Abstract: A KVM switch of universal input and programmable USB hub includes a main control unit (MCU) chip, having a MCU circuit for controlling functions of the KVM switch, complete reports of console input devices, reading and corresponding transmissions of descriptors; a console device interface chip connected to the MCU; a console port, connected to the console device interface chip; a computer interface chip, connected to the MCU; a re-assignment USB hub chip, connected to the computer interface chip; and a computer port, connected to the re-assignment USB hub chip. Console USB I/O interfaces become dynamic and universal, such that USB devices connected to the control end correspond to the computer port to provide full compatibility, and the console ports can be connected to various USB devices without any limitation of device types, and the devices can be replaced freely during their operation to provide convenient operations and applications.

Abstract: An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a “big via,” is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also includes a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view, the second dimension being substantially less than the first dimension.

Abstract: An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a “big via,” is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also includes a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view, the second dimension being substantially less than the first dimension.

Abstract: A KVM switch apparatus with bridging function includes a processor with a keyboard connection interface and a mouse connection interface; a keyboard/mouse switching circuit; a USB bridge unit and at least one computer interface unit electrically connected to at least one computer. The keyboard/mouse switching circuit and the USB bridge unit are selectively connected, whereby a switching of bridging channels is provided between at least two computers.

Abstract: A three-dimensional display including a display and a micro-lens is provided. The display has a plurality of pixel units thereon, and each pixel unit has a pixel pitch i. The micro-lens is disposed at a side of the display, the micro-lens has a plurality of lens units thereon, and each lens unit has a lens pitch l. A right eye viewing zone and a left eye viewing zone are formed if an image displayed from the display passes though the micro-lens, wherein a distance between the center of the right eye viewing zone and the center of the left eye viewing zone is wz, and lens pitch l satisfies: 2 ? i > l > 2 ? i × w z w z + i , wz is between 70 and 500 mm and i is between 0.1 and 500 ?m.

Abstract: A KVM switch apparatus with bridging function includes a processor with a keyboard connection interface and a mouse connection interface; a keyboard/mouse switching circuit; a USB bridge unit and at least one computer interface unit electrically connected to at least one computer. The keyboard/mouse switching circuit and the USB bridge unit are selectively connected, whereby a switching of bridging channels is provided between at least two computers.

Abstract: The present invention relates to an automatic mapping and updating computer switch device. The computer switching device provides the compatibility between a plurality of devices and a plurality of computers, and comprises a USB Host Chip connected to the plurality of peripheral devices each containing a USB connector for sending the necessary data (USB device descriptor/report) to a plurality of USB Device Chips, thus, the computers can acquire the necessary data of the peripheral devices through the connected USB Device Chips. Whenever the computer switching device re-boots or any of the peripheral devices are plugged in/pulled out, the USB Host Chip reads the new necessary data again with the previous ones, if any differences are found, the new necessary data is send to the USB Device Chip for storage. The aforesaid procedure is called DDM (Dynamic Devices Mapping) or full USB Enumeration or full USB Initiation.

Abstract: The present invention relates to a KVM switch with separate on-screen display and control channels, particularly to the KVM switch is connected to a plurality of computers, monitors and operation devices. The KVM switch comprises a switch circuit connected with the computers, a video switch circuit connected with the switch circuit for sending a signal to the monitors, a separate control system connected to the video switch circuit for receiving a function command from the operation devices, and a video control and display unit connected to the separate control system for producing and sending a video signal and synchronous signal to the monitors through the video switch circuit.

Abstract: The present invention relates to an automatic mapping and updating computer switch device. The computer switching device provides the compatibility between a plurality of devices and a plurality of computers, and comprises a USB host chip connected to the plurality of peripheral devices each containing a USB connector for sending the necessary data (USB device descriptor/report) to a plurality of USB device chips, thus, the computers can acquire the necessary data of the peripheral devices through the connected USB device chips. Whenever the computer switching device re-boots or any of the peripheral devices are plugged in/pulled out, the USB host chip reads the new necessary data again with the previous ones, if any differences are found, the new necessary data is send to the USB device chips for storage. The aforesaid procedure is called DDM (Dynamic Devices Mapping) or full USB Enumeration or full USB Initiation.

Abstract: A switchable cable device suitable for connecting between an electronic device and an external peripheral device for signal transmission is disclosed. The switchable cable device comprises a cable having a connection at a side for electrically connecting to the electronic device and at least two branches disposed on another side thereof. Each branch has a connector and at least one extensional connector. The extensional connectors and connectors have circuit boards and chips which can independently renew an activation program.

