Patents by Inventor Kaoru Iwato

Kaoru Iwato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120003591
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 5, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Yuichiro ENOMOTO, Shinji TARUTANI, Sou KAMIMURA, Kaoru IWATO, Keita KATO, Kana FUJII
  • Publication number: 20110318687
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin which contains (c) a repeating unit having at least one polarity conversion group and has at least either a fluorine atom or a silicon atom.
    Type: Application
    Filed: December 11, 2009
    Publication date: December 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroshi Saegusa, Kaoru Iwato, Shuji Hirano, Yusuke Iizuka
  • Publication number: 20110236828
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, includes: (A) a resin capable of increasing the solubility of the resin (A) in an alkali developer by the action of an acid; and (C) a resin having at least either a fluorine atom or a silicon atom and containing (c) a repeating unit having at least two or more polarity conversion groups.
    Type: Application
    Filed: December 11, 2009
    Publication date: September 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji Hirano, Kaoru Iwato, Hiroshi Saegusa, Yusuke Iizuka
  • Publication number: 20110091809
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes (A) a resin that when acted on by an acid, increases its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, and (C) a resin containing at least one group selected from among the following groups (x) to (z) and further containing at least either a fluorine atom or a silicon atom, in which three or more polymer chains are contained through at least one branch point, (x) an alkali-soluble group, (y) a group that when acted on by an alkali developer, is decomposed to thereby increase its solubility in the alkali developer, and (z) a group that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.
    Type: Application
    Filed: October 15, 2010
    Publication date: April 21, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Hiroshi Saegusa, Kaoru Iwato, Yusuke Iizuka, Kousuke Koshijima
  • Patent number: 7887988
    Abstract: A resist composition, which comprises: (A) a resin containing a repeating unit represented by formula (I); and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: wherein AR represents a benzene ring or a naphthalene ring; R represents a hydrogen atom, an alkyl group, a cycloalkyl group or an aryl group; Z represents a linking group for forming a ring together with AR; and A represents an atom or group selected from the group consisting of a hydrogen atom, an alkyl group, a halogen atom, a cyano group and an alkyloxycarbonyl group, and a pattern forming method using the resist composition.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: February 15, 2011
    Assignee: FUJIFILM Corporation
    Inventors: Kazuyoshi Mizutani, Kaoru Iwato, Kunihiko Kodama, Masaomi Makino
  • Publication number: 20100248136
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition comprises a hydrophobic resin (HR) containing a fluorine atom, wherein the hydrophobic resin (HR) comprises any of repeating units (a) of general formula (I) or (II) below:
    Type: Application
    Filed: March 30, 2010
    Publication date: September 30, 2010
    Applicant: FUJIFILM Corporation
    Inventors: Shinichi SUGIYAMA, Shinji Tarutani, Takayuki Kato, Kaoru Iwato, Hiroshi Saegusa
  • Publication number: 20100152400
    Abstract: A polymerizable compound having a lactone structure represented by formula (1) is provided: wherein A represents a polymerizable site; R2 represents a single bond or an alkylene group; R3 represents a hydrocarbon group in which hydrogen atoms are substituted with a fluorine atom; R4 represents a halogen atom, a cyano group, a hydroxy group, an amide group, an alkyl group, a cycloalkyl group, an alkoxy group, a phenyl group, an acyl group, an alkoxycarbonyl group, or a group represented by R—C(?O)— or R—C(?O)O—, wherein R represents an alkyl group or a cycloalkyl group; X represents an alkylene group, an oxygen atom or a sulfur atom; Z represents a single bond, an ether bond, an ester bond, an amide bond, a urethane bond or a urea bond; n represents an integer of from 0 to 5; and m represents an integer of from 0 to 7.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 17, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke IIZUKA, Kaoru IWATO, Hiroshi SAEGUSA, Shuji HIRANO
  • Publication number: 20100152401
    Abstract: Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 17, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji HIRANO, Kaoru IWATO, Hiroshi SAEGUSA, Yusuke IIZUKA
  • Patent number: 7700261
