Abstract: An electronic device includes at least two image capturing units which face the same side. The at least two image capturing units include a first image capturing unit and a second image capturing unit. The first image capturing unit includes an optical image system and a first image sensor. The optical image system includes a first lens element and an image surface. The first image sensor is disposed on the image surface of the optical image system thereof and has a first resolution of at least 60 megapixels. The second image capturing unit includes an optical image system and a second image sensor. The optical image system includes a first lens element and an image surface. The second image sensor is disposed on the image surface of the optical image system thereof and has a second resolution of at least 40 megapixels.

Abstract: A composite structure includes a passivated substrate, a sealing layer, a conductive layer, and a coating layer. The passivated substrate includes a substrate body made of a metallic material that is magnesium or magnesium alloy, and a porous passivation layer which is disposed on the substrate body, and which is made of an oxide of the metallic material. The sealing layer is disposed on the porous passivation layer, and is made of a sealing material. The conductive layer is disposed on the sealing layer, and is made of an electrically conductive material. The coating layer covers the conductive layer, and includes an electrophoretic material and/or a metal. A method of making the composite structure is also disclosed.

Abstract: A fastening device includes at least one base portion and at least one fastener portion. The base portion is connected to a first object and the fastener portion is slidably assembled to the base portion. The fastener portion cooperates with the base portion to provide a locking and an unlocking function for connecting or disconnecting a second object to or from the base portion. With these arrangements, two objects can be repeatedly and quickly connected to or disconnected from each other.

Abstract: A fastener structure and an assembling method thereof are introduced. The fastener structure includes a head portion and a body portion. The body portion is movably connected to the head portion and includes a connecting section for assembling to an intermediate member. The intermediate member includes a material retaining section and can be further connected to an object. Partial material of the object would move or flow into the material retaining section when the intermediate member is forcefully pressed against the object, so that the intermediate member and the object are connected together. Since the body portion can be assembled to the intermediate member and the intermediate member can be further connected to an object, and the fastener structure can be fastened to and released from a target object, at least two objects can be repeatedly and quickly connected to and disconnect from one another using the fastener structure.

Abstract: A single photon avalanche diode (SPAT) image sensor is disclosed. The SPAT) image sensor include: a substrate of a first conductivity type, the substrate having a front surface and a back surface; a deep trench isolation (DTI) extending from the front surface toward the back surface of the substrate, the DTI having a first surface and a second surface opposite to the first surface, the first surface being level with the front surface of the substrate; an epitaxial layer of a second conductivity type opposite to the first conductivity type, the epitaxial layer surrounding sidewalls and the second surface of the DTI; and an implant region of the first conductivity type extending from the front surface to the back surface of the substrate. An associated method for fabricating the SPAD image sensor is also disclosed.

Abstract: A pull aid structure includes a handle; a connecting element movably disposed at the handle; and a positioning element disposed at the handle and movably coupled to the connecting element. The pull aid structure enables a user to place the connecting element on an object, rotate the handle to fasten another object, confine the positioning element to the connecting element, and compress an elastic element, so as to couple together the two objects. To remove one of the objects, the user separates the positioning element and the connecting element to thereby separate the two objects, thereby achieving quick coupling and ease of removal.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an image sensor disposed within a substrate. The substrate has sidewalls and a horizontally extending surface defining one or more trenches extending from a first surface of the substrate to within the substrate. One or more isolation structures are arranged within the one or more trenches. A doped region is arranged within the substrate laterally between sidewalls of the one or more isolation structures and the image sensor and vertically between the image sensor and the first surface of the substrate. The doped region has a higher concentration of a first dopant type than an abutting part of the substrate that extends along opposing sides of the image sensor.

Abstract: An image capturing lens assembly includes seven lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface towards the object side and an image-side surface towards the image side. The second lens element with positive refractive power has the object-side surface being convex in a paraxial region thereof. The fourth lens element with positive refractive power has the image-side surface being convex in a paraxial region thereof. The sixth lens element has positive refractive power. The seventh lens element has the image-side surface being concave in a paraxial region thereof.

Abstract: An image capturing lens system includes four lens groups which include eight lens elements. The four lens groups are, in order from an object side to an image side: first, second, third and fourth lens groups. The eight lens elements are, in order from the object side to the image side: first, second, third, fourth, fifth, sixth, seventh and eighth lens elements. The first and second lens elements respectively have positive and negative refractive power. At least one lens element in the second through fourth lens groups has an inflection point. A focal length of the image capturing lens system is varied by changing axial distances between the four lens groups in a zooming process. The second lens group is moved relative to the first lens group along an optical axis in the zooming process. The image capturing lens system has a long-focal-length end and a short-focal-length end.

