Abstract: The use of volatilization reagents is disclosed for improved detection of inorganic oxidizers such as, but not limited to, chlorates and perchlorates. Detection methods are disclosed whereby a reagent can transfer a proton to the anion (i.e., chlorate, perchlorate, etc.) of an inorganic salt analyte, forming an acid (i.e., chloric acid, perchloric acid) that is easier to detect by a mechanism whereby the acidified reagent is more easily vaporized, and hence, more easily detected. Concurrently, the anion of the acid forms a new salt with the cation released from the salt that was acidified. The reagents can also include acidic salts or cation-donators, more generally. In some embodiments, hydrated reagents or co-reagents that can release water can be employed.

Abstract: Methods, systems, and compositions related to the recycling and/or recovery of activating materials from activated aluminum are disclosed. In one embodiment, an aqueous solution's composition may be controlled to maintain aluminum ions dissolved in solution during reaction of an activated aluminum. In another embodiment, aluminum hydroxide containing the activating materials may be dissolved into an aqueous solution to isolate the activating materials.

Abstract: The use of volatilization reagents is disclosed for improved detection of inorganic oxidizers such as, but not limited to, chlorates and perchlorates. Detection methods are disclosed whereby a reagent can transfer a proton to the anion (i.e., chlorate, perchlorate, etc.) of an inorganic salt analyte, forming an acid (i.e., chloric acid, perchloric acid) that is easier to detect by a mechanism whereby the acidified reagent is more easily vaporized, and hence, more easily detected. Concurrently, the anion of the acid forms a new salt with the cation released from the salt that was acidified. The reagents can also include acidic salts or cation-donators, more generally. In some embodiments, hydrated reagents or co-reagents that can release water can be employed.

Abstract: Volatilization reagents are disclosed for improved detection of inorganic oxidizers such as chlorates and perchlorates by mass spectrometry. Thermal desorption methods are also disclosed in which the reagent transfers a proton to the anion (i.e., chlorate, perchlorate, etc.) of an inorganic salt analyte, forming an acid (i.e., chloric acid, perchloric acid) that is more easily vaporized and, hence, more easily detected. The reagents can include acidic salts or cation-donators, more generally. The class of reagents including polymeric acids, polymeric organic acids and polymeric sulfonic acids. Hydrated reagents or other reagents that can release water can also be employed as co-reagents. Further, these reagents can be embedded in a swipe or other substrate, delivered as a liquid infused via nebulizer, or otherwise introduced to a sample to be tested.

Abstract: The use of volatilization reagents is disclosed for improved detection of inorganic oxidizers such as, but not limited to, chlorates and perchlorates. Detection methods are disclosed whereby a reagent can transfer a proton to the anion (i.e., chlorate, perchlorate, etc.) of an inorganic salt analyte, forming an acid (i.e., chloric acid, perchloric acid) that is easier to detect by a mechanism whereby the acidified reagent is more easily vaporized, and hence, more easily detected. Concurrently, the anion of the acid forms a new salt with the cation released from the salt that was acidified. The reagents can also include acidic salts or cation-donators, more generally. In some embodiments, hydrated reagents or co-reagents that can release water can be employed. In another aspect of the invention, a class of reagents including polmeric acids, polymeric organic acids and polymeric sulfonic acids are disclosed that can carry out this method.

Abstract: A method for reducing heat applied to a workpiece by a plasma discharge of a reactive plasma torch comprises determining a footprint of the plasma discharge on a surface of the workpiece based on a distance of the reactive atom plasma torch from the surface, determining a maximum heat absorbable by the workpiece, and determining an adjusted footprint of the reactive atom plasma torch on the surface based on the maximum heat absorbable by the workpiece. An aperture of an aperture device is selected based on the adjusted footprint of the reactive atom plasma torch. The aperture device is then positioned so that a portion of the plasma is one or both of deflected and absorbed by the aperture device, thereby reducing the heat absorbed by the workpiece.

Abstract: A tool for modifying a surface of a workpiece comprises a heat source having a modifiable footprint for heating a selectable portion of the surface, a reactive atom plasma torch, and a reactive precursor receivable within a plasma of the reactive atom plasma torch. The reactive cursor is received by the plasma to form a reactive species that chemically combines with a portion of the surface heated by the footprint of the heat source to produce a gas and leave the surface.

Abstract: The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

Abstract: A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

Abstract: The footprint of a reactive atom plasma processing tool can be modified using an aperture device. A flow of reactive gas can be injected into the center of an annular plasma. An aperture can be positioned relative to the plasma such that the effective footprint of the plasma can be changed without adjusting the gas flows or swapping out the tool. Once the aperture and tool are in position relative to a workpiece, reactive atom plasma processing can be used to modify the surface of the workpiece, such as to etch, smooth, polish, clean, and/or deposit material onto the workpiece. If necessary, a coolant can be circulated about the aperture. Multiple apertures can also be used to provide a variety of footprint sizes and/or shapes. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

Abstract: A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

Abstract: High-quality glass parts, such as high-end optics, can be generated using a completely damage free process. An intial damage-free forming step, such as sluping, can be used to roughly shape a glass workpiece without imparting any subsurface damage. A reactive atom processing (RAP) process can then be used to rapidly remove any anomalies or imperfections from the surface of the optic without imparting any damage unto the optic. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.