Patents by Inventor Katsumi Maeda

Katsumi Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120021357
    Abstract: A photosensitive insulating resin composition, comprising a polymer, a photosensitizer, and an amide derivative that is expressed by the following general formula (1); (in formula (1), R1 represents a bivalent alkyl group, R2 represents a hydrocarbon group with a carbon number of 1 to 10, and R3 represents a hydrogen atom or an alkyl group with a carbon number of 1 to 4.
    Type: Application
    Filed: January 29, 2010
    Publication date: January 26, 2012
    Applicant: NEC CORPORATION
    Inventors: Katsumi Maeda, Shintaro Yamamichi
  • Publication number: 20120020707
    Abstract: An achromatic apparatus achromatizing an achromatic toner image on paper by an achromatic toner containing a near-infrared ray absorbing colorant that is a cyanine-based colorant, and an organic boron-based compound includes heater units each of which are a ceramic heater arranged across an achromatic convey path of an achromatic unit, and light source units each of which include an LED array chip having a center wavelength shifted to the long-wavelength side from the peak of the first absorption band of the near-infrared ray absorbing colorant and within a predetermined wavelength range. While the paper formed with the achromatic toner image is being conveyed through the achromatic convey path at a liner speed of equal to or faster than 15 mm/sec, the achromatic toner image is heated to a predetermined temperature, and is irradiated with achromatic light from the LED, and thus achromatized efficiently at a low energy consumption.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 26, 2012
    Applicants: Casio Computer Co., Ltd., Casio Electronics Manufacturing Co., Ltd.
    Inventors: Satoshi MITSUI, Katsumi Maeda, Yoiti Tamagawa
  • Publication number: 20110281217
    Abstract: This invention relates to a negative photosensitive insulating resin composition characterized in that the composition comprises an alkali-soluble polymer having at least one repeating constitutional unit represented by the following general formula (1), a cross-linker and a photo-acid generator. The negative photosensitive insulating resin composition provides a film having excellent properties such as heat resistance, mechanical properties and electric properties, and can be alkali-developed to achieve high resolution. (In the formula, R1 represents a hydrogen atom or a methyl group, and R2 to R5 represent, independently each other, a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms.
    Type: Application
    Filed: January 14, 2010
    Publication date: November 17, 2011
    Inventor: Katsumi Maeda
  • Publication number: 20110196122
    Abstract: There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0<x?1, 0?y<1 and 0?z<1; and a weight-average molecular weight of the polymer is in the range of 2000 to 200000, and a resin having a (meth)acrylate unit of an alicyclic lactone structure represented by the
    Type: Application
    Filed: April 15, 2011
    Publication date: August 11, 2011
    Inventors: Katsumi Maeda, Shigeyuki Iwasa, Kaichiro Nakano, Etsuo Hasegawa
  • Publication number: 20110175213
    Abstract: A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.
    Type: Application
    Filed: October 5, 2009
    Publication date: July 21, 2011
    Inventors: Kentaro Mori, Daisuke Ohshima, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Katsumi Kikuchi, Yoshiki Nakashima
  • Patent number: 7939241
    Abstract: The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an acid-decomposable group; and R3 to R6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: May 10, 2011
    Assignee: NEC Corporation
    Inventors: Katsumi Maeda, Kaichirou Nakano
  • Publication number: 20110044597
    Abstract: The present invention has an object to provide a photosensitive resin composition for optical waveguide formation, which has low transmission loss and can form a waveguide pattern with high shape accuracy at low cost; an optical waveguide; and a method for producing an optical waveguide. The present invention provides a photosensitive resin composition for optical waveguide formation comprising at least: a polymer containing at least a (meth)acrylate structure unit having an epoxy structure, and a (meth)acrylate structure unit having a lactone structure and/or a vinyl monomer structure unit having an aromatic structure; and a photoacid generator, of which one or both of a core layer and a cladding layer are formed of a cured product.