    Abstract: A positive photosensitive composition comprises: (A) a compound that generates an acid upon irradiation with actinic ray or radiation; and (B) a resin that increases its solubility in an alkali developer by action of an acid, wherein the resin (B) has a repeating unit that has an acid-decomposable group and is represented by formula (I): wherein Xa1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom; Ry1 and Ry2 each independently represents an alkyl group or a cycloalkyl group; Rx represents an alkyl group having 2 or more carbon atoms, or a cycloalkyl group; and Z represents an alkylene group.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: April 20, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Kunihiko Kodama, Kaoru Iwato, Hideaki Tsubaki, Norihiko Taguchi
  • Patent number: 7687219
    Abstract: A positive resist composition comprises: (A) a resin that contains a repeating unit (A1) having a lactone structure and a cyano group, and increases its solubility to an alkali developer by action of an acid; (B) a compound that generates an acid by irradiation with actinic ray or radiation; and (C) a solvent.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: March 30, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Kunihiko Kodama
  • Publication number: 20100028804
    Abstract: A resist composition comprises two or more polymers containing a first polymer and a second polymer and a compound that when exposed to actinic rays or radiation, generates an acid, wherein when the resist composition is formed into a dry resist film, the mixing ratios of at least the first and second polymers in the resist film exhibit a gradient distribution such that the mixing ratios continuously change in entirety or partially in the direction of the depth from the surface of the resist film on the air side toward a support, and wherein the mixing ratio of the first polymer at a superior portion of the resist film is higher than that of the second polymer, while the mixing ratio of the second polymer at an inferior portion of the resist film is higher than that of the first polymer.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 4, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Kaoru IWATO, Kazuto Kunita
  • Patent number: 7632623
    Abstract: A positive resist composition comprising: a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group, a repeating unit containing a first group selected from groups represented by the formulae (pI) to (pV) as defined herein and a repeating unit containing a second group selected from groups represented by the formulae (pI) to (pV) as defined herein which is different from the first group; a compound which generates an acid upon irradiation of an actinic ray or a radiation; and a solvent.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: December 15, 2009
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Kunihiko Kodama, Yuko Yoshida, Kei Yamamoto
  • Patent number: 7625690
    Abstract: A resist composition, which comprises: (A) a resin containing a repeating unit represented by formula (I); and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: wherein AR represents an aryl group; Rn represents an alkyl group, a cycloalkyl group or an aryl group; and A represents an atom or group selected from the group consisting of a hydrogen atom, an alkyl group, a halogen atom, a cyano group and an alkyloxycarbonyl group, and a pattern forming method using the resist composition.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: December 1, 2009
    Assignee: FUJIFILM Corporation
    Inventors: Kazuyoshi Mizutani, Kaoru Iwato, Kunihiko Kodama, Masaomi Makino, Toru Tsuchihashi
  • Publication number: 20090221779
    Abstract: A film forming composition is provided that includes a compound represented by Formula (1) below and/or a polymer polymerized using at least a compound represented by Formula (1) below (in Formula (1), each A1 independently denotes a single bond, —CO—, —NR—, —O—, —SO2—, —CH?CH—, —C?C—, or a group in which two or more of the above are combined, A2 and A4 independently denote a monovalent organic group having 1 to 10 carbons, each A3 independently denotes a hydrogen atom or a monovalent organic group having 1 to 10 carbons but excluding a phenyl group, X denotes a tetravalent organic group having 1 to 9 carbons, R denotes a hydrogen atom or an alkyl group having 1 to 10 carbons, each m independently denotes an integer of 1 to 5, each n independently denotes an integer of 1 or more, each p independently denotes an integer of 0 to 4, and each q independently denotes an integer of 0 to 4). There are also provided a film obtained using the film forming composition and an electronic device having the film.
