Patents by Inventor Karl Boggs
Karl Boggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170096624Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: ApplicationFiled: December 19, 2016Publication date: April 6, 2017Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prema Sonthalia, Emanuel Cooper, Karl Boggs
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Patent number: 9528078Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: GrantFiled: March 25, 2014Date of Patent: December 27, 2016Assignee: Advanced Technology Materials, Inc.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
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Patent number: 9522773Abstract: The present disclosure relates to a blow-molded, rigid collapsible liner that can be suitable particularly for smaller storage and dispensing systems. The rigid collapsible liner may be a stand-alone liner, e.g., used without an outer container, and may be dispensed from a fixed pressure dispensing can. Folds in the rigid collapsible liner may be substantially eliminated, thereby substantially reducing or eliminating the problems associated with pinholes, weld tears, and overflow. The present disclosure also relates to flexible gusseted or non-gusseted liners, which is scalable in size and may be used for storage of up to 200 L or more. The flexible gusseted liner may be foldable, such that the liner can be introduced into a dispensing can. The liner can be made of thicker materials, substantially reducing or eliminating the problems associated pinholes, and may include more robust welds, substantially reducing or eliminating the problems associated weld tears.Type: GrantFiled: July 9, 2010Date of Patent: December 20, 2016Assignee: Entegris, Inc.Inventors: Glenn Tom, Thomas H. Baum, Matthew Kusz, Joseph Menning, Greg Nelson, Dongyun Lee, Wei Liu, Kanghyun Kim, Karl Boggs, Richard Chism
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Publication number: 20160159519Abstract: A pressure dispense method and system for reducing the presence of folds for a liquid-filled liner within an overpack while reducing the loads and stresses on the liquid-filled liner. The flexible liner is of a conformal size and shape to the interior space of the overpack so that the flexible liner does not pull downward and away from the interior surface of the overpack when the flexible liner is filled with a liquid. The flexible liner also configured to eliminate folding in upon itself when the liner is filled with a liquid within the overpack.Type: ApplicationFiled: December 4, 2015Publication date: June 9, 2016Inventors: Richard D. Chism, Amy Koland, Wei Liu, John Davis, Glenn Tom, Matthew Kusz, Karl Boggs
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Patent number: 9132412Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.Type: GrantFiled: September 24, 2013Date of Patent: September 15, 2015Assignee: ENTEGRIS, INC.Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun M. Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
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Publication number: 20140206588Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: ApplicationFiled: March 25, 2014Publication date: July 24, 2014Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
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Patent number: 8685909Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: GrantFiled: March 23, 2009Date of Patent: April 1, 2014Assignee: Advanced Technology Materials, Inc.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
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Publication number: 20140034671Abstract: A liner having a tubular body portion with a top circumferential edge and a bottom circumferential edge, a generally circular bottom portion sealed to the tubular body portion along the bottom circumferential edge, and a generally circular top portion sealed to the tubular body portion along the top circumferential edge. The top portion may include a fitment sealed thereto. The tubular body portion may include at least one weld seam extending from the top circumferential edge to the bottom circumferential edge. In a particular embodiment, the tubular body portion may include two sheets welded together to form a tubular body, the tubular body portion thus having two weld seams extending from the top circumferential edge to the bottom circumferential edge.Type: ApplicationFiled: December 9, 2011Publication date: February 6, 2014Applicant: ADVANCED TECHNOLOGY MATERIALS, INCInventors: Richard Chism, Amy Koland, Wei Liu, John Davis, Glenn Tom, Matt Kusz, Karl Boggs
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Publication number: 20140020419Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.Type: ApplicationFiled: September 24, 2013Publication date: January 23, 2014Applicant: Advanced Technology Materials, Inc.Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun M. Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney
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Patent number: 8539781Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.Type: GrantFiled: June 22, 2008Date of Patent: September 24, 2013Assignee: Advanced Technology Materials, Inc.Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
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Publication number: 20120267388Abstract: The present disclosure relates to a blow-molded, rigid collapsible liner that can be suitable particularly for smaller storage and dispensing systems. The rigid collapsible liner may be a stand-alone liner, e.g., used without an outer container, and may be dispensed from a fixed pressure dispensing can. Folds in the rigid collapsible liner may be substantially eliminated, thereby substantially reducing or eliminating the problems associated with pinholes, weld tears, and overflow. The present disclosure also relates to flexible gusseted or non-gusseted liners, which is scalable in size and may be used for storage of up to 200 L or more. The flexible gusseted liner may be foldable, such that the liner can be introduced into a dispensing can. The liner can be made of thicker materials, substantially reducing or eliminating the problems associated pinholes, and may include more robust welds, substantially reducing or eliminating the problems associated weld tears.Type: ApplicationFiled: July 9, 2010Publication date: October 25, 2012Applicant: Advanced Technology Materials, Inc.Inventors: Glenn Tom, Thomas H. Baum, Matt Kusz, Joseph Menning, Greg Nelson, Dongyun Lee, Wei Liu, Kanghyun Kim, Karl Boggs, Richard Chism
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Publication number: 20110048063Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.Type: ApplicationFiled: June 22, 2008Publication date: March 3, 2011Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
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Publication number: 20100248480Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.Type: ApplicationFiled: June 10, 2010Publication date: September 30, 2010Applicant: ADVANCED TECHNOLOGY MATERIALS INC.Inventors: Michael Darsillo, Peter Wrschka, Karl Boggs
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Patent number: 7736405Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.Type: GrantFiled: May 12, 2003Date of Patent: June 15, 2010Assignee: Advanced Technology Materials, Inc.Inventors: Michael Darsillo, Peter Wrschka, Karl Boggs
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Publication number: 20090239777Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: ApplicationFiled: March 23, 2009Publication date: September 24, 2009Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
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Patent number: 7300601Abstract: A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent. Such CMP composition advantageously is devoid of BTA, and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions, e.g., Cu2+, in the bulk CMP composition at the copper/CMP composition interface during CMP processing.Type: GrantFiled: December 10, 2002Date of Patent: November 27, 2007Assignee: Advanced Technology Materials, Inc.Inventors: Jun Liu, Peter Wrschka, David Bernhard, MacKenzie King, Michael Darsillo, Karl Boggs
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Publication number: 20070181852Abstract: A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent. Such CMP composition advantageously is devoid of BTA, and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions, e.g., Cu2+, in the bulk CMP composition at the copper/CMP composition interface during CMP processing.Type: ApplicationFiled: April 10, 2007Publication date: August 9, 2007Inventors: Jun Liu, Peter Wrschka, David Bernhard, MacKenzie King, Michael Darsillo, Karl Boggs
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Publication number: 20060249482Abstract: A CMP composition and process for planarization of a semiconductor wafer surface having a copper barrier layer portion, said composition comprising an oxidizing agent, a boric acid component, and an abrasive.Type: ApplicationFiled: May 10, 2004Publication date: November 9, 2006Inventors: Peter Wrschka, David Bernhard, Karl Boggs, Michael Darsillo
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Publication number: 20050263490Abstract: A method of passivating a CMP composition by dilution and determining the relationship between the extent of dilution and the static etch rate of copper. Such relationship may be used to control the CMP composition during the CMP polish to minimize the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions in the CMP composition and at the copper/CMP composition interface.Type: ApplicationFiled: April 28, 2005Publication date: December 1, 2005Inventors: Jun Liu, Mackenzie King, Michael Darsillo, Karl Boggs, Jeffrey Roeder, Thomas Baum
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Patent number: RE46427Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.Type: GrantFiled: January 13, 2015Date of Patent: June 6, 2017Assignee: Entegris, Inc.Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs