Patents by Inventor Juergen Wagner
Juergen Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230253668Abstract: Disclosed is a hermetically closed battery degas venting unit for venting a battery enclosure/pack/housing having rechargeable vehicle batteries. The unit having a housing base equipped with a non-porous rupturable venting film closing over and sealing off the pressure venting opening. The non-porous venting film configured to deflect towards a spike in response to overpressure and to tear or rupture to release overpressure in the battery enclosure/pack/housing.Type: ApplicationFiled: February 4, 2022Publication date: August 10, 2023Inventors: Vance HARWOOD, Thomas SCHLEIDEN, Juergen KOSICKI, Joseph DYER, Matthias WAGNER
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Patent number: 11626242Abstract: A winding assembly for a transformer, in particular with a medium operating voltage of Um?79.5 kV, wherein the winding assembly includes at least one winding, which ends in a winding conductor, where the winding conductor is connected to a switching line, which is configured to interconnect the winding to other windings, and where the connection of the switching line to the winding conductor is arranged inside the winding so as to reduce the danger of partial discharges and flashovers in the high-voltage end-line region for high-temperature applications.Type: GrantFiled: December 6, 2018Date of Patent: April 11, 2023Assignee: SIEMENS ENERGY GLOBAL GMBH & CO. KGInventors: Jürgen Gangel, Hans Jürgen Wagner
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Publication number: 20230002219Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.Type: ApplicationFiled: September 15, 2022Publication date: January 5, 2023Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Hermann, Ulrich Krumbien, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
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Patent number: 11524891Abstract: A microfabricated structure includes a perforated stator; a first isolation layer on a first surface of the perforated stator; a second isolation layer on a second surface of the perforated stator; a first membrane on the first isolation layer; a second membrane on the second isolation layer; and a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first tapered edge portion having a common surface with the first membrane, wherein the second isolation layer includes a first tapered edge portion having a common surface with the second membrane, and wherein an endpoint of the first tapered edge portion of the first isolation layer is laterally offset with respect to an endpoint of the first tapered edge portion of the second isolation layer.Type: GrantFiled: January 18, 2021Date of Patent: December 13, 2022Assignee: Infineon Technologies AGInventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
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Patent number: 11168799Abstract: A valve body (4) for a valve assembly (2) is proposed. The valve body (4) comprises a valve seat (96) which can be accessed by means of an opening (86). A plurality of threaded holes is provided around the opening (86). A plurality of first studs (22a-c) is arranged, in portions, in the threaded holes in order to arrange a valve drive. At least one second stud (24) comprises an electronic data carrier (26) for contactless identification of the valve seat (96). A portion of the second stud (24) is arranged in one of the threaded holes.Type: GrantFiled: June 7, 2018Date of Patent: November 9, 2021Assignee: GEMUE Gebr. Mueller Apparatebau GmbH & Co. KommanditgesellschaftInventors: Peter Stier, Juergen Wagner
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Patent number: 11161735Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.Type: GrantFiled: April 16, 2020Date of Patent: November 2, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Johann Strasser, Alfons Dehe, Gerhard Metzger-Brueckl, Juergen Wagner, Arnaud Walther
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Patent number: 11017283Abstract: There is provided an electronic tag for a metal component of a system, wherein the electronic tag includes: a metal support frame, a first portion arranged within the metal support frame and secured relative to the metal support frame, a passive transponder, and a second portion, wherein the second portion secures the passive transponder at least relative to the first portion.Type: GrantFiled: June 3, 2019Date of Patent: May 25, 2021Assignee: GEMUE Gebr. Mueller Apparatebau GmbH & Co. KommanditgesellschaftInventors: Sebastian Nadig, Juergen Wagner
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Publication number: 20210139319Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.Type: ApplicationFiled: January 18, 2021Publication date: May 13, 2021Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
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Patent number: 10981780Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.Type: GrantFiled: August 19, 2019Date of Patent: April 20, 2021Assignee: INFINEON TECHNOLOGIES AGInventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
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Publication number: 20210053821Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.Type: ApplicationFiled: August 19, 2019Publication date: February 25, 2021Inventors: Wolfgang Klein, Evangelos Angelopoulos, Stefan Barzen, Marc Fueldner, Stefan Geissler, Matthias Friedrich Herrmann, Ulrich Krumbein, Konstantin Tkachuk, Giordano Tosolini, Juergen Wagner
