Patents by Inventor Junshi Yoshioka

Junshi Yoshioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8715836
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: May 6, 2014
    Assignee: Mitsui Mining & Smelting Co., Ltd
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Patent number: 8419920
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: April 16, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20100089758
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Application
    Filed: October 2, 2007
    Publication date: April 15, 2010
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20090166213
    Abstract: An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used.
    Type: Application
    Filed: October 31, 2006
    Publication date: July 2, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Ayumu Tateoka, Hiroshi Hata, Satoshi Mogi, Takeo Taguchi, Junshi Yoshioka
  • Publication number: 20090047539
    Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.
    Type: Application
    Filed: March 9, 2007
    Publication date: February 19, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD
    Inventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
  • Patent number: 7217464
    Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: May 15, 2007
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Makoto Dobashi
  • Patent number: 6984453
    Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: January 10, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi
  • Publication number: 20040188263
    Abstract: The object is to provide carrier foil-incorporated copper foil which permits drilling by a carbon dioxide laser when on the surface of outer-layer copper foil of a copper-clad laminate there is no nickel assist metal layer or an organic material film to increase the absorption of laser light. For this purpose, there is used, for example, carrier foil-incorporated copper foil in which copper foil for printed wiring board manufacturing having a nodular-treated surface on the side of one surface of a bulk copper layer and carrier foil are laminated via an adhesive interface layer on a side opposite to the nodular-treated surface of the bulk copper layer, the bulk copper layer being formed from a high-carbon copper with a carbon content of 0.03 wt % to 0.40 wt %.
    Type: Application
    Filed: December 11, 2003
    Publication date: September 30, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi, Kenjirou Izutani, Youzo Itagaki, Osamu Nakano
  • Publication number: 20040170858
    Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200° C.
    Type: Application
    Filed: January 14, 2004
    Publication date: September 2, 2004
    Inventors: Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Makoto Dobashi
  • Publication number: 20040067377
    Abstract: An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil 1, which includes an adhesive interface layer 4 arranged on one face of the carrier foil 2 and an electrodeposited copper foil layer 3 arranged on the adhesive interface layer 4, characterized in that the adhesive interface layer 4 is composed of a metal oxide layer ML and an organic material layer OL, and the like are used.
    Type: Application
    Filed: August 11, 2003
    Publication date: April 8, 2004
    Inventors: Akiko Sugimoto, Junshi Yoshioka, Makoto Dobashi
  • Patent number: 6610418
    Abstract: The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: August 26, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Akiko Sugimoto, Makoto Dobashi, Ken-ichiro Iwakiri, Yutaka Hirasawa
  • Patent number: 6541126
    Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 1, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Akiko Sugimoto, Sakiko Taenaka, Makoto Dobashi, Tsutomu Higuchi, Takuya Yamamoto, Ken-ichiro Iwakiri
  • Patent number: 6270889
    Abstract: This invention provides a composite foil comprising an organic release layer between a metal carrier layer and an ultra-thin copper foil, and a process for producing such composite foils comprising the steps of depositing the organic release layer on the metal carrier layer and then forming an ultra-thin copper foil layer on said organic release layer by electrodeposition. The organic release layer preferably is a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, which provides a uniform bond strength which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate. The invention also includes laminates made from such composite foils and printed wiring boards made from such laminates.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: August 7, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Takashi Kataoka, Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Akiko Sugioka, Junshi Yoshioka
  • Patent number: 6183880
    Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.
    Type: Grant
    Filed: August 7, 1998
    Date of Patent: February 6, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Junshi Yoshioka, Shinichi Obata, Makoto Dobashi, Takashi Kataoka
  • Patent number: 6071629
    Abstract: An organic rust-roof treated copper foil characterized in that it has a metallic rust-proof layer formed on the non-adhesive side of the original copper foil and has an organic rust-proof layer formed on said metallic rust-proof layer, the organic rust-proof layer comprising a mixture of at least two kinds of chemicals selected from the group consisting of benzotriazole, its derivatives, aminotriazole and its isomers and derivatives is provided with on said metallic rust-proof layer, or it further has a chromate-treated layer formed between said metallic rust-proof layer and said organic rust-proof layer.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: June 6, 2000
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Toshiko Yokota, Makoto Dobashi, Hiroshi Hata, Hisao Sakai, Susumu Takahashi, Junshi Yoshioka