Patents by Inventor Juergen Stuerner

Juergen Stuerner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10629465
    Abstract: The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.
    Type: Grant
    Filed: May 4, 2019
    Date of Patent: April 21, 2020
    Assignee: BESI Switzerland AG
    Inventors: Harald Handlos, Florian Speer, Juergen Stuerner
  • Publication number: 20190362998
    Abstract: The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.
    Type: Application
    Filed: May 4, 2019
    Publication date: November 28, 2019
    Applicant: BESI Switzerland AG
    Inventors: Harald HANDLOS, Florian SPEER, Juergen STUERNER
  • Patent number: 9082816
    Abstract: A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: July 14, 2015
    Assignee: ESEC AG
    Inventors: Marco Graf, Dominik Hartmann, Juergen Stuerner
  • Publication number: 20130008599
    Abstract: A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.
    Type: Application
    Filed: July 2, 2012
    Publication date: January 10, 2013
    Applicant: ESEC AG
    Inventors: Marco Graf, Dominik Hartmann, Juergen Stuerner