Patents by Inventor Kambiz Vafai

Kambiz Vafai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942453
    Abstract: A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: March 26, 2024
    Assignee: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Andisheh Tavakoli, Mohammad Reza Salimpour
  • Publication number: 20240006269
    Abstract: A three-dimensional integrated circuit apparatus includes a three-dimensional integrated circuit including a group of integrated double-layer microchannels (DLMC) and multi-layer microchannels (MLMC) with optimized thermal performance for the three-dimensional integrated circuit.
    Type: Application
    Filed: June 26, 2023
    Publication date: January 4, 2024
    Inventors: Kambiz Vafai, Sainan Lu
  • Publication number: 20230395570
    Abstract: A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 7, 2023
    Inventors: Kambiz Vafai, Andisheh Tavakoli, Mohammad Reza Salimpour
  • Publication number: 20230282548
    Abstract: A three-dimensional integrated circuit device can include a group of die, a device layer and a thermal interface material formed above the substrate. A heat spreader can be located above the die, the device layer and the thermal interface material. The heat spreader can include a heat pipe comprising a rectangular-shaped heat pipe or disk-shaped heat pipe. A heat sink can be located above the heat spreader. The heat sink can include the heat pipe comprising the rectangular-shaped heat pipe or the disk-shaped heat pipe.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 7, 2023
    Inventors: Kambiz Vafai, Sainan Lu
  • Patent number: 11710723
    Abstract: A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: July 25, 2023
    Assignee: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Andisheh Tavakoli, Mohammad Reza Salimpour
  • Publication number: 20230047658
    Abstract: A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Inventors: Kambiz Vafai, Andisheh Tavakoli, Mohammad Reza Salimpour
  • Publication number: 20230048534
    Abstract: A 3D integrated circuit device can include a substrate, a thermal interface layer and at least one die, at least one device layer bonded between the thermal interface layer and the at least one die, wherein the thermal interface layer enhances conductive heat transfer between the at least one device layer and the at least one die, and a heat sink located adjacent to a heat spreader, wherein the thermal interface layer, the at least one die and the at least one device layer are located between the heat spreader and the substrate.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Inventors: Kambiz Vafai, Andisheh Tavakoli, Mohammad Reza Salimpour
  • Publication number: 20220370816
    Abstract: A method and system for noninvasively treating a neurodegenerative disorder, can involve determining characteristics indicative of physical attributes of a central nervous system, the characteristics including parameters for diminishing adverse impacts of a magnetothermal stimulation treatment for a neurodegenerative disorder with respect to the central nervous system, and applying as a part of the magnetothermal stimulation treatment and based on the characteristics of the physical attributes of the central nervous system, a magnetic field to the brain for a thermal stimulation of neuron cells within the brain.
    Type: Application
    Filed: June 6, 2021
    Publication date: November 24, 2022
    Inventors: Kambiz Vafai, Erfan Kosari
  • Publication number: 20220370817
    Abstract: A method and system for noninvasively treating a neurodegenerative disorder, can involve determining characteristics indicative of physical attributes of a central nervous system, the characteristics including parameters for diminishing adverse impacts of a magnetothermal stimulation treatment for a neurodegenerative disorder with respect to the central nervous system, and applying as a part of the magnetothermal stimulation treatment and based on the characteristics of the physical attributes of the central nervous system, a magnetic field to the brain for a thermal stimulation of neuron cells within the brain.
    Type: Application
    Filed: October 6, 2021
    Publication date: November 24, 2022
    Inventors: Kambiz Vafai, Erfan Kosari
  • Publication number: 20220276010
    Abstract: A heat exchanger apparatus and a method of operating the heat exchanger apparatus include a convergent interface separating two counterflows, and at least two concentric conduits including an inner conduit and an outer conduit, wherein the outer conduit comprises an outer conduit radius that is maintained as invariant, and the inner conduit comprises an inner conduit radius that is adjustable to form the convergent interface separating the two counterflows, wherein heat transfer with respect to the two counterflows occurs at the convergent interface.
    Type: Application
    Filed: February 23, 2022
    Publication date: September 1, 2022
    Inventors: Kambiz Vafai, Ahmed Al-Sammarraie
  • Patent number: 11147982
    Abstract: A method and system for noninvasively treating a neurodegenerative disorder, can involve determining characteristics indicative of physical attributes of a central nervous system, the characteristics including parameters for diminishing adverse impacts of a magnetothermal stimulation treatment for a neurodegenerative disorder with respect to the central nervous system, and applying as a part of the magnetothermal stimulation treatment and based on the characteristics of the physical attributes of the central nervous system, a magnetic field to the brain for a thermal stimulation of neuron cells within the brain.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: October 19, 2021
    Assignee: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Erfan Kosari
  • Patent number: 9170060
    Abstract: A system for thermal cycling a material to be thermal cycled including a microfluidic heat exchanger; a porous medium in the microfluidic heat exchanger; a microfluidic thermal cycling chamber containing the material to be thermal cycled, the microfluidic thermal cycling chamber operatively connected to the microfluidic heat exchanger; a working fluid at first temperature; a first system for transmitting the working fluid at first temperature to the microfluidic heat exchanger; a working fluid at a second temperature, a second system for transmitting the working fluid at second temperature to the microfluidic heat exchanger; a pump for flowing the working fluid at the first temperature from the first system to the microfluidic heat exchanger and through the porous medium; and flowing the working fluid at the second temperature from the second system to the heat exchanger and through the porous medium.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: October 27, 2015
    Assignees: Lawrence Livermore National Security, LLC, The Regents of the University of California
    Inventors: Neil Reginald Beer, Kambiz Vafai
  • Publication number: 20150010037
    Abstract: A method and system for analyzing variant thermal conditions at the porous-fluid interface under LTNE condition is disclosed. Exact solutions can be derived for both the fluid and solid temperature distributions for the most fundamental forms of thermal conditions at the interface between a porous medium and a fluid under LTNE conditions and the relationships between these solutions are obtained. The range of validity of all the models can be analyzed. Also, a critical non-dimensional half height of the porous media is determined, below which the LTE condition within porous region is considered to be valid. Furthermore, the range of validity of the LTE condition can be obtained based on the introduction of a critical parameter.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventors: Kambiz Vafai, Kun Yang
  • Patent number: 8814057
    Abstract: Devices comprising multi-compartment fluidic cell with multiple inlets. Compartments can be separated from one another using soft seals. The main cell can be located between two adjacent secondary cells. The main cell carries the main flow while the secondary cells can carry either the main flow or any auxiliary flows. The flow in the multi-compartment cells minimizes fluid leakage and causes reduced pressure difference between the main cell and the two secondary cells especially under similar flow conditions.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: August 26, 2014
    Assignee: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Abdul Rahim A. Khaled
  • Publication number: 20140180636
    Abstract: Methods and systems for analyzing the detection enhancement of rectangular microcantilevers with long-slit microsensors. The deflection profile of the microcantilevers can he compared with that of typical rectangular microcantilevers under presence of dynamic disturbances. Various force-loading conditions are considered. The theory of linear elasticity for thin beams is used to obtain the deflection related quantities. The disturbance in these quantities can be obtained based on wave propagation and beam vibration theories.
