Abstract: A non-volatile memory device includes a memory string, a select gate line coupled to the memory string, word lines coupled to the memory string and including a selected word line, and a control circuit coupled to the select gate line and the word lines, and configured to apply word line pre-pulse signals to at least two groups of the word lines disposed between the select gate line and the selected word line during a pre-charge period. The at least two groups of the word lines include a first group and a second group disposed between the first group and the select gate line. A voltage level of a second word line pre-pulse signal applied to the second group is greater than a voltage level of a first word line pre-pulse signal applied to the first group. A voltage level of at least one word line pre-pulse signal of the word line pre-pulse signals is greater than 0.

Abstract: A method for operating a memory device is disclosed. The memory device includes a first word line, a second word line, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first word line and the second word line. A first pass voltage is applied to the first dummy word line in a program operation. A second pass voltage is applied to the second dummy word line in the program operation. The first pass voltage is different from the second pass voltage.

Abstract: Systems, methods and media of optimization of temporary read errors (TRE) in three-dimensional (3D) NAND memory devices are disclosed. A disclosed memory device can comprises a plurality of memory cells arranged as an array of NAND memory strings, a plurality of word lines couple to the memory cells, and a controller. The controller is configured to determine whether a next read operation is a first read operation of the memory device after recovering from an idle state, and In response to a positive result of the determination, control the memory device to perform an extended pre-phase of the first read operation before a read-phase of the first read operation.

Abstract: A non-volatile memory device includes a plurality of word lines and a control circuit. The control circuit is configured to apply a first word line pre-pulse signal of a plurality of word line pre-pulse signals to a first group of the plurality of word lines, apply a second word line pre-pulse signal of the plurality of word line pre-pulse signals to a second group of the plurality of word lines during a pre-charge period, and apply a third word line pre-pulse signal of the plurality of word lines pre-pulse signals to a third group of the plurality of word lines during the pre-charge period. A voltage level of the second word line pre-pulse signal is greater than that of the first word line pre-pulse signal, and a voltage level of the third word line pre-pulse signal is greater than that of the second word line pre-pulse signal.

Abstract: A method for operating a memory is disclosed. The memory includes a first group of word lines, a second group of word lines, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first group of word lines and the second group of word lines. A first pass voltage is applied to the first dummy word line and applying a second pass voltage to the second dummy word line. A program voltage is applied to a selected word line, wherein a condition is met: a first voltage difference between the first pass voltage and a first threshold voltage of a first dummy cell corresponding to the first dummy word line is different from a second voltage difference between the second pass voltage and a second threshold voltage of a second dummy cell corresponding to the second dummy word line.

Abstract: A three-dimensional (3D) memory device includes a first set of word lines coupled to first memory cells, a second set of word lines coupled to second memory cells, an interface dummy word line between the first and send sets of word lines, and a peripheral circuit coupled to the first and send memory cells. The peripheral circuit is configured to apply a first voltage to the interface dummy word line in a first pre-charge period when programming a first selected memory cell in the first memory cells, and apply a second voltage lower than the first voltage to the interface dummy word line in a second pre-charge period when programming a second selected memory cell in the second memory cells. Programing the first selected memory cell is earlier than the second selected memory cell.

Abstract: A memory device includes memory cells in rows, word lines respectively coupled to the rows, and a control circuitry coupled to the memory cells via the word lines. The control circuitry is configured to apply a first program voltage to a first word line of the word lines. The first word line is coupled to a first row of the memory cells. The control circuitry is also configured to, after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the word lines. The second word line is coupled to a second row of the memory cells. The control circuitry is also configured to, after applying the second program voltage to the second word line, apply a first pre-charge voltage to the first word line and a second pre-charge voltage to the second word line. The second pre-charge voltage is greater than the first pre-charge voltage.

Abstract: In some aspects, a memory device is provided. The memory device includes a plurality of memory strings and a peripheral circuit. One of the memory strings includes memory cells, a select transistor coupled to a select line and a bit line, and a dummy cell coupled to a dummy word line and arranged between the select transistor and the memory cells. The peripheral circuit is coupled to the memory strings and configured to, in a pre-pulse period of a program operation, maintain a first voltage on the select line to retain an on-state of the select transistor and apply a second voltage to the dummy word line to turn off the dummy cell. After applying the second voltage to the dummy word line, the peripheral circuit is further configured to apply a third voltage to the select line to turn off the select transistor.

