Patents by Inventor Junji Yokoyama

Junji Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070020474
    Abstract: The adhesive composition of the present invention has a gel fraction of 20-50%, which comprises an acrylic polymer obtained by polymerizing a monomer mixture containing the following component (a) as a main component and the following component (b) in a proportion of 5-49 wt %: component (a): an alkyl (meth)acrylate wherein the alkyl group has 4 to 12 carbon atoms, component (b): a carboxyl group-containing monomer having a carboxyl group and an ethylenic unsaturated double bond, which affords, when polymerized, a homopolymer having a glass transition temperature of not more than 70° C. Since the adhesive composition of the present invention is superior in all of the adhesion, impact resistance and repulsion resistance, it can adhere even to a part having a coated film formed on a surface to be adhered.
    Type: Application
    Filed: July 20, 2006
    Publication date: January 25, 2007
    Inventors: Yutaka Tosaki, Tsuyoshi Hiramatsu, Junji Yokoyama, Yoshikazu Soeda
  • Publication number: 20050163995
    Abstract: A pressure-sensitive adhesive tape contains a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, wherein the substrate contains colored layers containing a silver layer, a layer of a color other than silver and black, and a black layer which are superposed in this order.
    Type: Application
    Filed: January 25, 2005
    Publication date: July 28, 2005
    Inventors: Junji Yokoyama, Yoshikazu Soeda
  • Patent number: 6854783
    Abstract: The combination of a multi-layer instrument panel having a skin layer with an exposed surface and an opening therethrough and a first accessory that is mounted in the opening. The first accessory has an exposed surface that is substantially flush with the exposed surface of the skin layer with the first accessory mounted in the opening and operatively connected to the multi-layer instrument panel. The invention is also directed to a method of manufacturing the instrument panel with the first accessory.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: February 15, 2005
    Assignee: Mitsubishi Belting Ltd.
    Inventors: Sadao Teranishi, Kazuo Hirayama, Satoru Nitta, Masaaki Kobashi, Mano Osamu, Junji Yokoyama
  • Publication number: 20040121148
    Abstract: A pressure-sensitive adhesive tape contains a substrate and a pressure-sensitive adhesive layer disposed on at least one side of the substrate, wherein the substrate contains colored layers containing a white layer, a layer of a color other than white and black, and a black layer which are superposed in this order.
    Type: Application
    Filed: July 22, 2003
    Publication date: June 24, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiko Miyano, Junji Yokoyama, Yoshikazu Soeda
  • Publication number: 20010030070
    Abstract: The combination of a multi-layer instrument panel having a skin layer with an exposed surface and an opening therethrough and a first accessory that is mounted in the opening. The first accessory has an exposed surface that is substantially flush with the exposed surface of the skin layer with the first accessory mounted in the opening and operatively connected to the multi-layer instrument panel. The invention is also directed to a method of manufacturing the instrument panel with the first accessory.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 18, 2001
    Inventors: Sadao Teranishi, Kazuo Hirayama, Satoru Nitta, Masaaki Kobashi, Mano Osamu, Junji Yokoyama
  • Patent number: 4640700
    Abstract: A method for attaching a stud pin to a cathode ray tube panel is disclosed, which employs as a frit slurry to attach the stud pin to the cathode ray tube panel, a crystalizing solder glass, a binder and a solvent having a viscosity higher than 10 cps and a boiling point ranging from 200.degree. C. to 320.degree. C.
    Type: Grant
    Filed: July 3, 1985
    Date of Patent: February 3, 1987
    Assignee: Sony Corporation
    Inventors: Shinzo Takei, Junji Yokoyama, Makoto Takagi