Patents by Inventor Junji Fukuhara

Junji Fukuhara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230071452
    Abstract: A double-sided pressure-sensitive adhesive tape includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C.
    Type: Application
    Filed: August 20, 2020
    Publication date: March 9, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Junji FUKUHARA, Masahito NIWA, Toru ISEKI, Ryosuke YOKOKAWA
  • Publication number: 20230033447
    Abstract: Provided is a double-sided pressure-sensitive adhesive tape, which is excellent in initial pressure-sensitive adhesive property to an adherend, is sufficiently elongated, hardly breaks even when sufficiently elongated, can be smoothly pulled and removed from the adherend under an elongated state, and is excellent in reworking properties.
    Type: Application
    Filed: September 14, 2020
    Publication date: February 2, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yukihiro YAMASHITA, Makoto SAITO, Toru ISEKI, Junji FUKUHARA
  • Publication number: 20220389284
    Abstract: Provided is a double-sided pressure-sensitive adhesive tape excellent in reworkability. A double-sided pressure-sensitive adhesive tape according to an embodiment of the present invention includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 100% of 7 N/10 mm or less, and wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 500% of 20 N/10 mm or less.
    Type: Application
    Filed: August 20, 2020
    Publication date: December 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toru ISEKI, Masahito NIWA, Junji FUKUHARA, Ryosuke YOKOKAWA
  • Publication number: 20220389283
    Abstract: A double-sided pressure-sensitive adhesive includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, and wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C.
    Type: Application
    Filed: August 20, 2020
    Publication date: December 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toru ISEKI, Masahito NIWA, Junji FUKUHARA, Ryosuke YOKOKAWA
  • Publication number: 20220195256
    Abstract: Provided is a PSA sheet that can bond well with at least a prescribed bonding strength to an adherend before a curing treatment and that can greatly prevent adhesive transfer during separation from the adherend after the curing treatment even when exposed to a high temperature. Provided is a PSA sheet having a PSA layer comprising carbon-carbon double bonds. The PSA sheet satisfies a property that the PSA layer has an elastic modulus of 22 MPa or greater, determined by nanoindentation after a heating/curing treatment in which the PSA sheet is heated at 180° C. for one hour, left standing at 25° C. for 30 minutes and then irradiated with UV rays at an intensity of 60 mW/cm2.
    Type: Application
    Filed: January 30, 2020
    Publication date: June 23, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi KAWAMOTO, Junji FUKUHARA, Takamasa HIRAYAMA
  • Publication number: 20220119685
    Abstract: Provided is a PSA sheet that can be separated well from the adherend after a curing treatment and that can prevent adhesive transfer during separation even when exposed to a high temperature. Provided is a PSA sheet having a PSA layer. The PSA layer of the PSA sheet comprises a polymer having a glass transition temperature of ?63° C. or higher. The PSA sheet has an adhesive strength reduction rate 17% or higher after a heating/curing treatment.
    Type: Application
    Filed: January 30, 2020
    Publication date: April 21, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi KAWAMOTO, Junji FUKUHARA, Takamasa HIRAYAMA
  • Publication number: 20130344274
    Abstract: The present invention is for providing a pressure-sensitive adhesive tape for protecting the surface of semiconductor parts which transfers little foreign matter to an object (part) to be adhered in a manufacturing process, the pressure-sensitive adhesive tape comprising at least a base material film, a pressure-sensitive adhesive layer, and a peeling liner, the base material film having the pressure-sensitive adhesive layer on one surface thereof, and the peeling liner using an unprocessed plastic film which does not contain a releasing layer being formed on the pressure-sensitive adhesive layer.
    Type: Application
    Filed: January 18, 2012
    Publication date: December 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Junji Fukuhara, Yukio Arimitsu