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Publication number: 20200350112Abstract: A winding assembly for a transformer, in particular with a medium operating voltage of Um?79.5 kV, wherein the winding assembly includes at least one winding, which ends in a winding conductor, where the winding conductor is connected to a switching line, which is configured to interconnect the winding to other windings, and where the connection of the switching line to the winding conductor is arranged inside the winding so as to reduce the danger of partial discharges and flashovers in the high-voltage end-line region for high-temperature applications.Type: ApplicationFiled: December 6, 2018Publication date: November 5, 2020Inventors: Jürgen Gangel, Hans Jürgen WAGNER
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Publication number: 20200239302Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.Type: ApplicationFiled: April 16, 2020Publication date: July 30, 2020Inventors: Johann Strasser, Alfons Dehe, Gerhard Metzger-Brueckl, Juergen Wagner, Arnaud Walther
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Patent number: 10669151Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.Type: GrantFiled: August 30, 2018Date of Patent: June 2, 2020Assignee: INFINEON TECHNOLOGIES AGInventors: Johann Strasser, Alfons Dehe, Gerhard Metzger-Brueckl, Juergen Wagner, Arnaud Walther
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Patent number: 10589990Abstract: In accordance with an embodiment, a MEMS microphone includes a sound detection unit having a first membrane, a second membrane arranged at a distance from the first membrane, a low-pressure region arranged between the first membrane and the second membrane, a gas pressure that is reduced in relation to normal pressure being present in said low-pressure region, a counter electrode arranged in the low-pressure region, and a sound through-hole, which extends through the sound detection unit in a thickness direction of the sound detection unit; and a valve provided at the sound through-hole, said valve being configured to adopt a plurality of valve states, wherein a predetermined degree of transmission of the sound through-hole to sound is assigned to each valve state.Type: GrantFiled: September 18, 2018Date of Patent: March 17, 2020Assignee: INFINEON TECHNOLOGIES AGInventors: Alfons Dehe, Ulrich Krumbein, Gerhard Metzger-Brueckl, Johann Strasser, Juergen Wagner, Arnaud Walther
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Publication number: 20190377993Abstract: There is provided an electronic tag for a metal component of a system, wherein the electronic tag includes: a metal support frame, a first portion arranged within the metal support frame and secured relative to the metal support frame, a passive transponder, and a second portion, wherein the second portion secures the passive transponder at least relative to the first portion.Type: ApplicationFiled: June 3, 2019Publication date: December 12, 2019Applicant: GEMUE Gebr. Mueller Apparatebau GmbH & Co. KommanditgesellschaftInventors: Sebastian Nadig, Juergen Wagner
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Publication number: 20190084827Abstract: In accordance with an embodiment, a MEMS microphone includes a sound detection unit having a first membrane, a second membrane arranged at a distance from the first membrane, a low-pressure region arranged between the first membrane and the second membrane, a gas pressure that is reduced in relation to normal pressure being present in said low-pressure region, a counter electrode arranged in the low-pressure region, and a sound through-hole, which extends through the sound detection unit in a thickness direction of the sound detection unit; and a valve provided at the sound through-hole, said valve being configured to adopt a plurality of valve states, wherein a predetermined degree of transmission of the sound through-hole to sound is assigned to each valve stateType: ApplicationFiled: September 18, 2018Publication date: March 21, 2019Inventors: Alfons Dehe, Ulrich Krumbein, Gerhard Metzger-Brueckl, Johann Strasser, Juergen Wagner, Arnaud Walther
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Publication number: 20190071305Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.Type: ApplicationFiled: August 30, 2018Publication date: March 7, 2019Inventors: Johann Strasser, Alfons Dehe, Gerhard Metzger-Brueckl, Juergen Wagner, Arnaud Walther
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Publication number: 20180356843Abstract: A valve body (4) for a valve assembly (2) is proposed. The valve body (4) comprises a valve seat (96) which can be accessed by means of an opening (86). A plurality of threaded holes is provided around the opening (86). A plurality of first studs (22a-c) is arranged, in portions, in the threaded holes in order to arrange a valve drive. At least one second stud (24) comprises an electronic data carrier (26) for contactless identification of the valve seat (96). A portion of the second stud (24) is arranged in one of the threaded holes.Type: ApplicationFiled: June 7, 2018Publication date: December 13, 2018Applicant: GEMUE Gebr. Mueller Apparatebau GmbH & Co. KommanditgesellschaftInventors: Peter Stier, Juergen Wagner
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Patent number: 9981843Abstract: A method of producing a chip package is described. A plurality of chips is provided on a first wafer. Each chip has a cavity which opens to a first main face of the chip. The cavities are filled or covered temporarily. The chips are then singulated. The singulated chips are embedded in an encapsulation material, and then the cavities are re-exposed.Type: GrantFiled: April 26, 2016Date of Patent: May 29, 2018Assignee: Infineon Technologies AGInventors: Dominic Maier, Alfons Dehe, Thomas Kilger, Markus Menath, Franz Xaver Muehlbauer, Daniel Porwol, Juergen Wagner
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Patent number: D920388Type: GrantFiled: October 30, 2019Date of Patent: May 25, 2021Assignee: SPOHN & BURKHARDT GMBH & CO. KGInventors: Jürgen Wagner, Gerhard Oesterle, Philipp Kessler, Thomas Starczewski