Abstract: Various embodiments of the present invention are directed to stacked memory modules. In one embodiment of the present invention, a memory module comprises at least one memory-controller layer stacked with at least one memory layer. Fine pitched through vias (e.g., through silicon vias) extend approximately perpendicular to a surface of the at least one memory controller through the stack providing electronic communication between the at least one memory controller and the at least one memory layers. Additionally, the memory-controller layer includes at least one external interface configured to transmit data to and from the memory module. Furthermore, the memory module can include an optical layer. The optical layer can be included in the stack and has a bus waveguide to transmit data to and from the at least one memory controller. The external interface can be an optical external interface which interfaces with the optical layer.

Abstract: A semiconductor device is disclosed. Embodiments relate to a semiconductor device which includes an active region including a source region, a drain region, and a channel region. A gate electrode, source electrodes, and a drain electrode are formed around the active region. A plurality of gate fingers diverge from the gate electrode into the channel region. A plurality of source fingers diverge from the source electrodes into the source region, the source fingers being disposed between the gate fingers in a predetermined pattern, the source fingers having at least two finger lines connected to each other via at least one grid line. A plurality of drain fingers diverge from the drain electrode into the drain region, the drain fingers being disposed between the gate fingers where the source fingers are not disposed.

Abstract: Embodiments relate to a fuse for a semiconductor device. To maintain a stable blowing characteristic with a minimized applied current, the fuse includes a fuse line having a blowing characteristic dependent on applied current. A first contact pad has a plurality of contacts connected to one side of the fuse line. A second contact pad has a plurality of contacts connected to the other side of the fuse line. The first and second contact pads have an asymmetrical configuration, which may have different ratios of length to width.

Abstract: A semiconductor device capacitor fabrication method that is capable of enabling the simultaneous use of an oxide capacitor and a PIP capacitor of a semiconductor device depending upon whether metal line terminals are used. The semiconductor device capacitor fabrication method can include forming an active region and a first gate electrode over a semiconductor substrate, partially depositing a silicon nitride layer, over which a capacitor will be formed, over the first gate electrode, forming a second gate electrode over the silicon nitride, sequentially forming a first insulation layer and a second insulation layer over the resultant structure and forming line terminals extending through the first insulating layer and the second insulating layer for a transistor and a capacitor.

Abstract: A method of forming a semiconductor device that can include forming a channel region in a semiconductor substrate; forming a first gate electrode and a second gate electrodes over the semiconductor substrate, the first gate electrode and the second gate electrode being spaced apart from each other at a predetermined distance; forming spacers on sidewalls of the first gate electrode and the second gate electrode and over the semiconductor substrate; forming source/drain regions in the semiconductor substrate; forming a first interlayer insulating layer and a second interlayer insulating over the semiconductor substrate; forming a plurality of contact holes in the first interlayer insulating layer and the second interlayer insulating; and then forming a contact plug in the plurality of contact holes.

Abstract: A semiconductor device including a semiconductor substrate having source/drain regions, a gate electrode formed on and/or over the semiconductor substrate, spacers formed against sidewalls of the gate electrode, an interlayer insulating layer formed over the semiconductor substrate and the gate electrode and having a plurality of contact holes formed therein, and contact plugs formed within the contact holes. The contact plugs can include a first contact plug and a second contact plug electrically connected to the gate electrode, and a third contact plug and a fourth contact plug electrically connected to the source/drain regions.

Abstract: A method of operation within an integrated-circuit processing device having a plurality of execution lanes. Upon receiving an instruction to exchange data between the execution lanes, respective requests from the execution lanes are examined to determine a set of the execution lanes that may send data to one or more others of the execution lanes during a first interval. Each execution lane within the set of the execution lanes is signaled to indicate that the execution lane may send data to the one or others of the execution lanes.

Abstract: A MOS transistor may include at least one of: a channel having a width W0 and a length L0; an active area with a channel between a source area and a drain area; a gate insulating layer formed over a channel; and/or a gate conductor formed over a gate insulating layer and intersecting the active area. In embodiments, a gate conductor may include at least one of: a connection pattern formed with a gate contact hole which electrically connects the gate conductor to the outside; an additional pattern connected to a connection pattern and positioned in parallel with both source and drain areas while being spaced apart from the active area at a certain distance; and a channel pattern connected to an additional pattern in the shape of a T and defining the length of a channel.

Abstract: A gate capacitor having a horizontal structure and a method for manufacturing the same is provided. The gate capacitor having a horizontal structure can be formed on a semiconductor substrate and used as a MOS transistor. The gate capacitor includes at least two adjacent gate electrodes and a capacitor dielectric layer filled between the two gate electrodes. In this case, insulating spacers can be formed at a sidewall of the gate electrodes in which the capacitor dielectric layer is not formed. As the gate capacitors can be used as a MOS transistor, a gate insulating layer can be formed between the two gate electrodes and the semiconductor substrate.

Abstract: Disclosed is a semiconductor transistor for enhancing performance of PMOS and NMOS transistors, particularly current driving performance, while reducing a narrow width effect. A narrow width MOS transistor includes: a channel of which width is W0 and length is L0; an active area including source and drain areas formed at both sides with the channel as a center; a gate insulating layer formed on the channel; a gate conductor formed on the gate insulating layer and intersecting the active area; a first additional active area of width is larger than that W0 of the channel as an active area added to the source area; and a second additional active area of width is larger than that W0 of the channel as an active area added to the drain area. When the structure of the transistor having the additional active areas is applied to NMOS and PMOS transistors, a driving current is represented as 107.27% and 103.31%, respectively. Accordingly, the driving currents of both PMOS and NMOS transistors are enhanced.