Abstract: A KVM switch is disclosed to include a housing, VGA ports arranged in pair on front and back panels of the housing for selectively installation of PCs in the front or back side of the housing, switching keys and indicator lights mounted on the front panel of the housing corresponding to the pairs of VGA ports, and a control unit mounted inside the housing to automatically scan connection of KVM cables to the VGA ports and to automatically switch off the corresponding VGA port on the front (or back) side of the housing when one VGA port on the back (or front) side of the housing is connected with the KVM cable.

Abstract: A KVM switch with an expansion module slot is disclosed. The KVM switch comprises a housing, a printed circuit board and an expansion module slot. The housing includes a receiving space, a panel disposed at a side thereof and a removable back panel disposed at another side thereof. The printed circuit is disposed in the receiving space, and comprises a controller, a switching circuit, a plurality of connectors and a plurality of wires. The expansion module slot is disposed corresponding to the back panel and is used for receiving an expansion module.

Abstract: A KVM switch with an expansion module slot is disclosed. The KVM switch comprises a housing, a printed circuit board and an expansion module slot. The housing includes a receiving space, a panel disposed at a side thereof and a removable back panel disposed at another side thereof. The printed circuit is disposed in the receiving space, and comprises a controller, a switching circuit, a plurality of connectors and a plurality of wires. The expansion module slot is disposed corresponding to the back panel and is used for receiving an expansion module.

Abstract: The present invention discloses a bidirectional convertible KVM switch assembly structure and its KVM switch, wherein the assembly structure uses a base to contain a KVM switch connected to a rear end of a four-in-one KVM switch and fixes the KVM switch, and the base and the KVM switch are latched with each other by male and female connectors (or male and female header receptacles), so that the KVM switch with a different number of ports (such as 4 ports, 8 ports or 16 ports) can be changed according to a user's requirement, and it is not necessary to remove the whole 4-in-1 structure and the fixed base for installing the KVM switch, and the KVM switch with a different number of ports can be latched directly with the fixed base.

Abstract: An offset spacer layer for an LDD ion implantation process is formed by blanket deposition without photolithography and dry etch processes. The offset spacer layer remaining on LDD regions during an ion implantation process prevents a substrate from silicon loss and dosage contamination and has densified characteristics to improve device reliability.

Abstract: Within an option selection device structure and a method for fabrication thereof there is formed a terminal metal layer and an option selection device at a co-planar level over a microelectronic substrate. The option selection device is passivated with: (1) a terminal metal passivation layer having an etch stop layer within its thickness; and (2) a bond pad passivation layer. There is simultaneously also formed through the bond pad passivation layer: (1) a via which accesses a bond pad formed contacting the terminal metal layer; and (2) an aperture over the option selection device which stops at the etch stop layer.

Abstract: A method for manufacturing isolation structures in a semiconductor device includes providing a substrate with a surface. A plurality of ions are implanted below the surface of the substrate and the substrate is then annealed to form a layer below its surface. Isolation structures may then be formed in the substrate extending from the surface of the substrate to approximately the depth of the layer.

Abstract: An offset spacer layer for an LDD ion implantation process is formed by blanket deposition without photolithography and dry etch processes. The offset spacer layer remaining on LDD regions during an ion implantation process prevents a substrate from silicon loss and dosage contamination and has densified characteristics to improve device reliability.

Abstract: Method for reducing dopant contamination during the fabrication of semiconductor devices is provided. The method includes doping a first layer, such as a polysilicon layer. During a subsequent annealing process, a gas, such as nitrogen, oxygen, a combination thereof, or the like, is introduced. The gas causes a cap layer to be formed over the first layer, preventing or reducing out-diffusing of the dopants and contamination of the process chamber. In a preferred embodiment, the gas is introduced during the ramp-up stage of the annealing process. The cap layer may be removed prior to etching the first layer.

Abstract: Within an option selection device structure and a method for fabrication thereof there is formed a terminal metal layer and an option selection device at a co-planar level over a microelectronic substrate. The option selection device is passivated with: (1) a terminal metal passivation layer having an etch stop layer within its thickness; and (2) a bond pad passivation layer. There is simultaneously also formed through the bond pad passivation layer: (1) a via which accesses a bond pad formed contacting the terminal metal layer; and (2) an aperture over the option selection device which stops at the etch stop layer.