    Type: Application
    Filed: February 25, 2009
    Publication date: September 3, 2009
    Applicant: FUJIFILM Corporation
    Inventors: Youhei Kubo, Haruki Inabe, Kaoru Iwato, Katsuyuki Watanabe
  • Publication number: 20090081581
    Abstract: A positive photosensitive composition comprises: (A) a compound that generates an acid upon irradiation with actinic ray or radiation; and (B) a resin that increases its solubility in an alkali developer by action of an acid, wherein the resin (B) has a repeating unit that has an acid-decomposable group and is represented by formula (I): wherein Xa1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom; Ry1 and Ry2 each independently represents an alkyl group or a cycloalkyl group; Rx represents an alkyl group having 2 or more carbon atoms, or a cycloalkyl group; and Z represents an alkylene group.
    Type: Application
    Filed: March 26, 2008
    Publication date: March 26, 2009
    Applicant: FUJIFILM CORPORATION
    Inventors: Kunihiko Kodama, Kaoru Iwato, Hideaki Tsubaki, Norihiko Taguchi
  • Publication number: 20090075202
    Abstract: A compound which generates a sulfonic acid having one or more —SO3H groups and one or more —SO2— bonds upon irradiation with an actinic ray or a radiation; a photosensitive composition containing the compound; and a method of pattern formation with the photosensitive composition.
    Type: Application
    Filed: August 13, 2008
    Publication date: March 19, 2009
    Applicant: FUJIFILM Corporation
    Inventors: Kunihiko KODAMA, Kenji Wada, Kaoru Iwato
  • Publication number: 20090048421
    Abstract: A film forming composition is provided that includes a compound represented by Formula (1) below and/or a polymer polymerized using at least a compound represented by Formula (1) below (in Formula (1), A1 denotes a 2- to 4-valent organic group, A2 denotes an alkenyl group or an alkynyl group, Ar1 denotes a (2+a1)-valent aryl group, R1 denotes a hydrogen atom or an alkyl group having 1 to 30 carbons, a1 denotes an integer of 1 to 4, and a2 denotes an integer of 2 to 4). There is also provided a film forming composition comprising a compound represented by Formula (2) below and/or a polymer polymerized using at least a compound represented by Formula (2) below (in Formula (2), A3 denotes a 4- or 6-valent organic group, A4 denotes an alkenyl group or an alkynyl group, Ar2 denotes an (a3+1)-valent aryl group, R2 denotes a hydrogen atom or an alkyl group having 1 to 30 carbons, a3 denotes an integer of 1 to 5, and a4 denotes 2 or 3).
    Type: Application
    Filed: July 11, 2008
    Publication date: February 19, 2009
    Applicant: FUJIFILM Corporation
    Inventors: Youhei Kubo, Kaoru Iwato, Haruki Inabe
  • Patent number: 7449573
    Abstract: A compound which generates a sulfonic acid having one or more —SO3H groups and one or more —SO2— bonds upon irradiation with an actinic ray or a radiation; a photosensitive composition containing the compound; and a method of pattern formation with the photosensitive composition.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: November 11, 2008
    Assignee: FUJIFILM Corporation
    Inventors: Kunihiko Kodama, Kenji Wada, Kaoru Iwato
  • Patent number: 7442490
    Abstract: A positive resist composition comprising: a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group and a repeating unit containing a first acid-decomposable group; a resin which increases solubility in an alkali developing solution by an action of an acid and comprises a repeating unit containing a lactone structure and a cyano group and a repeating unit containing a second acid-decomposable group which is different from the first acid-decomposable group; a compound which generates an acid upon irradiation of an actinic ray or a radiation; and a solvent.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: October 28, 2008
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Kunihiko Kodama
  • Publication number: 20080161532
    Abstract: A composition for forming a low-dielectric-constant film includes a compound represented by the following formula (A): wherein each of Ar1 and Ar2 independently represents an aryl group that may have a substituent.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 3, 2008
    Applicant: FUJIFILM CORPORATION
    Inventor: Kaoru IWATO