Abstract: A coated preparation for the detection of a H. pylori infection according to a urea breath test protocol which comprises a core composition containing at least an isotope C-labeled urea, an excipient and a lubricant in defined proportions and covered with 0.1˜10 weight % of a coating agent based on 100 weight % of the core composition. With this preparation, the influence of the urease-producing bacteria resident in organs other than the stomach, such as the mouth and throat, is excluded to enable a diagnosis of H. pylori infection without the risk for a false-positive test and with reasonable rapidity.

Abstract: It is intended to provide tablets which have a favorable texture in taking and excellent compressing characteristics, friability and mechanical strength. Tablets which are produced by blending a powdery or granular mixture comprising (1) an effective amount of a pharmacologically active substance and (2) 50% by weight or more of a water-soluble filler based on the powdery or granular mixture with (3) a compressing characteristic improving agent containing moisture at least in an amount corresponding to the equilibrated moisture content at 25° C. under a humidity of 12% and having an average particle size of 100 ?m or less, at a ratio of from 1 to 50% by weight based on the above mixture, and then compressing the resultant mixture.

Abstract: The present invention provides low hygroscopic forms of aripiprazole and processes for the preparation thereof which will not convert to a hydrate or lose their original solubility even when a medicinal preparation containing the aripiprazole anhydride crystals is stored for an extended period.

Abstract: An object of the present invention is to provide an elecroless copper plating solution using glyoxylic acid or a salt of glyoxylic acid as the reducing agent in which the amount of Cannizzaro reaction product is small, and the mechanical property of the obtained plated film is excellent, and to provide a supplementary solution for the electroless copper plating solution, a plating method capable of stably forming a plated film using the electroless copper plating solution, and a method of manufacturing a wiring board having an excellent connecting reliability of a through hole.