Abstract: An apparatus for cooling various types of heating sources in vacuum, wherein the heating source is adapted to be electronically cooled by the cooling portion thereof with the Pelter effect disposed in the vacuum by the feeding of the current from a DC power supply into a circuit formed by the use of the thermoelectric materials, resulting in that the response speed of the cooling may be improved, and the pollution within the vacuum portion may be prevented.

Abstract: An optical waveguide and an image sensor using the same, the optical waveguide comprising a plurality of bar-shaped cores that are aligned in a proper manner, the cores being made of transparent materials with a large refractive index, and a cladding that is disposed around the cores, the cladding being made of materials with a small refractive index that are capable of absorbing or scattering light, wherein part of each of said cores on which irradiated light is incident is uncovered, or part of said cladding on which irradiated light is incident is transparent.

Abstract: An electrostatic dust collector including a wall enclosing a vacuum chamber in which a target face to be subjected to dust removal is provided, an electron beam emitting device for emitting electron beams to dust on the target face so as to charge the dust negatively, a dielectric member which is provided in the vacuum chamber and has a collecting face confronting the target face and a member for imparting positive potential to the collecting face such that the dust charged negatively is attracted to the collecting face.

Abstract: A photosetting resin composition containing more than 10% by weight of one or more resins each having more than 3 functional groups--acryloyl or methacryloyl radicals--and a sensitizer. Since the compositions contain more than 10% by weight of one or more resins each having more than three functional groups, they exhibit very satisfactory and well balanced resistance-to-solder (JISC-6481, 260.degree. C., 10 sec), flexural strength (JISP-8115, 0.38R, 180.degree. bending) and adhesion (JISD-0202, chequer pattern test).

Abstract: There is provided a coating composition (B) consisting essentially of:a composition (A) anda photopolymerization initiating effective amount of a photoinitiator,said composition (A) containing:(i) 80 to 90% by weight of at least one polyfunctional monomer having three or more (meth)acryloyloxy radicals per molecule,(ii) 5 to 10% by weight of at least one acrylic monomer having two or less functional groups and(iii) 5 to 10% by weight of a phenol novolak epoxy (meth)acrylate oligomer of the formula: ##STR1## where, X.dbd.H, CH.sub.3,X.dbd.H, CH.sub.3, Br andn=0-8with the proportion of oligomer wherein n of 4.ltoreq.n.ltoreq.8 is more than 20 wt % with respect to the total amount of the novolak epoxy (meth)acrylate.

Abstract: A method of mounting electronic components on a printed circuit board by temporarily attaching the electronic component (4) to the circuit board (1) with adhesive (3) applied to the board (1), irradiating the adhesive (3) with ultraviolet rays with or without heating to cure the adhesive (3) and thereby rigidly attach the component (4) to the board (1), and thereafter joining the electrodes (5) of the component (4) to conductor portions (2) on the board (1). Excess adhesive portions (3a) adjoining the component (4) are cured first to subsequently cure the other portion of the adhesive (3) in chain relation to the curing of the excess.