Patents by Inventor Kanako ISHIHARA

Kanako ISHIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109985
    Abstract: A fluoropolymer of a monomer (I) represented by the general formula (I), wherein a content of a polymerization unit (I) derived from the monomer (I) is 50% by mass or more based on all polymerization units constituting the fluoropolymer: CX2?CX—O—Rf—SO3M??General formula (I) wherein X is independently F or CF3; Rf is a fluorine-containing alkylene group having 1 to 40 carbon atoms or a fluorine-containing alkylene group having 2 to 100 carbon atoms and having an ether bond or a keto group; and M is —H, a metal atom, —NR74, imidazolium optionally having a substituent, pyridinium optionally having a substituent, or phosphonium optionally having a substituent, wherein R7 is H or an organic group. Also disclosed are an aqueous solution and coating composition containing the fluoropolymer.
    Type: Application
    Filed: November 17, 2023
    Publication date: April 4, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Masahiro HIGASHI, Kanako NAKANISHI, Sumi ISHIHARA, Moe HOSOKAWA, Kensuke YAMATO, Kazuki KANEKO, Yosuke KISHIKAWA
  • Patent number: 10968329
    Abstract: A method of recovering a decomposition product of a thermosetting resin cured product, the method includes a step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal compound and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product; a step of mixing the treatment liquid, in which a decomposition product of the thermosetting resin cured product is dissolved, and an acidic aqueous solution to separate the mixture into an aqueous layer and an organic layer containing the decomposition product; and a step of recovering the organic layer.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: April 6, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kanako Ishihara, Kazuhito Kobayashi
  • Publication number: 20190023868
    Abstract: A method of treating a thermosetting resin cured product, the method includes a treatment step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal hydroxide and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product, in which moisture in the treatment liquid is removed during at least a part of a period of time from after preparation of the treatment liquid to completion of the treatment step.
    Type: Application
    Filed: March 8, 2016
    Publication date: January 24, 2019
    Inventors: Shunsuke UEDA, Kanako ISHIHARA, Keiichi KASUGA, Ken ORIE, Kazuhito KOBAYASHI
  • Publication number: 20180371203
    Abstract: A method of recovering a decomposition product of a thermosetting resin cured product, the method includes a step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal compound and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product; a step of mixing the treatment liquid, in which a decomposition product of the thermosetting resin cured product is dissolved, and an acidic aqueous solution to separate the mixture into an aqueous layer and an organic layer containing the decomposition product; and a step of recovering the organic layer.
    Type: Application
    Filed: March 8, 2016
    Publication date: December 27, 2018
    Inventors: Kanako ISHIHARA, Kazuhito KOBAYASHI