    Type: Application
    Filed: October 29, 2010
    Publication date: February 24, 2011
    Applicant: NEC CORPORATION
    Inventors: KATSUMI MAEDA, KAICHIRO NAKANO
  • Publication number: 20100329616
    Abstract: Provided are: a resin composition for the formation of an optical waveguide, which shows low transmission loss and high heat stability and enables to form a waveguide pattern at high shape accuracy and at low cost; an optical waveguide; a method of forming an optical waveguide; and an optical element using the method. A photosensitive resin composition is used, which includes a polyamic acid represented by a general formula (I) or a polyamic acid ester (A), a compound (B) having an epoxy group, and a compound (C) which generates an acid by being exposed to light.
    Type: Application
    Filed: August 29, 2007
    Publication date: December 30, 2010
    Inventors: Ning-Juan Chen, Shinji Ando, Kaichiro Nakano, Katsumi Maeda
  • Patent number: 7847017
    Abstract: The present invention has an object to provide a photosensitive resin composition for optical waveguide formation, which has low transmission loss and can form a waveguide pattern with high shape accuracy at low cost; an optical waveguide; and a method for producing an optical waveguide. The present invention provides a photosensitive resin composition for optical waveguide formation comprising at least: a polymer containing at least a (meth)acrylate structure unit having an epoxy structure, and a (meth)acrylate structure unit having a lactone structure and/or a vinyl monomer structure unit having an aromatic structure; and a photoacid generator, of which one or both of a core layer and a cladding layer are formed of a cured product.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: December 7, 2010
    Assignee: NEC Corporation
    Inventors: Katsumi Maeda, Kaichiro Nakano
  • Patent number: 7829207
    Abstract: A manufacture method that can manufacture ZnO based compound semiconductor crystal of good quality. A ZnO substrate is prepared to have a principal surface made of a plurality of terraces of (0001) planes arranged stepwise along an m-axis direction, the envelop of the principal surface being inclined relative to the (0001) plane by about 2 degrees or less. ZnO based compound semiconductor crystal is grown on the principal surface.
    Type: Grant
    Filed: September 27, 2008
    Date of Patent: November 9, 2010
    Assignees: Stanley Electric Co., Ltd., Tokyo Denpa Co., Ltd., Tohoku University
    Inventors: Hiroyuki Kato, Michihiro Sano, Katsumi Maeda, Hiroshi Yoneyama, Takafumi Yao, Meoung Whan Cho
  • Publication number: 20100150506
    Abstract: There are provided polymer optical waveguide forming material, a polymer optical waveguide and a manufacturing method of the polymer optical waveguide which reduces transmission loss with good processability. The polymer optical waveguide forming material is comprised of a polymer containing norbornene-based structural units including a hydroxy group; a photoacid generator for generating acid by irradiation of an actinic ray; and a monomer component polymerized by acid generated by said photoacid generator.
    Type: Application
    Filed: February 29, 2008
    Publication date: June 17, 2010
    Applicant: NEC Corporation
    Inventors: Katsumi Maeda, Kaichiro Nakano
  • Publication number: 20090283895
    Abstract: A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.
    Type: Application
    Filed: October 9, 2007
    Publication date: November 19, 2009
    Applicant: NEC Corporation
    Inventors: Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Takuo Funaya, Kentaro Mori, Takehiko Maeda, Masaya Kawano, Yuuji Kayashima
  • Publication number: 20090068587
    Abstract: The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an acid-decomposable group; and R3 to R6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.
    Type: Application
    Filed: May 12, 2006
    Publication date: March 12, 2009
    Applicant: NEC Corporation
    Inventors: Katsumi Maeda, Kaichirou Nakano
  • Publication number: 20090045398
    Abstract: A manufacture method that can manufacture ZnO based compound semiconductor crystal of good quality. A ZnO substrate is prepared to have a principal surface made of a plurality of terraces of (0001) planes arranged stepwise along an m-axis direction, the envelop of the principal surface being inclined relative to the (0001) plane by about 2 degrees or less. ZnO based compound semiconductor crystal is grown on the principal surface.
    Type: Application
    Filed: September 27, 2008
    Publication date: February 19, 2009
    Inventors: Hiroyuki Kato, Michihiro Sano, Katsumi Maeda, Hiroshi Yoneyama, Takafumi Yao, Meoung Whan Cho
  • Publication number: 20090046986
    Abstract: The present invention has an object to provide a photosensitive resin composition for optical waveguide formation, which has low transmission loss and can form a waveguide pattern with high shape accuracy at low cost; an optical waveguide; and a method for producing an optical waveguide. The present invention provides a photosensitive resin composition for optical waveguide formation comprising at least: a polymer containing at least a (meth)acrylate structure unit having an epoxy structure, and a (meth)acrylate structure unit having a lactone structure and/or a vinyl monomer structure unit having an aromatic structure; and a photoacid generator, of which one or both of a core layer and a cladding layer are formed of a cured product.
