Patents by Inventor Katsumi Yasuda

Katsumi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8837777
    Abstract: A wafer detecting apparatus detects storage states of a plurality of wafers stored in a wafer container. The plurality of wafers are stored substantially horizontal in slots in the wafer container to be transferred in and out of a front opening of the wafer container. The wafer detecting apparatus includes a vertically extending illumination device that emits light through the front opening onto the plurality of wafers and an imaging device that receives the light reflected from the plurality of wafers. The imaging device is arranged substantially directly in front of the wafer container and the illumination device is arranged in at least one of left and right sides of the imaging device.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: September 16, 2014
    Assignee: Sinfonia Technology Co., Ltd.
    Inventors: Katsumi Yasuda, Toshio Kamigaki, Takumi Mizokawa
  • Publication number: 20120281875
    Abstract: A wafer detecting apparatus detects storage states of a plurality of wafers stored in a wafer container. The plurality of wafers are stored substantially horizontal in slots in the wafer container to be transferred in and out of a front opening of the wafer container. The wafer detecting apparatus includes a vertically extending illumination device that emits light through the front opening onto the plurality of wafers and an imaging device that receives the light reflected from the plurality of wafers. The imaging device is arranged substantially directly in front of the wafer container and the illumination device is arranged in at least one of left and right sides of the imaging device.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 8, 2012
    Applicant: SINFONIA TECHNOLOGY CO., LTD.
    Inventors: Katsumi Yasuda, Toshio Kamigaki, Takumi Mizokawa
  • Patent number: 8177048
    Abstract: A vacuum processing apparatus includes a vacuum chamber capable of keeping a first pressure lower than an atmospheric pressure, a driving source disposed in the vacuum chamber, an electric power supply mechanism including a primary side mechanism disposed outside the vacuum chamber for supplying electric power to the driving source and a secondary side mechanism disposed in the vacuum chamber for receiving the electric power from the primary side mechanism in a contactless relationship, and a vessel capable of accommodating airtightly the secondary side mechanism under a second pressure higher than the first pressure.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: May 15, 2012
    Assignee: Sinfonia Technology Co., Ltd.
    Inventors: Yushi Sato, Toshio Miki, Yosuke Muraguchi, Katsumi Yasuda, Kazunari Kitaji, Yasushi Muragishi, Minoru Maeda
  • Publication number: 20100036523
    Abstract: A vacuum processing apparatus includes a vacuum chamber capable of keeping a first pressure lower than an atmospheric pressure, a driving source disposed in the vacuum chamber, an electric power supply mechanism including a primary side mechanism disposed outside the vacuum chamber for supplying electric power to the driving source and a secondary side mechanism disposed in the vacuum chamber for receiving the electric power from the primary side mechanism in a contactless relationship, and a vessel capable of accommodating airtightly the secondary side mechanism under a second pressure higher than the first pressure.
    Type: Application
    Filed: August 6, 2009
    Publication date: February 11, 2010
    Applicant: SINFONIA TECHNOLOGY CO., LTD.
    Inventors: Yushi SATO, Toshio Miki, Yosuke Muraguchi, Katsumi Yasuda, Kazunari Kitaji, Yasushi Muragishi, Minoru Maeda
  • Patent number: 6914233
    Abstract: The wafer mapping system has an access port for transferring a wafer in and out and detects an accommodated wafer for a cassette in which slots for accommodating and holding inserted wafers are disposed in tiers. The wafer mapping system includes (1) a receiver that is fixed to a member facing the access port for receiving elements arranged serially along a height direction of the cassette, and (2) a transmitter that is disposed movable in an up and down direction of the cassette and transmits a signal toward a wafer accommodated in each of the slots of the cassette. The receiver receives a signal from the transmitter, and thereby the presence or absence of a wafer and a state of a wafer accommodated in each of the slots of the cassette are detected. Thereby, with a simple system configuration, an accommodation state of the wafer can be accurately detected.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: July 5, 2005
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Yasuyoshi Kitazawa, Shigeto Suzuki, Toshio Miki, Susumu Nakagawa, Katsumi Yasuda, Kazunari Kitaji
  • Publication number: 20030119214
    Abstract: A wafer mapping system according to the present invention is provided with an access port for transferring in and out a wafer, and performs a detection operation of an accommodated wafer to a cassette in which slots for accommodating and holding substantially level a plurality of inserted wafers are disposed in a plurality of tiers. The wafer mapping system comprises: a receiver that is fixed to a member facing the access port and formed of receiving elements arranged serially along a height direction of the cassette; and a transmitter that is disposed movable in a up and down direction of the cassette and transmits a signal toward a wafer accommodated in each of the slots of the cassette; wherein the receiver receives a signal transmitted from the transmitter, and thereby presence or absence and a state of a wafer accommodated in each of the slots of the cassette are detected. Thereby, with a simple system configuration, an accommodation state of the wafer in a FOUP can be accurately detected.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 26, 2003
    Applicant: SHINKO ELECTRIC CO., LTD.
    Inventors: Yasuyoshi Kitazawa, Shigeto Suzuki, Toshio Miki, Susumu Nakagawa, Katsumi Yasuda, Kazunari Kitaji
  • Patent number: 6460711
    Abstract: A suspension type hoisting apparatus has the position of an elevating portion, which is elevatably suspended from a base via a suspension member, adjusted by a positioning member for positioning the suspension member suspended from a carriage in the horizontal plane. The suspension type hoisting apparatus also includes a position controller for outputting a velocity reference signal on the basis of a deviation between a position reference signal of the positioning member and the actual position thereof, and a velocity controller for outputting a force reference signal being a manipulated variable of the positioning member on the basis of a deviation between the velocity reference signal, of the positioning member, outputted from the position controller and the actual velocity thereof; wherein a sway velocity of the elevating portion is detected.
    Type: Grant
    Filed: April 1, 1999
    Date of Patent: October 8, 2002
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Kazumichi Kato, Yuushi Sato, Susumu Nakagawa, Katsumi Yasuda, Tsukasa Sugino
  • Patent number: 6041274
    Abstract: A pickup sensor for picking up an image on a floor is installed on a mobile body with a working machine mounted thereon in order to correct for the position deviation of a working machine due to possible deviation in the stop position of a mobile body to always ensure accurate working without increasing the working time of the overall system at the time of stopping the mobile body at a predetermined position and allowing said working machine to perform predetermined operation according to previously given teaching data. At the time the teaching data is given, the pickup sensor picks up an image (reference picked image) including a regular pattern and a predetermined identification mark formed on a floor. At the time the working machine works, the pickup sensor also picks up an image (on-pause picked image) on the floor surface at the stop position.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: March 21, 2000
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Masanori Onishi, Masanao Murata, Yutaka Nakai, Katsumi Yasuda, Tsukasa Sugino, Susumu Nakagawa, Kouji Miura