Abstract: The present invention relates to a camera module, and the present invention may comprise: a lens; a heating layer positioned on the lens so as to generate heat when power is supplied thereto; and a heating wire, which is positioned on the surface of the lens or of the heating layer, which generates heat when a current is supplied thereto from an external power supply, and which is electrically connected to the heating layer. The present invention comprises a heating wire, besides the heating layer that comprises a conductive material, and thus can reduce the time taken to supply a heating body with a current, and the reduced heating time accordingly enables rapid heating.

Abstract: One embodiment of a camera module may comprise: a lens barrel having a hollow formed therein, comprising at least one lens aligned in the optical axis of the hollow; a holder having formed therein an internal space in which a part of the lens barrel is accommodated; a casing coupled to the holder and having formed therein an internal space in which a printed circuit board is accommodated; and a first heater which is electrically connected to the printed circuit board to heat the lens.

Abstract: The present invention relates to a camera module, and the present invention may comprise: a lens; a heating layer positioned on the lens so as to generate heat when power is supplied thereto; and a heating wire, which is positioned on the surface of the lens or of the heating layer, which generates heat when a current is supplied thereto from an external power supply, and which is electrically connected to the heating layer. The present invention comprises a heating wire, besides the heating layer that comprises a conductive material, and thus can reduce the time taken to supply a heating body with a current, and the reduced heating time accordingly enables rapid heating.

Abstract: One embodiment of a camera module may comprise: a lens barrel having a hollow formed therein, comprising at least one lens aligned in the optical axis of the hollow; a holder having formed therein an internal space in which a part of the lens barrel is accommodated; a casing coupled to the holder and having formed therein an internal space in which a printed circuit board is accommodated; and a first heater which is electrically connected to the printed circuit board to heat the lens.

Abstract: The present invention relates to a camera module, and the present invention may comprise: a lens; a heating layer positioned on the lens so as to generate heat when power is supplied thereto; and a heating wire, which is positioned on the surface of the lens or of the heating layer, which generates heat when a current is supplied thereto from an external power supply, and which is electrically connected to the heating layer. The present invention comprises a heating wire, besides the heating layer that comprises a conductive material, and thus can reduce the time taken to supply a heating body with a current, and the reduced heating time accordingly enables rapid heating.

Abstract: One embodiment of a camera module may comprise: a lens barrel having a hollow formed therein, comprising at least one lens aligned in the optical axis of the hollow; a holder having formed therein an internal space in which a part of the lens barrel is accommodated; a casing coupled to the holder and having formed therein an internal space in which a printed circuit board is accommodated; and a first heater which is electrically connected to the printed circuit board to heat the lens.

Abstract: The present invention relates to a camera module, and the present invention comprises: a lens unit; a lens barrel for fixing the lens unit; a substrate unit, which has an image sensor mounted thereon, for converting light incident through the lens unit into an electric signal; and a housing accommodating the substrate unit in an inner space thereof and of which one side is coupled to the lens barrel, and the present invention can comprise: a transmission coil accommodated inside the housing so as to form an electric field, and a conductive heating element arranged on an outer surface of the lens unit or on an outer circumferential surface of the lens barrel, and in which an induced current is generated by the electric field formed by the transmission coil. Since the present invention heats a lens by wirelessly supplying power to a heating element through simple configurations such as a transmission coil and the heating element, large changes are unnecessary in the volume and the structure of a camera module.

Abstract: The present invention relates to a camera module, and the present invention may comprise: a lens; a heating layer positioned on the lens so as to generate heat when power is supplied thereto; and a heating wire, which is positioned on the surface of the lens or of the heating layer, which generates heat when a current is supplied thereto from an external power supply, and which is electrically connected to the heating layer. The present invention comprises a heating wire, besides the heating layer that comprises a conductive material, and thus can reduce the time taken to supply a heating body with a current, and the reduced heating time accordingly enables rapid heating.

Abstract: The present invention relates to a camera module, and the present invention comprises: a lens unit; a lens barrel for fixing the lens unit; a substrate unit, which has an image sensor mounted thereon, for converting light incident through the lens unit into an electric signal; and a housing accommodating the substrate unit in an inner space thereof and of which one side is coupled to the lens barrel, and the present invention can comprise: a transmission coil accommodated inside the housing so as to form an electric field, and a conductive heating element arranged on an outer surface of the lens unit or on an outer circumferential surface of the lens barrel, and in which an induced current is generated by the electric field formed by the transmission coil. Since the present invention heats a lens by wirelessly supplying power to a heating element through simple configurations such as a transmission coil and the heating element, large changes are unnecessary in the volume and the structure of a camera module.

Abstract: One embodiment of a camera module may comprise: a lens barrel having a hollow formed therein, comprising at least one lens aligned in the optical axis of the hollow; a holder having formed therein an internal space in which a part of the lens barrel is accommodated; a casing coupled to the holder and having formed therein an internal space in which a printed circuit board is accommodated; and a first heater which is electrically connected to the printed circuit board to heat the lens.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

Abstract: Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.

Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.

Abstract: The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.

Abstract: Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.