Abstract: A memory device in an integrated circuit is provided, including an input/output (I/O) circuit, a first memory segment and a second memory segment that separated from the first memory segment in a first direction, a first pair of data lines on a first side of the integrated circuit, extending in the first direction and configured to couple the first memory segment to the I/O circuit, and a second pair of data lines separated from the first pair of data lines in a second direction, different from the first direction, on a second side, opposite to the first side, of the integrated circuit, and configured to couple the second memory segment to the I/O circuit. A first width of the first pair of data lines is different from a second width of the second pair of data lines.

Abstract: A memory circuit includes an array including a plurality of memory cells arranged across a plurality of columns and a plurality of voltage control circuits, each of the plurality of voltage control circuits operatively coupled to the memory cells of a corresponding one of the plurality of columns. Each of the plurality of voltage control circuits includes a first portion configured to provide a first voltage drop in coupling a supply voltage to the memory cells of the corresponding column and a second portion configured to provide a second voltage drop in coupling the supply voltage to the memory cells of the corresponding column. The first voltage drop is substantially smaller than the second voltage drop.

Abstract: The present disclosure provides an electronic circuit, a memory device, and a method for operating an electronic circuit. An electronic circuit comprises a driver circuit configured to provide a drive voltage to a word line of the electronic circuit, a suppression circuit electrically connected to the driver circuit and the word line, and a control circuit electrically connected to the suppression circuit. The suppression circuit is configured to generate a voltage drop in the drive voltage. The control circuit controls the suppression circuit.

Abstract: A memory device is provided which includes a first memory cell including a first transistor and a second transistor coupled to the first transistor in parallel. Gates of the first transistor and the second transistor are coupled to each other, and the gates of the first transistor and the second transistor pass different layers and overlap with each other. Types of the first transistor and the second transistor are the same.

Abstract: A method includes forming a first bottom-tier transistor; forming a second bottom-tier transistor, the first and second bottom-tier transistors sharing a same source/drain region; forming a first top-tier transistor over the first bottom-tier transistor, the first top-tier transistor comprising a first channel layer and a first gate structure around the first channel layer; forming a second top-tier transistor over the second bottom-tier transistor, the second top-tier transistor comprising a second channel layer and a second gate structure around the second channel layer, the first and second top-tier transistors sharing a same source/drain region, wherein from a top view, a first dimension of the first channel layer in a lengthwise direction of the first gate structure is different than a second dimension of the second channel layer in the lengthwise direction of the first gate structure.

Abstract: A memory device in an integrated circuit is provided, including an input/output (I/O) circuit, a first memory segment and a second memory segment that separated from the first memory segment in a first direction, a first pair of data lines on a first side of the integrated circuit, extending in the first direction and configured to couple the first memory segment to the I/O circuit, and a second pair of data lines separated from the first pair of data lines in a second direction, different from the first direction, on a second side, opposite to the first side, of the integrated circuit, and configured to couple the second memory segment to the I/O circuit. A first width of the first pair of data lines is different from a second width of the second pair of data lines.

Abstract: A static random access memory includes a first and second memory cell array, a first word line, a bit line, a bit line bar, a primary driver circuit, and a first and second supplementary driver circuit. The first supplementary driver circuit is configured to pull a voltage of a first signal of the bit line or a second signal of the bit line bar to a first voltage level during a write operation in response to a supplementary driver circuit enable signal. The second supplementary driver circuit is configured to sense the voltage of the first or second signal. The second supplementary driver circuit includes a first pass-gate transistor. A first terminal of the first pass-gate transistor is coupled to a reference voltage supply. A second terminal of the first pass-gate transistor is electrically floating. A third terminal of the first pass-gate transistor is coupled to a first node.

Abstract: A memory device is provided. The memory device comprises a memory cell, a first power rail and a suppressing circuit. The memory cell is coupled to a word line. The first power rail transmits a first supply voltage. The suppressing circuit comprises a first transistor and a second transistor. The first transistor is diode-connected, coupled to the word line, and disposed at a first layer. The second transistor is diode-connected coupled between the first transistor and the first power rail, and disposed at a second layer under the first layer. The first transistor and the second transistor overlap with each other in a layout view.

Abstract: A semiconductor device includes a substrate; and a cell region having opposite first and second sides, the cell region including active regions formed in the substrate; relative to an imaginary first reference line, a first majority of the active regions having first ends which align with the first reference line, the first side being parallel and proximal to the first reference line; relative to an imaginary second reference line in the second direction, a second majority of the active regions having second ends which align with the second reference line, the second side being parallel and proximal to the second reference line; and gate structures correspondingly on first and second ones of the active regions; and relative to the second direction, a first end of a selected one of the gate structures abuts an intervening region between the first and second active regions.

Abstract: The first semiconductor layer and the second semiconductor layer are above the first semiconductor layer, in which the first and second semiconductor layers are vertically spaced apart from each other. The first and second source/drain epitaxial features are respectively on first and second sides of the first semiconductor layer. The third and fourth source/drain epitaxial features are respectively on first and second sides of the second semiconductor layer and above the first source/drain epitaxial feature. The first, third, and fourth source/drain epitaxial features have a first conductive type, and the second source/drain epitaxial feature has a second conductive type opposite to the first conductive type.