    Type: Application
    Filed: November 1, 2006
    Publication date: February 19, 2009
    Applicant: NEC CORPORATION
    Inventors: Katsumi Maeda, Kaichiro Nakano
  • Publication number: 20090023878
    Abstract: There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0<x?1, 0?y<1 and 0?z<1; and a weight-average molecular weight of the polymer is in the range of 2000 to 200000, and a resin having a (meth)acrylate unit of an alicyclic lactone structure represented by the
    Type: Application
    Filed: August 29, 2008
    Publication date: January 22, 2009
    Inventors: Katsumi Maeda, Shigeyuki Iwasa, Kaichiro Nakano, Etsuo Hasegawa
  • Publication number: 20090001604
    Abstract: An oxide layer and a metal layer composed of a gold- or platinum-group metal are formed in the stated order on a substrate. A wiring body having a wiring layer, insulating layer, via, and electrode is formed on the metal layer. A semiconductor element is then connected as a flip chip via solder balls on the wiring body electrode, and underfill is introduced between the semiconductor element and the wiring body. Subsequently, a sealing resin layer is formed so as to cover the semiconductor element and the surface of the wiring body on which the semiconductor element is mounted, thus producing a semiconductor package. A high-density, detailed, thin semiconductor package can thereby be realized.
    Type: Application
    Filed: March 1, 2006
    Publication date: January 1, 2009
    Inventors: Daisuke Tanaka, Shintaro Yamamichi, Hideya Murai, Tadanori Shimoto, Kaichirou Nakano, Katsumi Maeda, Katsumi Kikuchi, Yoichiro Kurita, Kouji Soejima
  • Patent number: 7470499
    Abstract: A noble alicyclic unsaturated compound represented by the general formula (1): wherein at least one of R1 and R2 is a fluorine atom or a fluorinated alkyl group; a polymer formed by the polymerization of a polymer precursor comprising the alicyclic compound. The polymer is useful, in the lithography using a light having a wavelength of 190 nm or less, as a chemically amplified resist which exhibits excellent transparency with respect to the light for use in exposure and also is excellent in the adhesion to a substrate and the resistance to dry etching.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: December 30, 2008
    Assignee: NEC Corporation
    Inventors: Katsumi Maeda, Kaichiro Nakano
  • Patent number: 7439005
    Abstract: There is disclosed a photosensitive resin composition for interlayer insulating films, surface protection films or the like, which exhibits excellent resolution and can be developed with an aqueous alkaline solution. The photosensitive resin composition is prepared using a polymer at least having a constitutional repeating unit represented by general formula II: wherein R1 represents hydrogen atom or methyl group; R2 to R9 independently represent hydrogen atom, halogen atom or alkyl group having 1 to 4 carbon atoms; X represents —CH?N—, —CONH—, —(CH2)n—CH?N— or —(CH2)n—CONH— and the N atom in X is bonded to a carbon atom in the benzene ring having AO— at an o-position; A represents hydrogen atom or a group being decomposed by an acid; and n represents a positive integer of 1 to 3.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: October 21, 2008
    Assignee: NEC Corporation
    Inventors: Katsumi Maeda, Kaichiro Nakano
  • Patent number: 7438762
    Abstract: A manufacture method that can manufacture ZnO based compound semiconductor crystal of good quality. A ZnO substrate is prepared to have a principal surface made of a plurality of terraces of (0001) planes arranged stepwise along an m-axis direction, the envelop of the principal surface being inclined relative to the (0001) plane by about 2 degrees or less. ZnO based compound semiconductor crystal is grown on the principal surface.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: October 21, 2008
    Assignee: Stanley Electric Co., Ltd., Tokyo Denpa Co., Ltd., and Tohoku University
    Inventors: Hiroyuki Kato, Michihiro Sano, Katsumi Maeda, Hiroshi Yoneyama, Takafumi Yao, Meoung Whan Cho