    Type: Application
    Filed: October 1, 2013
    Publication date: June 26, 2014
    Applicant: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Abdul Rahim A. Khaled
  • Patent number: 8714461
    Abstract: Devices utilized to enhance insulating properties at high temperatures. Such devices can include two gas compartments. A main gas compartment can function as a main layer and generally contains a layer of a gas (e.g., Xenon) having a relatively small thermal conductivity. The plates of the main gas layer can be separated by a soft seal, so that the main gas does not leak and the main layer expands easily. A second gas compartment can be configured as a vented compartment filled with air. At high temperatures, the main gas expands while the secondary gas volume shrinks. Since the main gas possesses a lower thermal conductivity, the effective resistance of the device increases, causing an enhancement in the insulating properties at large operating temperatures. A series of gas compartments can be utilized for additional enhancement in insulating properties.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: May 6, 2014
    Assignee: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Abdul-Rahim Assaad Khaled
  • Publication number: 20140120568
    Abstract: Low-density lipoprotein (LDL) transport while incorporating the thickening of the arterial wall and cholesterol lipid accumulation can be analyzed. A multi-layered model can be adopted to represent the heterogeneity using the Darcy-Brinkman and Staverman filtration equations to describe transport within the porous layers of the wall. The fiber matrix model can be utilized to represent the cholesterol lipid accumulation and the resulting variable properties. The impact of atherosclerotic wall thickening is shown to be negligible in the axial direction, but is found to be considerable in the radial direction within intima. The reference values of intima's porosity and effective fiber radius are obtained through the fiber matrix model, which characterizes the micro-structure within the intima.
    Type: Application
    Filed: October 22, 2013
    Publication date: May 1, 2014
    Applicant: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Stephen Chung
  • Publication number: 20140122038
    Abstract: A three-dimensional multilayer model of mechanical response for analyzing the effect of pressure on arterial failure. The three-dimensional effects are incorporated within five-concentric axisymmetric layers while incorporating the nonlinear elastic characteristics under combined extension and inflation. Constitutive equations for fiber-reinforced material are employed for layers such as intima, media, and adventitia, and an isotropic material model is employed for layers such as endothelium and internal elastic lamina. The three-dimensional five-layer model can be utilized to model propagated rupture area of the arterial wall. Required parameters for each layer are obtained by using nonlinear least square method fitted to in vivo non-invasive experimental data of human artery and the effects of pressure on arterial failure are examined.
    Type: Application
    Filed: October 21, 2013
    Publication date: May 1, 2014
    Inventors: Kambiz Vafai, Pannathai Khamdaengyodtai, Phrut Sakulchangsatjatai, Pradit Terdtoon
  • Publication number: 20140122036
    Abstract: Methods and systems for analyzing the effects of Fluid Solid Interactions (FSI) and pulsation on the transport of Low-Density Lipoprotein (LDL) through an elastic wall (e.g., an arterial wall). A comprehensive multi-layer model for both LDL transport as well as FSI can be analyzed and compared with existing results in limiting cases. The model takes into account the complete multi-layered LDL transport while incorporating FSI aspects to enable a comprehensive study of the deformation effect on the pertinent parameters of the transport processes within an artery. Since the flow inside an artery is time-dependent, the impact of pulsatile flow is also analyzed with and without FSI. The consequence of different factors on LDL transport in an artery is also analyzed.
    Type: Application
    Filed: October 8, 2013
    Publication date: May 1, 2014
    Applicant: Kambix Innovations, LLC
    Inventors: Kambiz Vafai, Stephen Chung
  • Publication number: 20140105241
    Abstract: A method and system for analyzing temperature gradient bifurcation in a porous medium by studying the convective heat transfer process within a channel filled with a porous medium with internal heat generation is disclosed. A LTNE model can be employed to represent the energy transport within a porous medium. Exact solutions can be derived for both fluid and solid temperature distributions for two primary approaches for the constant wall heat flux boundary condition. The Nusselt number for the fluid at the channel wall is also obtained. The effects of pertinent parameters such as fluid and solid internal heat generations, Biot number, and a fluid-to-solid effective thermal conductivity ratio can be determined. It can be shown that internal heat generation in a solid phase is significant for heat transfer characteristics.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 17, 2014
    Inventors: Kambiz Vafai, Kun Yang