Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Abstract: The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 ?m or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 ?g/cm2 or more and 0.40 ?g/cm2 or less.

Abstract: A flexible printed circuit board includes: an electrically insulating layer having a first surface and a second surface opposite to the first surface; a first wiring disposed on the first surface; a second wiring disposed on the second surface; and an electrically conductive layer. The first wiring includes a first land. The second wiring includes a second land. The first wiring includes a first layer disposed on the first surface and a second layer disposed on the first layer. The second wiring includes a third layer disposed on the second surface and a fourth layer disposed on the third layer. The first land and the second land overlap each other in a plan view. The electrically insulating layer is provided with a through hole extending through the electrically insulating layer in a thickness direction and overlapping the first land and the second land at least partially in the plan view.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 µm to 2.0 µm. The wiring lines have an average height of 40 µm to 120 µm. The wiring lines have an average spacing of 1 µm to 30 µm.

Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 ?m or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 ?g/cm2 or more and 0.40 ?g/cm2 or less.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Abstract: A plating device for printed interconnect boards includes: a plating bath configured to store a plating solution; a plurality of metal jigs; an anode disposed to face the base boards for printed interconnect boards; and a mechanism configured to apply a voltage to the anode and to the base boards for printed interconnect boards, wherein the plurality of metal jigs include insulating shielding plates at areas facing the anode and include, on sides of the base boards for printed interconnect boards and between the base boards for printed interconnect boards and the shielding plates, exposed surfaces that are orthogonal to the base boards for printed interconnect boards.

Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Abstract: A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.

Abstract: Provided is an aluminum plating solution capable of continuously manufacturing an aluminum film, the surface of which is smooth and which has good elongation. The aluminum plating solution capable of electrodepositing aluminum on a surface of a base contains, as components, (A) an aluminum halide, (B) at least one compound selected from the group consisting of alkylimidazolium halides, alkylpyridinium halides, and urea compounds, and (C1) at least one selected from the group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phosphine compounds, and sulfide compounds. The component (C1) has, as at least one side chain, a straight-chain or branched alkyl group having 8 or more and 36 or less carbon atoms. A mixing ratio of the component (A) and the component (B) is in a range of 1:1 to 3:1 in terms of molar ratio. A concentration of the component (C1) is 1.0 g/L or more and 45 g/L or less.

Abstract: Provided are a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber.

Abstract: Provided is an aluminum plating solution that has a wide current density range in which aluminum plating can be performed and that has a low solution resistance. The aluminum plating solution contains an aluminum halide, at least one selected from the group consisting of an alkylimidazolium halide, an alkylpyridinium halide, and a urea compound, and an ammonium salt represented by the general formula (1) below. A concentration of the ammonium salt is 1 g/L or more and 45 g/L or less. NR4+.X???General formula (1) In the general formula, R each represent a hydrogen atom or an alkyl group which may have a side chain and which has 15 or less carbon atoms, X represents a halogen atom, and R may be the same or different from each other.

Abstract: Provided is a conductive resin molded body that has a three-dimensional network structure and is suitable for producing an aluminum porous body in which the water adsorption amount is small. The conductive resin molded body includes a resin molded body having a three-dimensional network structure and a conductive layer at least containing carbon black and carboxymethylcellulose on the surface of the skeleton of the resin molded body. The conductive layer is preferably formed by applying a carbon coating material at least containing carbon black, carboxymethylcellulose, and water to the surface of the skeleton of the resin molded body and subsequently drying the carbon coating material; and the carbon coating material preferably has a viscosity of 100 mPa·s or more and 600 mPa·s or less.

Abstract: A metal tube including a metal substrate and a metal porous body disposed on at least part of a surface of the metal substrate. The metal tube is obtained by the steps of joining the metal porous body to at least part of the surface of the metal substrate in flat plate form; and forming the metal substrate with the metal porous body joined thereto into a tubular shape.

Abstract: The object of the invention is to provide a bed with a load detection function. The invention provides a bed with a load detection function that detects a load applied to a bed body, using a load detector attached to the bed body, and detects the state of a user on a bed surface of the bed body. Additionally, a load detector suitable for the bed is provided.