Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.

Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.

Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.

Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminum-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one eutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.

Abstract: The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.

Abstract: Embodiments herein present the invention of a class of Tungsten (W) free Cobalt based (?-??) superalloys with the basic chemical composition comprising in % by weight: 0.5 to 10 Aluminium (Al) and 1 to 15 Molybdenum (Mo) with at least one or both of 0.5 to 12 Niobium (Nb) and 0.5 to 12 Tantalum (Ta), with the remainder being Cobalt (Co). Some part of the cobalt can be replaced by nickel (50% or less). In Nickel added alloys, some part of either cobalt of nickel can be replaced by at least one among the transition metal selected from the group consisting of 10% or less Iridium, 10% or less Platinum, 10% or less Palladium, 15% or less Chromium and combination thereof.

Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.

Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.

Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminium-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one cutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.