Patents by Inventor Jumpei Fujikata

Jumpei Fujikata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11315812
    Abstract: Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: April 26, 2022
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Yuji Araki, Tensei Sato, Ryuya Koizumi
  • Patent number: 11230789
    Abstract: A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: January 25, 2022
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake, Jumpei Fujikata
  • Publication number: 20210285893
    Abstract: An object is to allow for simple measurement of a bump height. There is provided. a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.
    Type: Application
    Filed: June 27, 2019
    Publication date: September 16, 2021
    Inventors: Takahisa Okuzono, Masaki Tomita, Jumpei Fujikata, Hideki Takayanagi
  • Publication number: 20210262111
    Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.
    Type: Application
    Filed: February 17, 2021
    Publication date: August 26, 2021
    Inventors: Yasuyuki Masuda, Shao Hua Chang, Yoshitaka Mukaiyama, Masashi Shimoyama, Jumpei Fujikata
  • Patent number: 11047063
    Abstract: A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 29, 2021
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Yoichi Nakagawa, Yoshitaka Mukaiyama, Yoshio Minami
  • Publication number: 20210154629
    Abstract: A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 27, 2021
    Inventors: Yasuyuki Masuda, Masashi Shimoyama, Jumpei Fujikata, Yohei Wakuda, Shao Hua Chang
  • Patent number: 10954603
    Abstract: A substrate holder includes: a first holding member having a surface configured to come into contact with the substrate; and a second holding member, between which and the first holding member the substrate is put and held. The second holding member includes a removal portion that is disposed along an outer circumference of the substrate and configured to come into contact with the substrate and remove an insulating material on the substrate when the substrate is put between the first holding member and the second holding member, and an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 23, 2021
    Assignee: EBARA CORPORATION
    Inventor: Jumpei Fujikata
  • Patent number: 10946351
    Abstract: A paddle for agitating a plating solution by reciprocating parallel to a surface of a substrate is disclosed. The paddle includes a plurality of vertically-extending agitation rods. Each agitation rod includes: a planar portion perpendicular to a reciprocating direction of the paddle; two slope surfaces extending from side ends of the planar portion in directions closer to each other, the two slope surfaces being symmetric with respect to a center line of the agitation rod, the center line being perpendicular to the planar portion; and a tip portion connected with the two slope surfaces.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: March 16, 2021
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Masuda, Masashi Shimoyama, Jumpei Fujikata, Yohei Wakuda, Shao Hua Chang
  • Publication number: 20210062354
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto
  • Patent number: 10914019
    Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: February 9, 2021
    Assignee: EBARA CORPORATION
    Inventors: Shao Hua Chang, Yasuyuki Masuda, Jumpei Fujikata, Masashi Shimoyama, Tsutomu Nakada
  • Patent number: 10914020
    Abstract: To prevent turbulence on a surface of a plating solution as much as possible and suppress spattering and splashing of the plating solution even when the plating solution is stirred. Provided is a wave absorbing member that is attachable to a paddle moveable in a horizontal direction to stir liquid. The wave absorbing member includes a thin plate shaped body portion configured to move on a liquid surface when moving in the horizontal direction and a front end portion designed to be tapered toward an end from the body portion.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: February 9, 2021
    Assignee: EBARA CORPORATION
    Inventors: Shao Hua Chang, Jumpei Fujikata
  • Patent number: 10910334
    Abstract: A device for inspecting a bump height includes an illumination device, an imaging device, and a control device. The illumination device irradiates a substrate with light. The substrate includes a resist and a bump formed on an opening portion of the resist. The imaging device images a pattern of the resist and the bump. The control device evaluates a height of the bump based on a luminance value of image data of the pattern obtained by the imaging device.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: February 2, 2021
    Assignee: EBARA CORPORATION
    Inventors: Takahisa Okuzono, Masaki Tomita, Jumpei Fujikata
  • Patent number: 10865492
    Abstract: A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: December 15, 2020
    Assignee: EBARA CORPORATION
    Inventors: Jumpei Fujikata, Masashi Shimoyama, Ryu Miyamoto, Kentaro Ishimoto
  • Publication number: 20200270760
    Abstract: The present invention provides a regulation plate and a plating apparatus equipped with the regulation plate which can curb reduction in in-plane uniformity due to influence of a terminal effect with respect to plural substrates differing in characteristics and processing conditions. One form of the present invention provides a regulation plate used to adjust an electric current between an anode and a substrate to be plated. The regulation plate includes a plate main body provided with an opening adapted to allow passage of an electric current; plural first blades used to narrow a diameter of the opening; and a first moving mechanism adapted to translate the plural first blades in a radial direction of the opening.
    Type: Application
    Filed: December 5, 2016
    Publication date: August 27, 2020
    Inventors: Yoichi NAKAGAWA, Jumpei FUJIKATA
  • Publication number: 20200255968
    Abstract: An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.
    Type: Application
    Filed: June 7, 2017
    Publication date: August 13, 2020
    Inventors: Yoshitaka MUKAIYAMA, Toshio YOKOYAMA, Kunio OISHI, Masaaki KIMURA, Jumpei FUJIKATA
  • Publication number: 20200209099
    Abstract: A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.
    Type: Application
    Filed: December 12, 2019
    Publication date: July 2, 2020
    Inventors: Kiyoshi Suzuki, Jumpei Fujikata
  • Publication number: 20200199769
    Abstract: A method capable of removing a liquid from a seal of a substrate holder so as to prevent contact between the liquid and an electrical contact of the substrate holder is provided. The method includes: immersing the substrate in a plating solution, with a seal and an electrical contact of the substrate holder in contact with the substrate; applying a voltage between the substrate and an anode in the presence of the plating solution to plate the substrate; pulling up the plated substrate from the plating solution; separating the seal from the plated substrate; and forming a flow of gas passing through a gap between the plated substrate and the seal, the flow of gas being directed from an inside to an outside of the substrate holder.
    Type: Application
    Filed: November 15, 2019
    Publication date: June 25, 2020
    Inventors: Masaya Seki, Hideki Takayanagi, Kiyoshi Suzuki, Masayuki Satake, Jumpei Fujikata
  • Patent number: 10676838
    Abstract: A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: June 9, 2020
    Assignee: EBARA CORPORATION
    Inventors: Mizuki Nagai, Kazuhito Tsuji, Takashi Kishi, Toshiki Miyakawa, Masashi Shimoyama, Jumpei Fujikata
  • Publication number: 20200165737
    Abstract: Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 28, 2020
    Applicant: EBARA CORPORATION
    Inventors: MASASHI SHIMOYAMA, JUMPEI FUJIKATA, FUMITOSHI NISHIURA, TAKASHI KISHI
  • Patent number: D892747
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: August 11, 2020
    Assignee: EBARA CORPORATION
    Inventors: Kiyoshi Suzuki, Jumpei Fujikata