Patents by Inventor Katsuhito Mori

Katsuhito Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210138763
    Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Masami SAITO, Koji KONDO, Masashi TOTOKAWA, Hirotaka MIYANO, Yoshitake SUGANUMA, Kenichi YAGI, Yuichi KATO, Kunio MORI, Katsuhito MORI, Taiga HANDA
  • Patent number: 10385076
    Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: August 20, 2019
    Assignees: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Publication number: 20170334933
    Abstract: A surface treatment agent including a compound (?) is provided. The compound (?) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 23, 2017
    Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shuukichi TAKII, Shigeru MICHIWAKI, Manabu MIYAWAKI, Masanori YANAI, Kouichi KAMIYAMA, Hitomi CHIBA, Yasuyuki MASUDA
  • Patent number: 9790242
    Abstract: A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: the compound (?) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3?n, or —N{Rb—Si(Rc)n(ORd)3?n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: October 17, 2017
    Assignees: Sulfur Chemical Laboratory, Inc.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Patent number: 9593423
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: March 14, 2017
    Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Patent number: 9540403
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 10, 2017
    Assignees: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
  • Publication number: 20160152641
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 2, 2016
    Applicants: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO
  • Patent number: 9238757
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: January 19, 2016
    Assignees: Sulfur Chemical Laboratory Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo
  • Publication number: 20150152124
    Abstract: Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: said compound (?) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 4, 2015
    Applicants: Sulfur Chemical Laboratory, Inc., Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shuukichi Takii, Shigeru Michiwaki, Manabu Miyawaki, Masanori Yanai, Kouichi Kamiyama, Hitomi Chiba, Yasuyuki Masuda
  • Publication number: 20140227539
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Application
    Filed: March 18, 2014
    Publication date: August 14, 2014
    Applicants: Kunio Mori, Sulfur Chemical Institute Incorporated, MEIKO ELECTRONICS CO., LTD.
    Inventors: Kunio MORI, Yusuke MATSUNO, Katsuhito MORI, Takahiro KUDO, Shigeru MICHIWAKI, Manabu MIYAWAKI
  • Patent number: 8753748
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: June 17, 2014
    Assignees: Sulfur Chemical Laboratory Incorporated, Meiko Electronics Co., Ltd.
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Publication number: 20130177770
    Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
    Type: Application
    Filed: September 28, 2011
    Publication date: July 11, 2013
    Applicants: Sulfur Chemical Institute Incorporated, Kunio Mori
    Inventors: Kunio Mori, Yusuke Matsuno, Katsuhito Mori, Takahiro Kudo