Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.

Abstract: A method and system for detecting and determining icing conditions. The method includes: creating a statistical model from test data in which set of data from n data inputs are each plotted as a point in n-dimensional space, and wherein the n-dimensional space is divided into a plurality of regions each representative of a different icing condition according to the data in that region; for a set of current data from n data inputs, using the model to classify the icing condition indicated by the current data, by: obtaining current data from n data inputs; providing the current data as input data to the model; determining the region of the model in which the current data set is located; and identifying the icing condition indicated by the current data set according to the determined region.

Abstract: A power switch module includes a semiconductor die and a conductive busbar. The semiconductor die is electrically conductively mounted to the busbar. The module also includes a dielectric coolant fluid and the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid.

Abstract: A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.

Abstract: A system for heating an aircraft component of an aircraft includes a heater mat located adjacent the aircraft component and to generate heat. The system further includes a controller coupled to the heater mat and configured to receive an aircraft speed of the aircraft and an outside air temperature (OAT), and to control the heater mat based on the OAT and the aircraft speed.

Abstract: A multi-layered ice detector apparatus includes a first heater strip, a second heater strip, and a plurality of temperature sensors. The first heater strip is configured to be mounted to a surface, the first heater strip forming a first heater layer of the multi-layered ice detector apparatus. The second heater strip is coupled in proximity to the first heater strip, the second heater strip forming a second heater layer of the multi-layered ice detector apparatus. The plurality of temperature sensors are coupled to at least one of the first heater strip and the second heater strip, wherein the plurality of temperature sensors are configured to detect a temperature profile of the multi-layered ice detector apparatus, wherein the temperature profile is indicative of an extent of icing.

Abstract: An ice detection system for an aircraft surface includes a sensor assembly comprising a plurality of temperature sensitive elements configured to be arranged at respective points on the aircraft surface, a control unit arranged to receive signals indicative of a temperature sensed by each of the temperature sensitive elements, a signal conducting bus to transmit the signals from the temperature sensitive elements to the control unit, and means for providing power to the sensor assembly, wherein the sensor assembly further comprises a multiplexer arranged to multiplex the signals from the plurality of temperature sensitive elements into a single signal for transmission on the signal conducting bus to the control unit.

Abstract: A method of controlling a power converter having a plurality of parallel-connected switching devices, the method comprising: measuring a threshold voltage of each of the parallel switching devices at start up of the parallel power converter in an initial self-calibration process; and determining synchronization of a time at which the threshold voltages of the respective switching devices occur.

Abstract: A method of controlling a power converter having a plurality of parallel-connected switching devices, the method comprising: measuring a threshold voltage of each of the parallel switching devices at start up of the parallel power converter in an initial self-calibration process; and determining synchronization of a time at which the threshold voltages of the respective switching devices occur.