Patents by Inventor Jyunko HIRATA

Jyunko HIRATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11230788
    Abstract: Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D(S-P) represented by a formula (1) satisfying a relationship of D(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×104 to 30×104 or a number-average molecular weight of the polyamide-imide is 2×104 to 5×104.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji Hirano, Shintaro Iida, Jyunko Hirata, Hideaki Sakurai
  • Publication number: 20190032238
    Abstract: Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100° C. and D(S-P) represented by a formula (1) satisfying a relationship of D(S-P)<6, and a weight-average molecular weight of the polyamide-imide is 10×104 to 30×104 or a number-average molecular weight of the polyamide-imide is 2×104 to 5×104.
    Type: Application
    Filed: February 14, 2017
    Publication date: January 31, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji HIRANO, Shintaro IIDA, Jyunko HIRATA, Hideaki SAKURAI