Patents by Inventor Junji Kodemura
Junji Kodemura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7964685Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.Type: GrantFiled: December 27, 2007Date of Patent: June 21, 2011Assignee: Zeon CorporationInventors: Akihiko Yoshiwara, Junji Kodemura
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Publication number: 20110144292Abstract: A polymerizable composition suitable as an electric material and the like used in an electric circuit board, which comprises a norbornene monomer, a metathesis polymerization catalyst, and a chain transfer agent composed of a compound represented by formula (A): CH2?CH—Y—OCO—CR1?CH2 wherein Y represents a divalent hydrocarbon group having 3 to 20 carbon atoms, and R1 represents a hydrogen atom or a methyl group. By further comprising a crosslinking agent in the polymerizable composition, obtaining a crosslinkable resin by carrying out bulk polymerization, and crosslinking the crosslinkable resin to obtain a molded article and a crosslinked resin composite having excellent characteristics such as electric insulation, adhesion, mechanical strength, heat resistance, dielectric properties and the like.Type: ApplicationFiled: October 19, 2007Publication date: June 16, 2011Inventors: Kiyoshige Kojima, Junji Kodemura
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Publication number: 20100324247Abstract: A polymerizable composition comprising a norbornene monomer, a metathesis polymerization catalyst, and a nonpolar radical generating agent, from which a crosslinkable resin can be obtained that is suitable as an electric material and the like used in an electric circuit board. By coating or impregnating this polymerizable composition onto or into a support, and then carrying out bulk polymerization to obtain a crosslinkable resin composite, and then crosslinking the crosslinkable resin composite to obtain a crosslinked resin composite having excellent characteristics such as electric insulation, adhesion, mechanical strength, heat resistance, dielectric properties and the like. The compound has a dipole moment of 0.5 or less, generates radicals by heating, and can initiate a crosslinking reaction.Type: ApplicationFiled: October 19, 2007Publication date: December 23, 2010Applicant: ZEON CORPORATIONInventors: Kiyoshige Kojima, Junji Kodemura
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Publication number: 20100252310Abstract: A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.Type: ApplicationFiled: July 25, 2008Publication date: October 7, 2010Inventors: Kiyoshige Kojima, Junji Kodemura
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Publication number: 20100144924Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.Type: ApplicationFiled: December 27, 2007Publication date: June 10, 2010Applicant: Zeon CorporationInventors: Akihiko Yoshiwara, Junji Kodemura
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Publication number: 20100124615Abstract: A process for producing a crosslinkable resin formed product is disclosed which comprises providing a polymerizable composition containing a cycloolefin monomer, a metathesis polymerization catalyst, a chain transfer agent, and a crosslinking agent, and heating the polymerizable composition to 50° C. or more to effect ring-opening metathesis bulk polymerization, the temperature of the polymerizable composition before heating being maintained at ?10° C. to +20° C. According to the present invention, a process for efficiently producing a crosslinkable resin formed product which exhibits excellent flowability when melted by heat and does not produce voids(blurs) inside a laminate or impair flatness when laminated on a substrate is provided.Type: ApplicationFiled: February 6, 2007Publication date: May 20, 2010Applicant: ZEON CORPORATIONInventors: Tomoyoshi Ohtaki, Kazuyuki Onishi, Narumi Suzuki, Kiyoshige Kojima, Junji Kodemura
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Publication number: 20100015871Abstract: The present invention intends to provide a crosslinkable molded article and a crosslinked molded article free from molding failures, wherein their coefficient of thermal expansion is sufficiently low, their dimensional accuracy is high and a polymerizable composition is sufficiently filled in a fibrous material; a process for producing the same; and a use of such molded articles. A process for producing the molded articles of the present invention is characterized by producing a crosslinkable molded article by performing ring-opening bulk polymerization of a polymerizable composition comprising a cycloolefin monomer, a metathesis catalyst and, in accordance with need, a crosslinking agent and/or a filler in the presence of a glass yarn cloth having a bulk density of 0.50 to 1.10 g/cm3 and, then, if desired, conducting a crosslinking reaction.Type: ApplicationFiled: September 28, 2007Publication date: January 21, 2010Inventors: Hirotoshi Tanimoto, Tomoo Sugawara, Junji Kodemura