Abstract: A semiconductor device includes a memory array comprising a plurality of transistors arranged over a plurality of rows and a plurality of columns. The plurality of rows correspond to a plurality of active regions that continuously extend along a first lateral direction, respectively, and the plurality of columns correspond to a plurality of gate structures that discontinuously extend along a second lateral direction, respectively, the first lateral direction and the second lateral direction being perpendicular to each other. A first one of the gate structures comprising a first gap cutting the first gate structure and a second one of the gate structures comprising a second gap cutting the second gate structure are disposed immediately next to each other along the first lateral direction. The first gap and an extension of the second gap are offset from each other along the second lateral direction.

Abstract: An integrated circuit (IC) device includes a plurality of memory segments. Each memory segment includes a plurality of memory cells, and a local bit line electrically coupled to the plurality of memory cells and arranged on a first side of the IC device. The IC device further includes a global bit line electrically coupled to the plurality of memory segments, and arranged on a second side of the IC device. The second side is opposite the first side in a thickness direction of the IC device.

Abstract: A memory cell array includes a first bank of memory cells, a second bank of memory cells adjacent to the first bank of memory cells, a first set of bit lines and a second set of bit lines. The first set of bit lines extend in a first direction, is coupled to the first bank of memory cells, and is on at least a first metal layer above a front-side of a substrate. The second set of bit lines extend in the first direction, is coupled to the second bank of memory cells, and is on at least a second metal layer below a back-side of the substrate opposite from the front-side of the substrate.

Abstract: A static random access memory (SRAM) includes: first and second CFET stacks, each of which includes a first active region (AR), e.g., N-type, stacked in a first direction on a second AR (e.g., P-type), each CFET stack representing a complementary FET (CFET) architecture; an upper half of a third CFET stack; a lower half of a fourth CFET stack; the first and second CFET stacks including FETs that comprise a latch of the SRAM; the first CFET stack further including FETs that comprise first and third ports of the SRAM; the second CFET stack further including FETs that comprise second and fourth ports of the SRAM; the lower half of the fourth CFET stack including FETs that comprise a fifth port of the SRAM; and the upper half of the third CFET stack including FETs that comprise a sixth port of the SRAM.

Abstract: A dual-port memory cell includes a first, second, third, and fourth pass-gate transistor, and a first and a second word line. The first pass-gate transistor includes a first gate on a first level. The second pass-gate transistor includes a second gate on a second level below the first level. The third pass-gate transistor includes a third gate on the first level. The fourth pass-gate transistor includes a fourth gate on the second level. The first word line is on a first metal layer above a front-side of a substrate, and is coupled to the first and third pass-gate transistors that correspond to a first port of the dual-port memory cell. The second word line is on a second metal layer below a back-side of the substrate, and is coupled to the second and fourth pass-gate transistors that correspond to a second port of the dual-port memory cell.

Abstract: A memory cell includes a first, second, third, and fourth transistor, a first and a second inverter, and a first and second word line. The first inverter is coupled to the first and third transistor. The second inverter is coupled to the first inverter and the first and third transistor. The first word line is configured to supply a first word line signal, is on a first metal layer above a front-side of a substrate, and is coupled to the first and third transistor. The second word line is configured to supply a second word line signal, and is on a second metal layer below a back-side of the substrate opposite from the front-side of the substrate, and is coupled to the second and fourth transistor. At least the first, second, third or fourth transistor are on the front-side of the substrate.

Abstract: Semiconductor devices including a first upper channel structure, a first intermediate structure below the first upper channel structure, a first lower channel structure below the first intermediate structure, and a voltage source connected to the first lower channel structure, in which the first upper channel structure, the first intermediate structure, and the first lower channel structure comprise a first vertical assembly that provides an electrical connection between the voltage source and the first upper channel structure.

Abstract: A memory macro includes an input/output (I/O) circuit positioned in a semiconductor wafer, a column of memory cells including first and second subsets of contiguous memory cells extending away from the I/O circuit in the semiconductor wafer, wherein the first subset is positioned between the I/O circuit and the second subset, a first bit line coupled to the I/O circuit and extending on one of a frontside or a backside of the semiconductor wafer along the first subset and terminating at the second subset, and a second bit line coupled to the I/O circuit and extending on the other of the frontside or the backside along the first and second subsets. Each memory cell of the first subset is electrically connected to the first bit line, and each memory cell of the second subset is electrically connected to the second bit line.

Abstract: An integrated circuit (IC) device includes a memory array including a plurality of memory cells, a first word line over the memory array and electrically coupled to at least one first memory cell among the plurality of memory cells, and a second word line under the memory array and electrically coupled to at least one second memory cell among the plurality of memory cells. Each memory cell among the plurality of memory cells includes complementary field-effect transistor (CFET) devices.

Abstract: A device includes a first power rail for a first power domain and a second power rail for a second power domain. A first circuit block is connected to the first power rail and a second circuit block is connected to the second power rail. The first and second circuit blocks are both connected to a virtual VSS terminal. A footer circuit is connected between the virtual VSS terminal and a ground terminal, and the footer circuit is configured to selectively control a connection between the virtual VSS terminal and the ground terminal.