Abstract: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

Abstract: A memory device includes memory cells in rows, word lines respectively coupled to the rows, and a control circuitry coupled to the memory cells via the word lines. The control circuitry is configured to apply a first program voltage to a first word line of the word lines. The first word line is coupled to a first row of the memory cells. The control circuitry is also configured to, after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the word lines. The second word line is coupled to a second row of the memory cells. The control circuitry is also configured to, after applying the second program voltage to the second word line, apply a first pre-charge voltage to the first word line and a second pre-charge voltage to the second word line. The second pre-charge voltage is greater than the first pre-charge voltage.

Abstract: A method for operating a memory is disclosed. The memory includes a first group of word lines, a second group of word lines, a first dummy word line, and a second dummy word line. The first dummy word line and the second dummy word line are between the first group of word lines and the second group of word lines. A first pass voltage is applied to the first dummy word line and applying a second pass voltage to the second dummy word line. A program voltage is applied to a selected word line, wherein a condition is met: a first voltage difference between the first pass voltage and a first threshold voltage of a first dummy cell corresponding to the first dummy word line is different from a second voltage difference between the second pass voltage and a second threshold voltage of a second dummy cell corresponding to the second dummy word line.

Abstract: A memory device includes bit lines, and a cell array including strings, each of which includes memory cells, a select cell coupled to a respective one of the bit lines, and a dummy cell between the select cell and the memory cells. The memory device also includes a select line coupled to the select cells, a dummy word line coupled to the dummy cells, word lines each coupled to a respective row of the memory cells, and a controller coupled to the cell array. The controller is configured to drive a voltage on the dummy word line from a first level to a second level lower than the first level. The controller is also configured to drive a voltage on the select line from the first level to the second level, such that the voltage on the select line reaches the second level after the voltage on the dummy word line reaches the second level.

Abstract: A three-dimensional (3D) memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second sets of memory layers. The 3D memory device may further include a peripheral circuit that includes a word line (WL) driving circuit configured to when programming a first memory layer of the first set of memory layers, apply a first pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the first memory layer, and when programming a second memory layer of the first set of memory layers located above the first memory layer, apply a second pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the second memory layer. The first pre-charge voltage may be larger than the second pre-charge voltage.

Abstract: A memory includes an upper deck and a lower deck. The upper deck includes a first upper dummy word line. The lower deck includes a first lower dummy word line. A method for reducing program disturbance of the memory includes adjusting a first upper bias voltage applied to the first upper dummy word line and/or a first upper threshold voltage of the first upper dummy word line to adjust a first difference between the first upper bias voltage and the first upper threshold voltage; and adjusting a first lower bias voltage applied to the first lower dummy word line and/or a first lower threshold voltage of the first lower dummy word line to adjust a second difference between the first lower bias voltage and the first lower threshold voltage.

Abstract: A non-volatile memory device includes a plurality of word lines and a control circuit. The control circuit is configured to apply a first word line pre-pulse signal of a plurality of word line pre-pulse signals to a first group of the plurality of word lines, apply a second word line pre-pulse signal of the plurality of word line pre-pulse signals to a second group of the plurality of word lines during a pre-charge period, and apply a third word line pre-pulse signal of the plurality of word lines pre-pulse signals to a third group of the plurality of word lines during the pre-charge period. A voltage level of the second word line pre-pulse signal is greater than that of the first word line pre-pulse signal, and a voltage level of the third word line pre-pulse signal is greater than that of the second word line pre-pulse signal.

Abstract: A non-volatile memory device and a control method are provided e disclosed. The non-volatile memory device includes a memory array, a bit line, a plurality of word lines, a first control circuit, and second control circuit. The bit line is connected to a first memory string of the memory array. The plurality of word lines are connected to memory cells of the first memory string and each word line is connected to a respective memory cell. The first control circuit is configured to apply a bit line pre-pulse signal to the bit line during a pre-charge period. The second control circuit is configured to apply a word line signal to a selected word line and apply a plurality of word line pre-pulse signals to word lines disposed between a select gate line and the selected word line. Voltage levels of the plurality of word line pre-pulse signals are incremental.

Abstract: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

Abstract: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

Abstract: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

Abstract: A three-dimensional (3D) memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second sets of memory layers. The 3D memory device may further include a peripheral circuit that includes a word line (WL) driving circuit configured to when programming a first memory layer of the first set of memory layers, apply a first pre- charge voltage to the first dummy memory layer during a pre-charge period associated with the first memory layer, and when programming a second memory layer of the first set of memory layers located above the first memory layer, apply a second pre-charge voltage to the first dummy memory layer during a pre-charge period associated with the second memory layer. The first pre-charge voltage may be larger than the second pre-charge voltage.