Abstract: “Corrosion” performance of an optical filter is enhanced when a relatively thick zinc-based film functions as a seed layer for a subsequently formed silver-based film. At least two pairs of dielectric and metallic layers are included within the optical filter, where the zinc-based film is a second film of the dielectric layer and where the silver-based film is the metallic layer. The zinc-based film has a zinc content of at least 80 percent and has a thickness of at least 15 nm. In order to further improve the corrosion performance, gold may be incorporated into the silver-based film.

Abstract: “Corrosion” performance of an optical filter is enhanced when a relatively thick zinc-based film functions as a seed layer for a subsequently formed silver-based film. At least two pairs of dielectric and metallic layers are included within the optical filter, where the zinc-based film is a second film of the dielectric layer and where the silver-based film is the metallic layer. The zinc-based film has a zinc content of at least 80 percent and has a thickness of at least 15 nm. In order to further improve the corrosion performance, gold may be incorporated into the silver-based film.

Abstract: In a method of forming micro traces, stamping techniques are employed to define a target pattern of the micro traces. The stamping is applied to electrically conductive material and may be limited to pressure, but a thermal stamping approach may be utilized. Following the stamping, a portion of the conductive material is removed, leaving the target pattern of conductive micro traces. In the pressure-application step, the pressure or the combination of pressure and temperature is sufficient to at least weaken the integrity of the bulk conductive material along the area of contact. Typically, this step causes shearing of the conductive material. Following the pressure-application step, excess conductive material is removed. In some embodiments of the invention, the thickness of the micro traces is not determined in a single step. The original thickness may be formed using a “seed” material. The subsequent material buildup may occur after the target pattern is established.

Abstract: In a method of forming micro traces, stamping techniques are employed to define a target pattern of the micro traces. The stamping is applied to electrically conductive material and may be limited to pressure, but a thermal stamping approach may be utilized. Following the stamping, a portion of the conductive material is removed, leaving the target pattern of conductive micro traces. In the pressure-application step, the pressure or the combination of pressure and temperature is sufficient to at least weaken the integrity of the bulk conductive material along the area of contact. Typically, this step causes shearing of the conductive material. Following the pressure-application step, excess conductive material is removed. In some embodiments of the invention, the thickness of the micro traces is not determined in a single step. The original thickness may be formed using a “seed” material. The subsequent material buildup may occur after the target pattern is established.