Abstract: An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.

Abstract: The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.

Abstract: In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor includes a ceiling plate section covering the chip part and side plate sections which are formed to be united with the ceiling plate section and to be at a position lower than the ceiling plate section and which are arranged on both sides in a horizontal direction of the chip part, and openings are formed in both side ends in a front-rear direction of the shielding conductor to open both sides in a front-rear direction of the chip part, and the side plate sections of the shielding conductor are electrically connected via a plurality of shielding bumps in the front-rear direction to a ground layer pattern of a mounting substrate.

Abstract: An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.

Abstract: Regular data inputted/outputted to/from external terminals is read/written to/from a regular cell array, and parity data is read/written from/to a parity cell array. Since the parity data is generated by a parity generation circuit, it is difficult to write a desired pattern to the parity cell array. The regular data and the parity data are exchanged with each other by a switch circuit, so that the regular data can be written to the parity cell array and the parity data can be written to the regular cell array. This enables the write of desired data to the parity cell array. A test of the parity data can be easily conducted. In particular, a leakage test or the like between memory cells can be easily conducted.

Abstract: The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.

Abstract: An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Abstract: The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.

Abstract: The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.

Abstract: In a shielding configuration of a chip part, a shielding effect and a cooling effect are sufficiently obtained at the same time. In an electronic device including a chip part to be disclosed, a shielding conductor 3 includes a ceiling plate section 4 covering the chip part 1 and side plate sections 5 which are formed to be united with the ceiling plate section 4 and to be at a position lower than the ceiling plate section 4 and which are arranged on both sides in a horizontal direction of the chip part 1, and openings 8 are formed in both side ends in a front-rear direction of the shielding conductor 3 to open both sides in a front-rear direction of the chip part 1, and the side plate sections 5 of the shielding conductor 3 are electrically connected via a plurality of shielding bumps 17 in the front-rear direction to a ground layer pattern 11 of a mounting substrate 10.

Abstract: A pulse generator generates a plurality of column pulses in response to a read command. An address counter outputs addresses subsequent to an external address supplied in association with the read command in succession as internal addresses. A column decoder successively selects column selecting lines in synchronization with the column pulses. A plurality of bits of data read from memory cells in response to a single read command RD is successively transmitted to a common data bus line through column switches. This can reduce the number of data bus lines to a minimum, preventing an increase in chip size. Since a single data bus line can transmit a plurality of bits of data, it is possible to minimize the size of the memory region to be activated in response to a read command. This consequently allows a reduction in power consumption.

Abstract: The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.

Abstract: An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Abstract: In an optical module, a package includes an array of first optical elements and at least one first positioning member. A microlens array plate including microlenses is fixed to the package, so that each of the microlenses corresponds to one of the first optical elements. An optical array connector mounts second optical elements thereon. The optical array connector has a light path bending portion for bending light paths of the second optical elements and at least one second positioning member. The optical array connector abuts against the package by aligning the second positioning member to the first positioning member so that each of the first optical elements corresponds to one of the second optical elements, A clamping member clamps the optical, array connector to the package.

Abstract: A casting apparatus comprises a die 2 which contains a molten metal which is poured via an opening section which is disposed above the die, a heater which is disposed above the die, a gas supplying structure for supplying an inert gas to a surface of the molten metal, a lid 6 which is disposed between the surface of the molten metal and the heater, and a lid moving structure for moving the lid to the die relatively so as to control the opening amount of the opening section above the die.

Abstract: A pulse generator generates a plurality of column pulses in response to a read command. An address counter outputs addresses subsequent to an external address supplied in association with the read command in succession as internal addresses. A column decoder successively selects column selecting lines in synchronization with the column pulses. A plurality of bits of data read from memory cells in response to a single read command RD is successively transmitted to a common data bus line through column switches. This can reduce the number of data bus lines to a minimum, preventing an increase in chip size. Since a single data bus line can transmit a plurality of bits of data, it is possible to minimize the size of the memory region to be activated in response to a read command. This consequently allows a reduction in power consumption.

Abstract: An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.

Abstract: In an optical module, a package includes an array of first optical elements and at least one first positioning member. A microlens array plate including microlenses is fixed to the package, so that each of the microlenses corresponds to one of the first optical elements.

Abstract: A simple and inexpensive method and apparatus for producing crystalline silicon comprising the steps of melting silicon in a mold, then cooling the bottom of the mold is cooled to create a positive temperature gradient from the bottom of the mold upward, thereby causing the molten silicon to crystallize from the inner bottom of the mold upward so that the solid-liquid phase boundary, separating the crystallized silicon from the molten silicon, moves upward as the molten silicon crystallizes. As the silicon crystallizes, an inert gas is blown onto the surface of the molten silicon from a position above the surface of the molten silicon, thereby vibrating the surface of the molten silicon in such a manner that cavities are formed in the surface of the molten silicon.

Abstract: A simple and inexpensive method and apparatus for producing crystalline silicon comprising the steps of melting silicon in a mold, then cooling the bottom of the mold is cooled to create a positive temperature gradient from the bottom of the mold upward, thereby causing the molten silicon to crystallize from the inner bottom of the mold upward so that the solid-liquid phase boundary, separating the crystallized silicon from the molten silicon, moves upward as the molten silicon crystallizes. As the silicon crystallizes, an inert gas is blown onto the surface of the molten silicon from a position above the surface of the molten silicon, thereby vibrating the surface of the molten silicon in such a manner that cavities are formed in the surface of the molten silicon.