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Publication number: 20090305018Abstract: A crosslinkable resin formed product comprising a cycloolefin resin obtained by ring-opening metathesis bulk polymerization of a cycloolefin monomer and a crosslinking agent, the cycloolefin resin having a weight average molecular weight (Mw) of 10,000 to 50,000 and a molecular weight distribution (Mw/Mn) of 4.4 or less, a crosslinked resin formed product produced by crosslinking the crosslinkable resin formed product, and a crosslinked resin-metal clad laminate produced by laminating the crosslinked resin formed product on a metal foil are disclosed. According to the present invention, a crosslinkable resin formed product which exhibits excellent flowability when melted by heat, and does not produce voids inside the laminate or impair flatness when laminated with a substrate, a crosslinked resin formed product produced by crosslinking the crosslinkable resin formed product, and a crosslinked resin-metal clad laminate produced by laminating the crosslinked resin formed product on a metal foil are provided.Type: ApplicationFiled: February 6, 2007Publication date: December 10, 2009Applicant: Zeon CorporationInventors: Tomoyoshi Ohtaki, Kazuyuki Onishi, Narumi Suzuki, Kiyoshige Kojima, Junji Kodemura
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Patent number: 7465773Abstract: A polymerizable composition which comprises a cycloolefin monomer (A), a filler (B), a polymer (C) having a carboxyl group or a carboxylic acid anhydride group and having an acid value of 0.1 to 100 mgKOH/g, and a metathesis polymerization catalyst (D). The polymerizable composition comprises a cycloolefin monomer and a large amount of a filler, and has a low viscosity and is excellent in fluidity, and further can provide a molded product which is excellent in the lowness of dielectric constant, the lowness of dielectric loss tangent, the lowness of linear expansion coefficient, high heat resistance and adhesiveness, and further is free of bubble inclusion.Type: GrantFiled: August 4, 2004Date of Patent: December 16, 2008Assignee: Zeon CorporationInventors: Junji Kodemura, Kazunori Tohshima
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Patent number: 7358307Abstract: A graft polymer containing a cyclic structure comprised of a polymer containing a cyclic structure graft-modified with an unsaturated compound containing a polar group, having a graft ratio of 10 to 150 mol %, having a weight average molecular weight of 1,000 to 1,000,000, and having a gel content of not more than 0.1 wt % or having a ratio (Ha/La) of high molecular weight side area (Ha) and low molecular weight side area (La) divided by a vertical line suspended from a peak top of a differentiated elution profile measured by gel permeation chromatography to a baseline of not more than 1.6, a method of production of the same, and a curable composition containing that graft polymer containing a cyclic structure and a curing agent.Type: GrantFiled: April 27, 2001Date of Patent: April 15, 2008Assignee: Zeon CorporationInventors: Junji Kodemura, Kazuaki Kondo
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Patent number: 7238405Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 ?m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.Type: GrantFiled: February 4, 2004Date of Patent: July 3, 2007Assignee: Nippon Zeon Company, Ltd.Inventors: Yasuo Tsunogae, Yasuhiro Wakizaka, Junji Kodemura, Tohru Hosaka
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Publication number: 20060211809Abstract: A polymerizable composition which comprises a cycloolefin monomer (A), a filler (B), a polymer (C) having a carboxyl group or a carboxylic acid anhydride group and having an acid value of 0.1 to 100 mgKOH/g, and a metathesis polymerization catalyst (D). The polymerizable composition comprises a cycloolefin monomer and a large amount of a filler, and has a low viscosity and is excellent in fluidity, and further can provide a molded product which is excellent in the lowness of dielectric constant, the lowness of dielectric loss tangent, the lowness of linear expansion coefficient, high heat resistance and adhesiveness, and further is free of bubble inclusion.Type: ApplicationFiled: August 4, 2004Publication date: September 21, 2006Inventors: Junji Kodemura, Kazunori Toshima
