Abstract: A gas sensor that includes a heat source and a gas sensing film. The gas sensing film includes a polycrystalline tungsten trioxide film thermally connected to the heat source and a plurality of islands of gold on a surface of the polycrystalline tungsten trioxide film. The surface of the polycrystalline tungsten trioxide film is exposed between the islands of gold to allow the polycrystalline tungsten trioxide film to sense gas. A first electrode that electrically connected to the polycrystalline tungsten trioxide film and a second electrode is electrically connected to the polycrystalline tungsten trioxide film. The resistance of the polycrystalline tungsten trioxide film between the first electrode and the second electrode changes when the polycrystalline tungsten trioxide film is exposed to a particular type of gas.

Abstract: A gas sensor that includes a heat source and a gas sensing film. The gas sensing film includes a polycrystalline tungsten trioxide film thermally connected to the heat source and a plurality of islands of gold on a surface of the polycrystalline tungsten trioxide film. The surface of the polycrystalline tungsten trioxide film is exposed between the islands of gold to allow the polycrystalline tungsten trioxide film to sense gas. A first electrode that electrically connected to the polycrystalline tungsten trioxide film and a second electrode is electrically connected to the polycrystalline tungsten trioxide film. The resistance of the polycrystalline tungsten trioxide film between the first electrode and the second electrode changes when the polycrystalline tungsten trioxide film is exposed to a particular type of gas.

Abstract: Thermal conductivity detectors and methods of operating thermal conductivity detectors are described herein. One or more device embodiments include a single fluidic channel, wherein the single fluidic channel includes a single inlet and a single outlet, and multiple sensors configured to determine one or more properties associated with a thermal conductivity of a fluid in the single fluidic channel.

Abstract: Devices, methods, and systems for wafer bonding are described herein. One or more embodiments include forming a bond between a first wafer and a second wafer using a first material adjacent the first wafer and a second material adjacent the second wafer. The first material includes a layer of gold (Au) and a layer of indium (In), and the second material includes a layer of Au. Forming the bond between the first wafer and the second wafer includes combining the layer of Au in the first material, the layer of In in the first material, and a portion of the layer of Au in the second material, wherein an additional portion of the layer of Au in the second material is not combined with the layer of Au in the first material and the layer of In in the first material.

Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.

Abstract: A fuel cell, fuel cell array and methods of forming the same are disclosed. The fuel cell can be made by forming a first aperture defined by a first aperture surface through a first electrode layer and forming a second aperture defined by a second aperture surface through a second electrode layer. A proton exchange membrane is laminated between the first electrode layer and the second electrode layer. At least a portion of the first aperture is at least partially aligned with the second aperture.

Abstract: Thermal conductivity detectors and methods of operating thermal conductivity detectors are described herein. One or more device embodiments include a single fluidic channel, wherein the single fluidic channel includes a single inlet and a single outlet, and multiple sensors configured to determine one or more properties associated with a thermal conductivity of a fluid in the single fluidic channel.

Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.

Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.

Abstract: Embodiments of the present invention relate to detector structures for use in a micro gas analyzer, preferably in a differential setup. The detector structures may comprise one or more detector types, such as photo-ionization (PID), electron capture (ECD), ion mobility (IMS), differential mobility (DMS), ion-trap mass spectrometer (ITMS), in which all are provided with ions and electrons from one vacuum ultra violet (VUV) source. This source may also provide ions for ion-based gas pumps.

Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.

Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.