Abstract: A floating fixing component and a mounting method thereof are introduced. The floating fixing component includes at least a stop section and an application section. The stop section is used to abut against an object to prevent the floating fixing component from separating from the object. The floating fixing component and the object have a floating space existed between them, such that the floating fixing component can float and shift on and relative to the object. With these arrangements, the floating fixing component can be mounted to an object while the application section can be fastened to or disconnected from another object. In this manner, at least two objects can be repeatedly and quickly connected to and disconnected from one another.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an image sensing element disposed within a semiconductor substrate. One or more isolation structures are arranged within one or more trenches disposed along a first surface of the semiconductor substrate. The one or more isolation structures are separated from opposing sides of the image sensing element by non-zero distances. The one or more trenches are defined by sidewalls and a horizontally extending surface of the semiconductor substrate. A doped region is laterally arranged between the sidewalls of the semiconductor substrate defining the one or more trenches and is vertically arranged between the image sensing element and the first surface of the semiconductor substrate.

Abstract: An operating lever assembly includes a fastening member having a retaining section releasably fastened to a first object, a receiving space and a locating section; and a lever member having a mating locating section and being movably connected at an end to the receiving space and at another end to a second object. Alternatively, the fastening member includes a retaining section and a locating section; and the lever member includes a mating locating section and a receiving space, to which the fastening member is movably connected. The fastening member can be pushed to release the retaining section from the first object, while the lever member is moved in the receiving space and the locating section is engaged with the mating locating section to hold the fastening member to the lever member, allowing the first object to be repeatedly and quickly separated from or fastened to the second object.

Abstract: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.

Abstract: Provided is a semiconductor package structure including a redistribution layer (RDL) structure, a chip, an electronic device and a stress compensation layer. The RDL structure has a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the RDL structure. The electronic device is disposed in the RDL structure, electrically connected to the chip, and includes a dielectric layer disposed therein. The stress compensation layer is disposed in or outside the RDL structure. The dielectric layer provides a first stress between 50 Mpa and 200 Mpa in a first direction perpendicular to the second surface, the stress compensation layer provides a second stress between 50 Mpa and 200 Mpa in a second direction opposite to the first direction, and the difference between the first stress and the second stress does not exceed 60 Mpa.

Abstract: A rolling module structure and a method for use therewith are introduced. The rolling module structure includes a carrier and at least one rolling member. The rolling member is fitted to the carrier to form a rolling module structure. The rolling module structure is fitted to a moving target, allowing the moving target to move smoothly because of the rolling member.

Abstract: An imaging lens assembly includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The second lens element has positive refractive power. The sixth lens element has positive refractive power, and the image-side surface of the sixth lens element is convex in a paraxial region thereof. The seventh lens element has negative refractive power. At least one of the object-side surface and the image-side surface of at least one lens element of the imaging lens assembly is aspheric and has at least one inflection point.

Abstract: A handle structure includes a handgrip body and at least one rotating body. The rotating body is pivotally connected to the handgrip body, the rotating body is used to pivotally connect a first object, and when rotating, the rotating body drives the handgrip body to move toward the first object for reducing the height of the handle structure. Therefore, the handle structure can make a handgrip body moved out toward a direction distant from the first object when used, and can make the handgrip body moved in toward a direction of the first object when not in use for reducing the height of the handgrip body so as to operate and use easily and prevent collision.

Abstract: A photovoltaic cell includes a germanium-containing well embedded in a single crystalline silicon substrate and extending to a proximal horizontal surface of the single crystalline silicon substrate, wherein germanium-containing well includes germanium at an atomic percentage greater than 50%. A silicon-containing capping structure is located on a top surface of the germanium-containing well and includes silicon at an atomic percentage greater than 42%. The silicon-containing capping structure prevents oxidation of the germanium-containing well. A photovoltaic junction may be formed within, or across, the trench by implanting dopants of a first conductivity type and dopants of a second conductivity type.

Abstract: An image capturing lens assembly includes seven lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element, each of the seven lens elements has an object-side surface towards the object side and an image-side surface towards the image side. The first lens element has negative refractive power. The third lens element has positive refractive power. The seventh lens element has negative refractive power.

Abstract: A fastener structure includes a casing, an engaging element and a controlling element. The engaging element is movably disposed at the casing. The controlling element is movably disposed at the casing. The controlling element controls the engaging element to enter a locked state or unlocked state. Therefore, the casing is fitted to the first object, such that engaging element is fastened to or unfastened from the second object, so as to couple together quickly and separate easily at least two objects.