Patents by Inventor Karl Boggs

Karl Boggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170096624
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prema Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 9528078
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: December 27, 2016
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 9522773
    Abstract: The present disclosure relates to a blow-molded, rigid collapsible liner that can be suitable particularly for smaller storage and dispensing systems. The rigid collapsible liner may be a stand-alone liner, e.g., used without an outer container, and may be dispensed from a fixed pressure dispensing can. Folds in the rigid collapsible liner may be substantially eliminated, thereby substantially reducing or eliminating the problems associated with pinholes, weld tears, and overflow. The present disclosure also relates to flexible gusseted or non-gusseted liners, which is scalable in size and may be used for storage of up to 200 L or more. The flexible gusseted liner may be foldable, such that the liner can be introduced into a dispensing can. The liner can be made of thicker materials, substantially reducing or eliminating the problems associated pinholes, and may include more robust welds, substantially reducing or eliminating the problems associated weld tears.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: December 20, 2016
    Assignee: Entegris, Inc.
    Inventors: Glenn Tom, Thomas H. Baum, Matthew Kusz, Joseph Menning, Greg Nelson, Dongyun Lee, Wei Liu, Kanghyun Kim, Karl Boggs, Richard Chism
  • Publication number: 20160159519
    Abstract: A pressure dispense method and system for reducing the presence of folds for a liquid-filled liner within an overpack while reducing the loads and stresses on the liquid-filled liner. The flexible liner is of a conformal size and shape to the interior space of the overpack so that the flexible liner does not pull downward and away from the interior surface of the overpack when the flexible liner is filled with a liquid. The flexible liner also configured to eliminate folding in upon itself when the liner is filled with a liquid within the overpack.
    Type: Application
    Filed: December 4, 2015
    Publication date: June 9, 2016
    Inventors: Richard D. Chism, Amy Koland, Wei Liu, John Davis, Glenn Tom, Matthew Kusz, Karl Boggs
  • Patent number: 9132412
    Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: September 15, 2015
    Assignee: ENTEGRIS, INC.
    Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun M. Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
  • Publication number: 20140206588
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 8685909
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: April 1, 2014
    Assignee: Advanced Technology Materials, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Publication number: 20140034671
    Abstract: A liner having a tubular body portion with a top circumferential edge and a bottom circumferential edge, a generally circular bottom portion sealed to the tubular body portion along the bottom circumferential edge, and a generally circular top portion sealed to the tubular body portion along the top circumferential edge. The top portion may include a fitment sealed thereto. The tubular body portion may include at least one weld seam extending from the top circumferential edge to the bottom circumferential edge. In a particular embodiment, the tubular body portion may include two sheets welded together to form a tubular body, the tubular body portion thus having two weld seams extending from the top circumferential edge to the bottom circumferential edge.
    Type: Application
    Filed: December 9, 2011
    Publication date: February 6, 2014
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC
    Inventors: Richard Chism, Amy Koland, Wei Liu, John Davis, Glenn Tom, Matt Kusz, Karl Boggs
  • Publication number: 20140020419
    Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: Advanced Technology Materials, Inc.
    Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun M. Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney
  • Patent number: 8539781
    Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
    Type: Grant
    Filed: June 22, 2008
    Date of Patent: September 24, 2013
    Assignee: Advanced Technology Materials, Inc.
    Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
  • Publication number: 20120267388
    Abstract: The present disclosure relates to a blow-molded, rigid collapsible liner that can be suitable particularly for smaller storage and dispensing systems. The rigid collapsible liner may be a stand-alone liner, e.g., used without an outer container, and may be dispensed from a fixed pressure dispensing can. Folds in the rigid collapsible liner may be substantially eliminated, thereby substantially reducing or eliminating the problems associated with pinholes, weld tears, and overflow. The present disclosure also relates to flexible gusseted or non-gusseted liners, which is scalable in size and may be used for storage of up to 200 L or more. The flexible gusseted liner may be foldable, such that the liner can be introduced into a dispensing can. The liner can be made of thicker materials, substantially reducing or eliminating the problems associated pinholes, and may include more robust welds, substantially reducing or eliminating the problems associated weld tears.
