactor. In the multiband low noise amplifier, a varactor having a variable capacitance is installed at an input end, thereby easily performing band switching through bias voltage control by a small amount and minimizing noises that may be caused by a control signal.

Abstract: Antennas of broadband and multi-band operation are presented. A broadband planar antenna includes two inverted-L antennas (ILAs) facing each other across a gap. One of the ILAs is input fed, and the other is electromagnetically coupled. The positioning of the gap affects the bandwidth. A dual-band planar antenna includes two ILAs facing each other across a gap with one of the ILAs being input fed, and the other being coupled. This dual-band planar antenna also includes a monopole antenna disposed between the two ILAs. A triple-band planar antenna includes two ILAs facing each other across a gap with one of the ILAs being input fed and the other IPA being coupled. This triple-band antenna also includes a monopole antenna disposed between the two ILAs, and a conductor extending horizontally from the monopole antenna towards, but not reaching the coupled ILA. Another dual-band antenna includes an inner cut loop antenna encompassed by an outer cut loop antenna.

Abstract: Antennas of broadband and multi-band operation are presented. A broadband planar antenna includes two inverted-L antennas (ILAs) facing each other across a gap. One of the ILAs is input fed, and the other is electromagnetically coupled. The positioning of the gap affects the bandwidth. A dual-band planar antenna includes two ILAs facing each other across a gap with one of the ILAs being input fed, and the other being coupled. This dual-band planar antenna also includes a monopole antenna disposed between the two ILAs. A triple-band planar antenna includes two ILAs facing each other across a gap with one of the ILAs being input fed and the other IPA being coupled. This triple-band antenna also includes a monopole antenna disposed between the two ILAs, and a conductor extending horizontally from the monopole antenna towards, but not reaching the coupled ILA. Another dual-band antenna includes an inner cut loop antenna encompassed by an outer cut loop antenna.

Abstract: A method, system, and apparatus for embedding circuits. The present invention allows reduction in the size of fabricated multichip modules by embedding circuitry within a substrate. A first layer of dielectric material is provided and a circuit having a predetermined length, width, and depth is provided. Then, a cavity is formed in the first layer of dielectric material substantially corresponding to the predetermined length and width of the circuit. After the cavity is formed, the circuit is deposited into the cavity. Once the circuit is deposited, a second layer of dielectric material may be provided to cover the circuit.

Abstract: A higher frequency modulator built with low cost materials and with a lower power requirement is described as well as methods relating thereto. A received radio frequency (RF) signal is combined with a created local oscillator (LO) signal to result in a combined radio frequency (RF) signal, which may be converted into a message signal. A subharmonic mixer may be used to convert the combined RF signal into the message signal. The subharmonic mixer may include antiparallel diode pair (APDP) topology. The created LO signal is a combination of a selected LO signal with another LO signal. The selected LO signal may be a subharmonic of the RF signal. The other LO signal may be a low odd-order harmonic of the selected LO signal. Preferably, the created LO signal is not greater than the RF signal.

Abstract: A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line may be a radial transmission line. Similarly, the ground bumps may be arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this method may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.

Abstract: A patch antenna is described that includes a ground plane, a first shorting structure in contact with the ground plane, a first conductor plate in contact with the first shorting structure. The patch antenna can also include a second shorting structure in contact with the ground plane, and a second conductor plate in contact with the second shorting structure and forming a radiation slot with the first conductor plate. Other devices and methods are herein provided for.

Abstract: A flip chip assembly is disclosed that includes a coplanar waveguide launch with a transmission line, and a bump interconnection that includes multiple ground bumps. The transmission line maybe a radial transmission line. Similarly, the ground bumps maybe arranged in a pseudo-coaxial configuration so as to effect a vertical transition in the flip chip assembly. A method is also disclosed that includes the steps of: providing a coplanar waveguide transmission line launch; providing a chip for attachment to the coplanar waveguide launch; arranging one or more ground bumps on the coplanar waveguide launch; and forming a bump interconnection between the coplanar waveguide launch and the chip. The coplanar waveguide launch provided in this step may include a radial transmission line. The step of arranging the multiple ground bumps may include the step of arranging multiple ground bumps in a pseudo-coaxial configuration.

Abstract: A system and method for providing a multi-layer, high density wireless communication architecture is disclosed. An example of a transceiver module is provided to better demonstrate this system and method. The transceiver module comprises a transmitting layer having a top portion and a bottom portion. A filter layer having a top portion and a bottom portion is also provided, wherein the top portion of the filter layer is adjacent to the bottom portion of the transmitting layer. A logic layer having a top portion and a bottom portion is provided, wherein the top portion is adjacent to the bottom portion of the filter layer and wherein logic is located on the bottom portion of the logic layer. A series of via structures of connected at specific locations of the transceiver module to allow for electrical connections between the transmitting layer and the filter layer, and the filter layer and the logic layer. Shield layers are also provided to prevent harmful electronic coupling between layers.

Abstract: Data throughput rates are increased in an optical fiber communication system without requiring replacement of the existing optical fiber in a link. Channel throughput is increased by upgrading the components and circuitry in the head and terminal of an optical fiber communication system link. Aggregate throughput in a fiber optic link is increased beyond the range of conventional Wavelength Division Multiplexed (WDM) upgrades, while precluding the necessity of replacing existing fiber plants. The increase in system throughput is achieved by using advanced modulation techniques to encode greater amounts of data into the transmitted spectrum of a channel, thereby increasing the spectral efficiency of each channel. This novel method of increasing transmission capacity by upgrading the head and terminal of the system to achieve greater spectral efficiency and hence throughput, alleviates the need to replace existing fiber plants.