Patents by Inventor Jung Up PARK

Jung Up PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polycarbonate resin composition having excellent heat resistance and fluidity, and molded product including same
    Patent number: 10934431
    Abstract: Disclosed is a polycarbonate resin composition including (1) a polyester compound having a structure of chemical formula 1 as defined herein or a phenyl-arylene ether sulfone compound having a structure of chemical formula 2 as defined herein; (2) a polycarbonate block copolymer; and (3) a thermoplastic aromatic polycarbonate resin or a polysiloxane-polycarbonate resin; and a molded product including the same. The polycarbonate resin composition exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: March 2, 2021
    Assignee: SAMYANG CORPORATION
    Inventors: Seung Pil Jung, Jung Up Park, Jin Sik Choi, Seong Hyen Heo, Kyung Moo Shin
  • POLYCARBONATE RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE AND FLUIDITY, AND MOLDED PRODUCT INCLUDING SAME
    Publication number: 20200087509
    Abstract: The present invention relates to a polycarbonate resin composition having excellent heat resistance and fluidity, and a molded product including the same. More specifically, the present invention relates to a polycarbonate resin composition, and a molded product including the same, wherein the polycarbonate resin composition, by including a polycarbonate copolymer together with a compound having a specific structure and a specific resin, exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.
    Type: Application
    Filed: November 10, 2017
    Publication date: March 19, 2020
    Applicant: SAMYANG CORPORATION
    Inventors: Seung Pil JUNG, Jung Up PARK, Jin Sik CHOI, Seong Hyen HEO, Kyung Moo SHIN