Patents by Inventor Ju Il Kang

Ju Il Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915853
    Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
  • Patent number: 11912915
    Abstract: The present invention relates to a phosphine precursor for the preparation of a quantum dot, and a quantum dot prepared therefrom. Using the phosphine precursor for the preparation of a quantum dot of the present invention, a quantum dot with improved luminous efficiency and higher luminous color purity can be provided.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 27, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Hee Il Chae, Jeong Ho Park, Kyung Sil Yoon, Ju-Sik Kang, Yu Mi Chang, Nam-Choul Yang, Jae Kyun Park, Song Lee
  • Patent number: 7838790
    Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: November 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-goo Kang, Jun-ho Lee, Ki-sang Kang, Hyun-seop Shim, Do-young Kam, Jae-il Lee, Ju-il Kang
  • Patent number: 7554349
    Abstract: A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: June 30, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong-goo Kang, Jun-ho Lee, Ki-sang Kang, Hyun-seop Shim, Do-young Kam, Jae-il Lee, Ju-il Kang
  • Publication number: 20080139024
    Abstract: A burn-in board connection device includes a first connection unit to hold a burn-in board and move in a first direction perpendicular to the burn-in board that is inserted in a chamber of a burn-in test device, a second connection unit to move in a second direction parallel to the burn-in board to attach/detach the burn-in board that is held by the first connection unit to/from a connector disposed in the chamber. A burn-in board connection method includes coupling a finger to the burn-in board by moving the finger in a first direction, attaching the burn-in board to a connector by moving the finger in a second direction, and driving the finger by converting a rotation of a servo motor into a linear movement of the finger.
    Type: Application
    Filed: November 8, 2007
    Publication date: June 12, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Nam LEE, Jung-Hyeon KIM, Ju-Il KANG, Jin-Woo YANG
  • Publication number: 20080110809
    Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.
    Type: Application
    Filed: November 9, 2007
    Publication date: May 15, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seong-goo Kang, Jun-ho Lee, Ki-sang Kang, Hyun-seop Shim, Do-young Kam, Jae-il Lee, Ju-il Kang
  • Publication number: 20070236235
    Abstract: A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 11, 2007
    Inventors: Seong-goo Kang, Jun-ho Lee, Ki-sang Kang, Hyun-seop Shim, Do-young Kam, Jae-il Lee, Ju-il Kang
  • Patent number: 6974069
    Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: December 13, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-il Kang, Hee-Sang Yang
  • Publication number: 20030213832
    Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
    Type: Application
    Filed: June 20, 2003
    Publication date: November 20, 2003
    Inventors: Ju-Il Kang, Hee-Sang Yang
  • Patent number: 6607117
    Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: August 19, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju-Il Kang, Hee-Sang Yang
  • Patent number: 6323669
    Abstract: An apparatus and a method for automatic testing and correction of the contact between an IC device and a socket are disclosed. The apparatus includes: a table; a burn-in board having a burn-in board connector; respective tools for loading the device from an IC tray to a positioning jig on the X-Y table, for inserting the device into a socket of the burn-in board, for removing the device from a socket of the burn-in board and for moving the device to a DC test position; a contact part for contacting the burn-in board connector; and a contact tester for testing the contact between device pins and socket terminals.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: November 27, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ju-Il Kang
  • Patent number: 6239396
    Abstract: An apparatus in accordance with the present invention includes separate transporting units respectively for good and rejected semiconductor devices. As a result, respective handlings of the rejected and good devices, such as loading of the good devices into a burn-in board or an unloading tray and loading of the rejected devices into a rejecting tray, can be performed separately without interfering each other.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: May 29, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ju-il Kang
  • Patent number: 6209194
    Abstract: An automatic loading and unloading apparatus using servo motors allows simultaneous loading and unloading of two or more semiconductor device packages into and from test devices. The loading and unloading apparatus has a feeding mechanism which has a feed container carrying two semiconductor device packages which have not yet been tested; a loading tool for transferring those two semiconductor device packages from the feed container to a centering position; a DC test contact tool; an insertion tool; a removal tool; and a sorting station for sorting the semiconductor device packages depending on results of a burn-in test. The tools of the apparatus are driven by the action of servo motors, thereby allowing independent movements thereof in the vertical and horizontal directions.
    Type: Grant
    Filed: October 3, 1997
    Date of Patent: April 3, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ju Il Kang, Byung Ro Kim, Sung Yeol Lee, Hyun Ho Kim, Young Ki Park
  • Patent number: 6142723
    Abstract: A carrier transfer apparatus for automatically unloading and/or loading semiconductor device packages from and/or to printed circuit boards loaded into a carrier. The apparatus includes a housing, an input portion, an elevator portion and an output portion.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: November 7, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ju Il Kang