Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.

Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.

Abstract: A biological material manufacturing device according to an embodiment of the inventive concept includes a main body and a head unit that is rotatable on the main body. The main body includes a main groove and a first container groove connected to the main groove. The head unit includes a pillar provided in the main groove and a protruding part that protrudes from the pillar.

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.

Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.

Abstract: In some aspects, the disclosure relates to compositions and methods for treating fibrodysplasia ossificans progressiva (FOP) in a subject. In some aspects, the disclosure provides isolated nucleic acids, and vectors such as rAAV vectors, configured to express transgenes that inhibit (e.g., decrease) expression of mutated AVCR1 gene in muscle cells or connective tissues.

Abstract: A method of preventing or treating pathogenic bacterial infectious diseases, includes: providing a pharmaceutical composition comprising a LysSAP26 protein, wherein the LysSAP26 protein is a recombinant protein composed of an amino acid sequence derived from the bacteriophage genome and includes an amino acid sequence represented by SEQ ID NO: 1 as an active ingredient; and administering the pharmaceutical composition to a subject.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.

Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.