Patents by Inventor Katsuhiko Miya

Katsuhiko Miya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210090910
    Abstract: A substrate processing apparatus comprises: a first chamber; a liquid film former which forms a liquid film P of a solution containing a sublimable substance having sublimability on a surface of a substrate in the first chamber; a second chamber 30 which receives the substrate W having the liquid film; a plate unit 311 provided in the second chamber such that the substrate W is placeable on an upper surface thereof; a temperature controller 312, 335 which controls a temperature of the upper surface of the plate unit 311 to a predetermined temperature; and a heater 322 which heats and sublimates the sublimable substance precipitated from the solution on the substrate W placed on the plate unit 311.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Inventor: Katsuhiko MIYA
  • Patent number: 10619894
    Abstract: A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: April 14, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroaki Kitagawa, Dai Ueda, Katsuhiko Miya
  • Patent number: 10612844
    Abstract: When a substrate on which a fine pattern is formed is dried with vapor, prevention of collapse of the pattern due to water originally contained in IPA to be stored has been a problem to be solved. A mixed liquid stored in a mixed liquid storage is vaporized to generate mixed vapor containing the IPA and water (water vapor). Then, a vapor dewatering unit connected to a vapor supply pipe through which the mixed vapor is fed removes water in the mixed vapor. This can reduce the concentration of water originally contained in the IPA to be stored before the IPA is supplied to the substrate, thereby suppressing collapse of the pattern.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: April 7, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yosuke Hanawa, Katsuhiko Miya
  • Patent number: 10586693
    Abstract: A substrate processing apparatus comprises: a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate W held horizontally; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid forming the liquid film to the liquid film; a thawing liquid discharge nozzle which discharges a thawing liquid to a frozen film formed by freezing the liquid film; a thawing liquid supplier which supplies the heated thawing liquid to the thawing liquid discharge nozzle via a pipe; and a receiver which receives the cooling gas and the thawing liquid respectively discharged from the cooling gas discharge nozzle and the thawing liquid discharge nozzle at the respective retracted position and guides the cooling gas and the thawing liquid to a common flow passage.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: March 10, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Masahiko Kato, Katsuhiko Miya, Hiroyuki Yashiki
  • Patent number: 10286425
    Abstract: After hydrophobization of surfaces of patterns, a liquid film of pure water or the like is formed on the surfaces of the substrate. At this stage, the liquid of the liquid film cannot be present between the patterns because of hydrophobization, and gas is present there. With the front surface of the substrate covered with the liquid film, a liquid to which ultrasonic waves are applied is supplied to the back surface of the substrate, whereby the back surface of the substrate is cleaned due to the cavitation collapse energy in the liquid caused by the ultrasonic waves. While collapse of cavitation occurs at the front surface of the substrate, the presence of the gas between the patterns prohibits collapse of cavitation between the patterns, the liquid film can prevent contamination while preventing collapse of the patterns, and the back surface of the substrate is cleaned favorably.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: May 14, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuta Sasaki, Yosuke Hanawa, Katsuhiko Miya
  • Publication number: 20180345328
    Abstract: A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.
    Type: Application
    Filed: August 6, 2018
    Publication date: December 6, 2018
    Inventors: Hiroaki KITAGAWA, Katsuhiko MIYA
  • Patent number: 10065218
    Abstract: A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: September 4, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroaki Kitagawa, Katsuhiko Miya
  • Publication number: 20180238621
    Abstract: When a substrate on which a fine pattern is formed is dried with vapor, prevention of collapse of the pattern due to water originally contained in IPA to be stored has been a problem to be solved. A mixed liquid stored in a mixed liquid storage is vaporized to generate mixed vapor containing the IPA and water (water vapor). Then, a vapor dewatering unit connected to a vapor supply pipe through which the mixed vapor is fed removes water in the mixed vapor. This can reduce the concentration of water originally contained in the IPA to be stored before the IPA is supplied to the substrate, thereby suppressing collapse of the pattern.
    Type: Application
    Filed: April 23, 2018
    Publication date: August 23, 2018
    Inventors: Yosuke HANAWA, Katsuhiko MIYA
  • Publication number: 20180147609
    Abstract: A substrate processing method wherein a solidification liquid, having a solidification point higher than normal temperature, is supplied on a top surface of a substrate and solidified in a normal-temperature atmosphere to form a solidified material of the solidification liquid on the top surface.