    Type: Application
    Filed: July 9, 2010
    Publication date: October 25, 2012
    Applicant: Advanced Technology Materials, Inc.
    Inventors: Glenn Tom, Thomas H. Baum, Matt Kusz, Joseph Menning, Greg Nelson, Dongyun Lee, Wei Liu, Kanghyun Kim, Karl Boggs, Richard Chism
  • Publication number: 20110048063
    Abstract: An adsorption structure is described that includes at least one adsorbent member formed of an adsorbent material and at least one porous member provided in contact with a portion of the adsorbent member to allow gas to enter and exit the portion of the adsorbent member. Such adsorption structure is usefully employed in adsorbent-based refrigeration systems. A method also is described for producing an adsorbent material, in which a first polymeric material is provided having a first density and a second polymeric material is provided having a second density, in which the second polymeric material is in contact with the first polymeric material to form a structure. The structure is pyrolyzed to form a porous adsorbent material including a first region corresponding to the first polymeric material and a second region corresponding to the second polymeric material, in which at least one of the pore sizes and the pore distribution differs between the first region and the second region.
    Type: Application
    Filed: June 22, 2008
    Publication date: March 3, 2011
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: J. Donald Carruthers, Karl Boggs, Luping Wang, Shaun Wilson, Jose I. Arno, Paul J. Marganski, Steven M. Bilodeau, Peng Zou, Brian Bobita, Joseph D. Sweeney, Douglas Edwards
  • Publication number: 20100248480
    Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.
    Type: Application
    Filed: June 10, 2010
    Publication date: September 30, 2010
    Applicant: ADVANCED TECHNOLOGY MATERIALS INC.
    Inventors: Michael Darsillo, Peter Wrschka, Karl Boggs
  • Patent number: 7736405
    Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: June 15, 2010
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Michael Darsillo, Peter Wrschka, Karl Boggs
  • Publication number: 20090239777
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Application
    Filed: March 23, 2009
    Publication date: September 24, 2009
    Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs
  • Patent number: 7300601
    Abstract: A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent. Such CMP composition advantageously is devoid of BTA, and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions, e.g., Cu2+, in the bulk CMP composition at the copper/CMP composition interface during CMP processing.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: November 27, 2007
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Jun Liu, Peter Wrschka, David Bernhard, MacKenzie King, Michael Darsillo, Karl Boggs
  • Publication number: 20070181852
    Abstract: A CMP composition containing 5-aminotetrazole, e.g., in combination with oxidizing agent, chelating agent, abrasive and solvent. Such CMP composition advantageously is devoid of BTA, and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions, e.g., Cu2+, in the bulk CMP composition at the copper/CMP composition interface during CMP processing.
    Type: Application
    Filed: April 10, 2007
    Publication date: August 9, 2007
    Inventors: Jun Liu, Peter Wrschka, David Bernhard, MacKenzie King, Michael Darsillo, Karl Boggs
  • Publication number: 20060249482
    Abstract: A CMP composition and process for planarization of a semiconductor wafer surface having a copper barrier layer portion, said composition comprising an oxidizing agent, a boric acid component, and an abrasive.
    Type: Application
    Filed: May 10, 2004
    Publication date: November 9, 2006
    Inventors: Peter Wrschka, David Bernhard, Karl Boggs, Michael Darsillo
  • Publication number: 20050263490
    Abstract: A method of passivating a CMP composition by dilution and determining the relationship between the extent of dilution and the static etch rate of copper. Such relationship may be used to control the CMP composition during the CMP polish to minimize the occurrence of dishing or other adverse planarization deficiencies in the polished copper, even in the presence of substantial levels of copper ions in the CMP composition and at the copper/CMP composition interface.
    Type: Application
    Filed: April 28, 2005
    Publication date: December 1, 2005
    Inventors: Jun Liu, Mackenzie King, Michael Darsillo, Karl Boggs, Jeffrey Roeder, Thomas Baum
  • Patent number: RE46427
    Abstract: An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: June 6, 2017
    Assignee: Entegris, Inc.
    Inventors: David Angst, Peng Zhang, Jeffrey Barnes, Prerna Sonthalia, Emanuel Cooper, Karl Boggs