Patents by Inventor Karl Heinz Gasser

Karl Heinz Gasser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9935060
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: April 3, 2018
    Assignee: Infineon Technologies AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Publication number: 20170154857
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Application
    Filed: February 13, 2017
    Publication date: June 1, 2017
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Patent number: 9589880
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: March 7, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez
  • Publication number: 20160126197
    Abstract: A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the second metal layer.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 5, 2016
    Applicant: Infineon Technologies AG
    Inventors: Kurt Matoy, Dirk Ahlers, Ulrike Fastner, Petra Fischer, Karl-Heinz Gasser, Stephan Henneck, Stefan Krivec, Florian Weilnboeck
  • Patent number: 9177790
    Abstract: Methods, apparatuses and devices relate to inkjet printing a covering layer on at least a first side of a substrate in a peripheral region thereof are discussed.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: November 3, 2015
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Mischitz, Karl Heinz Gasser, John Cooper, Kae-Horng Wang
  • Publication number: 20150115415
    Abstract: Methods, apparatuses and devices relate to inkjet printing a covering layer on at least a first side of a substrate in a peripheral region thereof are discussed.
    Type: Application
    Filed: October 30, 2013
    Publication date: April 30, 2015
    Inventors: Martin Mischitz, Karl Heinz Gasser, John Cooper, Kae-Horng Wang
  • Publication number: 20150097294
    Abstract: A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 9, 2015
    Applicant: Infineon Technologies AG
    Inventors: Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez