Patents by Inventor Katsuhiro Morikawa

Katsuhiro Morikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11637035
    Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: April 25, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoshi Morita, Masami Akimoto, Katsuhiro Morikawa, Kouichi Mizunaga
  • Patent number: 11600500
    Abstract: A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: March 7, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kouzou Tachibana, Katsuhiro Morikawa, Kouichi Mizunaga
  • Patent number: 11551945
    Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 10, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsuhiro Morikawa, Masami Akimoto, Satoshi Morita, Kouichi Mizunaga
  • Patent number: 11532492
    Abstract: A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: December 20, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsuhiro Morikawa, Masami Akimoto
  • Patent number: 11515182
    Abstract: There is provided a drying apparatus for covering an upper surface of the substrate with an uneven pattern formed thereon with a liquid film and subsequently drying the substrate, including: a first heat transfer part whose temperature is adjusted to a first temperature, wherein a first heat is transferred between the first heat transfer part and the substrate by a first temperature difference; a second heat transfer part whose temperature is adjusted to a second temperature different from the first temperature, wherein a second heat is transferred between the second heat transfer part and the substrate by a second temperature difference; and a controller configured to control the first temperature and the second temperature and to control a surface tension distribution of the liquid film so as to control an agglomeration of the liquid film.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: November 29, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Katsuhiro Morikawa
  • Publication number: 20220371041
    Abstract: A processing liquid nozzle according to an aspect of the present invention comprises an ultrasonic application part (60), a first supply flow path (71), a discharge flow path (72), and a second supply flow path (73). The ultrasonic application part (60) has a vibrator (61) for generating ultrasonic waves, and a vibrating body (62) joined to the vibrator (61). The first supply flow path (71) supplies a first liquid (L1) to a position contacting the vibrating body (62) of the ultrasonic application part (60). The discharge flow path (72) supplies the first liquid (L1), to which ultrasonic waves have been applied by the ultrasonic application part (60), to a discharge port (74). The second supply flow path (73) is connected to the discharge flow path (72) on the downstream side from the ultrasonic application part (60), and supplies a second liquid (L2) to the discharge flow path (72).
    Type: Application
    Filed: September 14, 2020
    Publication date: November 24, 2022
    Inventors: Daisuke GOTO, Katsuhiro MORIKAWA, Takahiro KOGA
  • Patent number: 11510284
    Abstract: A substrate processing apparatus includes a rotary table configured to hold and rotate a substrate; an electronic component provided at the rotary table and configured to be rotated along with the rotary table; a first electrode unit provided at the rotary table and configured to be rotated along with the rotary table, the first electrode unit comprising multiple first electrodes electrically connected to the electronic component via multiple first conductive lines; an electric device configured to perform a power supply to the electronic component and a transmission/reception of signals; a second electrode unit comprising multiple second electrodes electrically connected to the electric device via multiple second conductive lines and arranged at positions respectively corresponding to the multiple first electrodes to be brought into contact with the multiple first electrodes; and an electrode moving device configured to connect/disconnect the first electrode unit to/from the second electrode unit.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: November 22, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Satoshi Morita, Masami Akimoto, Katsuhiro Morikawa, Kouichi Mizunaga, Kouzou Kawahara
  • Publication number: 20220347711
    Abstract: A substrate processing apparatus includes a substrate holder, a processing liquid supply and a cover unit. The substrate holder holds a substrate horizontally and rotate the substrate. The processing liquid supply supplies a processing liquid toward a first surface of the substrate held by the substrate holder. The cover unit faces a second surface of the substrate, the second surface being opposite to the first surface. The cover unit includes a heater configured to heat the substrate. The cover unit is provided with an opening at a position corresponding to a central portion of the substrate and multiple gas supply openings, at an outer peripheral side than the opening, through which a gas is supplied toward the second surface of the substrate. The gas is heated by the heater. A supply amount of at least some of the gas is adjusted based on a rotation speed of the substrate.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 3, 2022
    Inventors: Tetsuya Sakazaki, Katsuhiro Morikawa
  • Publication number: 20220154342
    Abstract: A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.
    Type: Application
    Filed: March 24, 2020
    Publication date: May 19, 2022
    Inventors: Katsuhiro Morikawa, Masami Akimoto, Mitsuaki Iwashita, Satoshi Kaneko
  • Publication number: 20220130691
    Abstract: A substrate processing method of performing liquid processing on a substrate in a substrate processing apparatus, which includes a substrate table configured to suction the substrate, a heater configured to heat the substrate table, and a processing liquid nozzle configured to supply a processing liquid to the substrate suctioned to the substrate table, includes: a suctioning process of suctioning the substrate by the substrate table when there is no temperature difference between the substrate and the substrate table or when a temperature difference between the substrate and the substrate is within a predetermined range; and after the suctioning process, a processing liquid supply process of supplying the processing liquid from the processing liquid nozzle to the substrate suctioned to the substrate table heated by the heater.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 28, 2022
    Inventors: Kouzou TACHIBANA, Katsuhiro MORIKAWA, Kouichi MIZUNAGA, Masami AKIMOTO, Kousuke NEGISHI
  • Publication number: 20220056590
    Abstract: A substrate processing apparatus includes a rotation driving mechanism configured to rotate a rotary table configured to hold a substrate; an electric heater provided in the rotary table to be rotated along with the rotary table and configured to heat the substrate; a power receiving electrode provided in the rotary table to be rotated along with the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode and configured to supply a power to the electric heater via the power receiving electrode; an electrode moving mechanism; a power feeder configured to supply the power to the power feeding electrode; a processing cup surrounding the rotary table; at least one processing liquid nozzle configured to supply a processing liquid; a processing liquid supply mechanism configured to supply at least an electroless plating liquid; and a controller.
    Type: Application
    Filed: September 26, 2019
    Publication date: February 24, 2022
    Inventors: Satoshi Morita, Masami Akimoto, Katsuhiro Morikawa, Kouichi Mizunaga, Mitsuaki Iwashita, Satoshi Kaneko
  • Patent number: 11244849
    Abstract: Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: February 8, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsuhiro Morikawa, Yuta Matsushima
  • Publication number: 20220020611
    Abstract: A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Inventors: Kouzou Tachibana, Katsuhiro Morikawa, Kouichi Mizunaga
  • Patent number: 11208725
    Abstract: A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 28, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kouichi Mizunaga, Masami Akimoto, Satoshi Morita, Katsuhiro Morikawa
  • Patent number: 11097907
    Abstract: A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 24, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Katsuhiro Morikawa
  • Publication number: 20200365425
    Abstract: There is provided a drying apparatus for covering an upper surface of the substrate with an uneven pattern formed thereon with a liquid film and subsequently drying the substrate, including: a first heat transfer part whose temperature is adjusted to a first temperature, wherein a first heat is transferred between the first heat transfer part and the substrate by a first temperature difference; a second heat transfer part whose temperature is adjusted to a second temperature different from the first temperature, wherein a second heat is transferred between the second heat transfer part and the substrate by a second temperature difference; and a controller configured to control the first temperature and the second temperature and to control a surface tension distribution of the liquid film so as to control an agglomeration of the liquid film.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 19, 2020
    Inventor: Katsuhiro MORIKAWA
  • Publication number: 20200312678
    Abstract: A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Inventors: Katsuhiro Morikawa, Masami Akimoto
  • Publication number: 20200172351
    Abstract: A substrate transfer device according to an embodiment includes: a holding part configured to hold a substrate having a pattern formed on a front surface thereof; and a supply part configured to supply an inert gas, which locally keeps the front surface of the substrate held by the holding part in a low oxygen state, to the front surface of the substrate.
    Type: Application
    Filed: June 26, 2018
    Publication date: June 4, 2020
    Inventor: Katsuhiro MORIKAWA
  • Publication number: 20200105574
    Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Inventors: Satoshi Morita, Masami Akimoto, Katsuhiro Morikawa, Kouichi Mizunaga
  • Publication number: 20200102654
    Abstract: A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 2, 2020
    Inventors: Kouichi Mizunaga, Masami Akimoto, Satoshi Morita, Katsuhiro Morikawa