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Publication number: 20060154099Abstract: A laminated body is disclosed which is excellent in adhesion between a molded product and a plating layer. A laminated body containing a plating layer formed on its surface of a molded product obtained by bulk polymerization of a cyclic olefin monomer in the presence of an inorganic filler by using a ruthenium catalyst. A method for producing a laminated body containing a plating layer formed on its surface, which comprises the steps of: the step of obtaining a molded product by bulk polymerization of a cyclic olefin monomer in the presence of an in organic filler by using a ruthenium catalyst; the step of etching the surface of the molded product with a permanganic acid compound; the step of applying a plating catalyst thereon; and the step of electroless plating the surface of the molded product.Type: ApplicationFiled: June 25, 2004Publication date: July 13, 2006Inventors: Junji Kodemura, Yutaka Katoh
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Publication number: 20060127655Abstract: An object of the invention is to provide a laminate which is good in adhesiveness between a substrate and a thin film laminated thereon by a dry film-forming method such as a chemical vapor growth method or a vacuum evaporation method even if the substrate is a polymer substrate made of a nonpolar polymer; and a process for producing the same. In order to attain the above-mentioned object, the invention provides a laminate comprising a polymer substrate, a primer layer comprising a cyclized rubber which is a conjugated diene polymer cyclized product or a derivative thereof, the layer being formed on the surface of the polymer substrate, and a thin film laminated on the surface of the primer layer by a dry film-forming method; and a process for producing the same.Type: ApplicationFiled: January 20, 2004Publication date: June 15, 2006Inventors: Shizuo Kitahara, Tetsuya Toyoshima, Kouichirou Maeda, Junji Kodemura, Yutaka Katoh
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Patent number: 6833180Abstract: An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.Type: GrantFiled: January 4, 2000Date of Patent: December 21, 2004Assignee: Nippon Zeon Company, Ltd.Inventor: Junji Kodemura
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Publication number: 20040157039Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 &mgr;m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.Type: ApplicationFiled: February 4, 2004Publication date: August 12, 2004Inventors: Yasuo Tsunogae, Yasuhiro Wakizaka, Junji Kodemura, Tohru Hosaka
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Patent number: 6713154Abstract: An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 &mgr;m in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.Type: GrantFiled: December 6, 1999Date of Patent: March 30, 2004Assignee: Nippon Zeon Co., Ltd.Inventors: Yasuo Tsunogae, Yasuhiro Wakizaka, Junji Kodemura, Tohru Hosaka
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Publication number: 20030181580Abstract: A graft polymer containing a cyclic structure comprised of a polymer containing a cyclic structure graft-modified with an unsaturated compound containing a polar group, having a graft ratio of 10 to 150 mol %, having a weight average molecular weight of 1,000 to 1,000,000, and having a gel content of not more than 0.1 wt % or having a ratio (Ha/La) of high molecular weight side area (Ha) and low molecular weight side area (La) divided by a vertical line suspended from a peak top of a differentiated elution profile measured by gel permeation chromatography to a baseline of not more than 1.6, a method of production of the same, and a curable composition containing that graft polymer containing a cyclic structure and a curing agent.Type: ApplicationFiled: May 30, 2003Publication date: September 25, 2003Inventors: Junji Kodemura, Kazuaki Kondo
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Patent number: 6492443Abstract: A norbornene resin composition comprising 100 parts by weight of a thermoplastic norbornene polymer and 1 to 150 parts by weight of a thermosetting resin.Type: GrantFiled: April 7, 1999Date of Patent: December 10, 2002Assignee: Nippon Zeon Co., Ltd.Inventors: Junji Kodemura, Yasuo Tsunogae, Yasuhiro Wakizaka
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Patent number: 6472082Abstract: A modified thermoplastic norbornene polymer obtained by graft-modifying a thermoplastic norbornene polymer selected from a ring-opening polymer of a norbornene monomer or a hydrogenated product thereof with at least one unsaturated compound selected from the group consisting of unsaturated epoxy compounds and unsaturated carboxylic compounds, and having a rate of graft modification of at least 10 mol % and a number average molecular weight (Mn) of 500 to 500,000, a production process thereof, and a crosslinking polymer composition comprising the modified thermoplastic norbornene polymer and a crosslinking agent.Type: GrantFiled: April 29, 1999Date of Patent: October 29, 2002Assignee: Nippon Zeon Co., Ltd.Inventor: Junji Kodemura