Patents by Inventor Kamanio Chattopadhyay

Kamanio Chattopadhyay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180290244
    Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.
    Type: Application
    Filed: June 8, 2018
    Publication date: October 11, 2018
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Patent number: 9816159
    Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminum-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one eutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: November 14, 2017
    Assignee: INDIAN INSTITUTE OF SCIENCE
    Inventors: Chandrasekhar Tiwary, Sanjay Kashyap, Olu Emmanuel Femi, Dipankar Banerjee, Kamanio Chattopadhyay
  • Publication number: 20170304955
    Abstract: The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 26, 2017
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20170136583
    Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.
    Type: Application
    Filed: January 30, 2017
    Publication date: May 18, 2017
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20170037498
    Abstract: Embodiments herein present the invention of a class of Tungsten (W) free Cobalt based (?-??) superalloys with the basic chemical composition comprising in % by weight: 0.5 to 10 Aluminium (Al) and 1 to 15 Molybdenum (Mo) with at least one or both of 0.5 to 12 Niobium (Nb) and 0.5 to 12 Tantalum (Ta), with the remainder being Cobalt (Co). Some part of the cobalt can be replaced by nickel (50% or less). In Nickel added alloys, some part of either cobalt of nickel can be replaced by at least one among the transition metal selected from the group consisting of 10% or less Iridium, 10% or less Platinum, 10% or less Palladium, 15% or less Chromium and combination thereof.
    Type: Application
    Filed: March 21, 2015
    Publication date: February 9, 2017
    Applicant: Indian Institute of Science
    Inventors: Surendra Kumar MAKINENI, Nithin BALER, Kamanio CHATTOPADHYAY
  • Publication number: 20160214213
    Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.
    Type: Application
    Filed: December 28, 2015
    Publication date: July 28, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20160144462
    Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.
    Type: Application
    Filed: December 28, 2015
    Publication date: May 26, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20150292062
    Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminium-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one cutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.
    Type: Application
    Filed: June 4, 2012
    Publication date: October 15, 2015
    Applicant: Indian Institute of Science
    Inventors: Chandrasekhar Tiwary, Sanjay Kashyap, Olu Emmanuel Femi, Dipankar Banerjee, Kamanio Chattopadhyay
  • Publication number: 20140219711
    Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 7, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20140199115
    Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
    Type: Application
    Filed: August 2, 2012
    Publication date: July 17, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi