Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may includes a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.

Abstract: Disclosed are an impeller of a suction-enforced type, and a fan-motor for a vacuum cleaner having the same. The fan-motor having the impeller of the suction-enforced type includes: a motor housing; a motor installed in the motor housing; an impeller casing coupled to the upper portion of the motor housing; the impeller of the suction-enforced type installed in the impeller casing and connected to a rotation shaft of the motor; and a guide vane installed at the lower portion of the impeller of the suction-enforced type, for guiding the air sucked into the impeller casing to the motor side. As a result, suction efficiency of the impeller is improved, and thus efficiency of the fan-motor for the vacuum cleaner is improved.

Abstract: Disclosed is a control apparatus and method of a clothes treating machine. Power consumption can be expected or detected when an operation of the clothes treating apparatus is determined, and greenhouse gas emissions to an energy source or electricity prices according can be expected on the basis of power consumption. In addition, reasonable operations can be determined on the basis of recommended operation conditions provided by the clothes treating apparatus, and power consumption of the clothes treating machine, greenhouse gas emissions to an energy source or electricity prices can be easily calculated without providing an additional complicated power detection circuit.

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Abstract: An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented.

Abstract: Disclosed is a refrigerator having a dispenser, including a main body having a cooling chamber and a door for selectively shielding the cooling chamber. The refrigerator also includes a container accommodating unit and a communication chute that passes through a front surface of the door and guides content to a dispensing cavity defined by the container accommodating unit. The refrigerator further includes an obstruction unit disposed in the container accommodating unit, and movable, about a plane perpendicular to the front which content guided by the communication chute is relatively obstructed by the obstruction unit and a second position in which content guided by the communication chute is relatively unobstructed by the obstruction unit.

Abstract: Disclosed is a high speed type impeller, including: a body having a shaft coupling hole into which a rotation shaft of a motor is coupled, the outer circumference of the body being widened from the top to bottom end in the insertion direction of the rotation shaft to form a bent surface, a step portion shadowed in the radial direction being formed on the top end of the body; a plurality of blades installed on the bent surface of the body to be bent at a predetermined angle to the rotation shaft direction; and an upper reinforcing ring installed at the step portion of the body. Even through the impeller is made of a low cost material, the reinforcing ring reinforces the weak portion of the impeller to improve durability. Reliability of the impeller is attained with high economical efficiency.

Abstract: Disclosed is a method for fabricating a composite material comprising nano carbon and metal or ceramic, in more detail, a method for fabricating a composite material in which metallic or ceramic particles are uniformly dispersed on a nano carbon surface, the method including (1) coating a metal layer on nano carbon, (2) fabricating composite nano powders by performing a thermal treatment for the nano carbon coated with the metal layer, and (3) sintering the composite nano powders, whereby the composite nano powders, in which metallic or ceramic nano powders are uniformly mixed on the surface of the nano carbon, can be easily fabricated, and such composite nano powders can be sintered so as to fabricate the composite material, in which the nano carbon and the metallic or ceramic powders are uniformly dispersed.

Abstract: The present invention relates to a switched reluctance motor and a connection method for a sensor shutter thereof. The switched reluctance motor in accordance with the present invention includes a stator; a rotor rotating with respect to the stator centering around a rotational shaft; and a sensor shutter having a sensing part through which a light can be passed and connected to an end portion of the rotational shaft, and a stopping ring is connected to the end portion of the rotational shaft so as to prevent the sensor shutter from being separated. Accordingly, the sensor shutter can be quickly and easily connected and the length of the rotational shaft can be decreased.

Abstract: A switched reluctance motor is provided that includes a housing, a stator and a rotor received and installed within the housing, and a rotor position detector that detects a rotational position of the rotor at an outer side of the housing. With such structure, assembly may be quickly and easily performed, a sensor may be easily repaired and checked, and a bad influence on the sensor by temperature and dust may be reduced.

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.