    Type: Application
    Filed: January 31, 2018
    Publication date: May 31, 2018
    Inventors: Katsuhiko MIYA, Naozumi FUJIWARA
  • Patent number: 9976804
    Abstract: When a substrate on which a fine pattern is formed is dried with vapor, prevention of collapse of the pattern due to water originally contained in IPA to be stored has been a problem to be solved. A mixed liquid stored in a mixed liquid storage is vaporized to generate mixed vapor containing the IPA and water (water vapor). Then, a vapor dewatering unit connected to a vapor supply pipe through which the mixed vapor is fed removes water in the mixed vapor. This can reduce the concentration of water originally contained in the IPA to be stored before the IPA is supplied to the substrate, thereby suppressing collapse of the pattern.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: May 22, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yosuke Hanawa, Katsuhiko Miya
  • Patent number: 9922848
    Abstract: A rinsing liquid adheres to a substrate subjected to a cleaning process. The rinsing liquid on the substrate is first replaced with IPA liquid. While the substrate covered with the IPA liquid is held in a dryer chamber, liquid carbon dioxide is supplied to the surface of the substrate. Liquid nitrogen is supplied to cool down the interior of the dryer chamber. This solidifies the liquid carbon dioxide on the substrate into solid carbon dioxide. Thereafter, the pressure in the dryer chamber is returned to atmospheric pressure, and gaseous nitrogen is supplied into the dryer chamber. Thus, the temperature in the dryer chamber increases. The solid carbon dioxide on the surface of the substrate is sublimated, and is hence removed from the substrate. All of the steps are performed while carbon dioxide is not in a supercritical state but in a non-supercritical state.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: March 20, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Katsuhiko Miya, Hiroaki Kitagawa
  • Patent number: 9859110
    Abstract: An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: January 2, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yosuke Hanawa, Katsuhiko Miya, Yuta Sasaki
  • Publication number: 20170309472
    Abstract: An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 26, 2017
    Inventors: Yosuke HANAWA, Katsuhiko MIYA, Yuta SASAKI
  • Publication number: 20170287700
    Abstract: A substrate processing apparatus comprises: a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate W held horizontally; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid forming the liquid film to the liquid film; a thawing liquid discharge nozzle which discharges a thawing liquid to a frozen film formed by freezing the liquid film; a thawing liquid supplier which supplies the heated thawing liquid to the thawing liquid discharge nozzle via a pipe; and a receiver which receives the cooling gas and the thawing liquid respectively discharged from the cooling gas discharge nozzle and the thawing liquid discharge nozzle at the respective retracted position and guides the cooling gas and the thawing liquid to a common flow passage.
    Type: Application
    Filed: June 21, 2017
    Publication date: October 5, 2017
    Inventors: Masahiko KATO, Katsuhiko MIYA, Hiroyuki YASHIKI
  • Publication number: 20170278726
    Abstract: A substrate processing apparatus comprises: a first chamber; a liquid film former which forms a liquid film P of a solution containing a sublimable substance having sublimability on a surface of a substrate in the first chamber; a second chamber 30 which receives the substrate W having the liquid film; a plate unit 311 provided in the second chamber such that the substrate W is placeable on an upper surface thereof; a temperature controller 312, 335 which controls a temperature of the upper surface of the plate unit 311 to a predetermined temperature; and a heater 322 which heats and sublimates the sublimable substance precipitated from the solution on the substrate W placed on the plate unit 311.
    Type: Application
    Filed: March 24, 2017
    Publication date: September 28, 2017
    Inventor: Katsuhiko MIYA
  • Patent number: 9728396
    Abstract: An ultrasonic wave applying liquid is supplied to one principal surface of a substrate while a liquid film of a first liquid being formed on another principal surface of the substrate. The ultrasonic wave applying liquid is obtained by applying ultrasonic waves to a second liquid. Ultrasonic vibration is transmitted to the other principal surface and the liquid film, thereby ultrasonically cleaning the other principal surface. The first liquid has a higher cavitation intensity, which is a stress per unit area acting on the substrate by cavitation caused in the liquid when ultrasonic waves are transmitted to the liquid present on the principal surface of the substrate, than the second liquid.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: August 8, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yosuke Hanawa, Katsuhiko Miya, Yuta Sasaki
  • Publication number: 20170213725
    Abstract: A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 27, 2017
    Inventors: Hiroaki KITAGAWA, Dai UEDA, Katsuhiko MIYA
  • Publication number: 20170043379
    Abstract: After hydrophobization of surfaces of patterns, a liquid film of pure water or the like is formed on the surfaces of the substrate. At this stage, the liquid of the liquid film cannot be present between the patterns because of hydrophobization, and gas is present there. With the front surface of the substrate covered with the liquid film, a liquid to which ultrasonic waves are applied is supplied to the back surface of the substrate, whereby the back surface of the substrate is cleaned due to the cavitation collapse energy in the liquid caused by the ultrasonic waves. While collapse of cavitation occurs at the front surface of the substrate, the presence of the gas between the patterns prohibits collapse of cavitation between the patterns, the liquid film can prevent contamination while preventing collapse of the patterns, and the back surface of the substrate is cleaned favorably.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 16, 2017
    Inventors: Yuta SASAKI, Yosuke HANAWA, Katsuhiko MIYA
  • Publication number: 20160279679
    Abstract: A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.
    Type: Application
    Filed: March 11, 2016
    Publication date: September 29, 2016
    Inventors: Hiroaki KITAGAWA, Katsuhiko MIYA
  • Patent number: 9431276
    Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: August 30, 2016
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Katsuhiko Miya, Akira Izumi