Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a conductive cured silicone product that has low resistance and resistivity values, a resistance value independent of temperature, and little variation in resistance and resistivity values over time.

Abstract: A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of said filler is higher in the layer of said cured material remote from the element than in the layer of said cured material adjoining the element. The method for fabricating such a device comprises coating the surface of a semiconductor element with a curable silicone composition in which there is dispersed a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 and thereafter curing said composition after the elapse of sufficient time for the filler in the layer of the composition adjoining the element to migrate into the layer of said composition remote from the element.

Abstract: A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0.

Abstract: Method for curing UV-curable silicone compositions, characterized by the formation of cured silicone, having a low-tack surface that is harder than the interior, by exposing an ultraviolet-curable silicone composition to ultraviolet radiation at a ratio of the exposure dose for wavelengths of 200 to 280 nm (excluding 280 nm) to the exposure dose for wavelengths of 280 to 400 nm of 0.5 to 10.0.

Abstract: A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

Abstract: A curable composition containing a curable liquid-form organopolysiloxane composition and a curable liquid-form organic resin composition. The organic resin composition is contained as liquid particles in the organopolysiloxane composition. A cured product formed by curing the abovementioned curable liquid composition such that the cured product contains fine particles of a cured organic resin in a cured organopolysiloxane matrix. An electronic part which is covered by the cured product of the abovementioned curable liquid-form composition.

Abstract: A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.

Abstract: A two-part composition comprising a liquid composition (I) composed of the components (A), (C), and (E) described below and a liquid composition (II) composed of the components (A) (B), (C), and (D) described below, which yield upon mixing a curable liquid silicone composition comprising(A) an alkenyl-substituted poyorganopolysiloxane;(B) a hydrogen-substituted organopolysiloxane in an amount that provides 0.3 to 10 moles silicon-bonded hydrogen from component (B) per 1 mole alkenyl in component (A);(C) an inorganic filler that has a specific surface of 50 to 500 m.sup.2 /g;(D) an alkoxy-substituted organopolysiloxane; and(E) platinum catalyst in a quantity sufficient to cure the instant composition;wherein the curable silicone composition that results when liquid composition (I) and liquid composition (II) are mixed, is thixotropic and has a viscosity, immediately upon the mixing that is greater than the viscosity of liquid composition (II).

Abstract: Curable silicone compositions comprise either (a) microparticles of a fluororesin which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture and heat resistance.

Abstract: Disclosed is a highly reproducible method for the molecular weight fractionation of polyhydrogen silsesquioxane that gives a very storage-stable polyhydrogen silsesquioxane having a freely selectable molecular weight. The method involves dissolving polyhydrogen silsesquioxane in active-hydrogen-free nonpolar solvent; adding an active-hydrogen-free polar solvent to the resulting solution in order to precipitate polyhydrogen silsesquioxane; and collecting the desired molecular weight fraction of polyhydrogen silsesquioxane.

Abstract: Disclosed is a highly reproducible method for the molecular weight fractionation of polyhydrogen silsesquioxane that gives a very storage-stable polyhydrogen silsesquioxane having a freely selectable molecular weight. The method involves dissolving polyhydrogen silsesquioxane in active-hydrogen-free nonpolar solvent; adding an active-hydrogen-free polar solvent to the resulting solution in order to precipitate polyhydrogen silsesquioxane; and collecting the desired molecular weight fraction of polyhydrogen silsesquioxane.

Abstract: Disclosed is a method for the formation of ceramic silicon oxide films on substrate surfaces wherein said films are thick, free of cracks and pinholes, and insoluble in organic solvents. These films are formed by coating the surface of a substrate with a silicon resin having the general formula(HR.sub.2 SiO.sub.1/2).sub.X (SiO.sub.4/2).sub.1.0wherein R is selected from the set comprising the hydrogen atom, alkyl groups, and aryl groups, and 0.1.ltoreq.X.ltoreq.2.0, and then heating the coated substrate to convert the coating into a ceramic silicon oxide film.

Abstract: Disclosed is a method for the formation of a thick silicon oxide film which is insoluble in organic solvents and free of cracks and pinholes on the surface of a substrate. The method comprises forming a hydrogen silsesquioxane resin film on the surface of a substrate, converting the hydrogen silsesquioxane resin into preceramic silicon oxide by heating in an inert gas atmosphere, and converting the preceramic silicon oxide into silicon oxide ceramic by heating in an atmosphere selected from the group consisting of oxygen and oxygen mixed with an inert gas.

Abstract: Disclosed is a method for the formation of a thick silicon oxide film on the surface of a substrate. The method comprises forming a hydrogen silsesquioxane resin film on the surface of a substrate and converting the hydrogen silsesquioxane resin into silicon oxide ceramic by heating the resin film-bearing substrate in an inert gas atmosphere at 250.degree. C. to 500.degree. C. until the content of silicon-bonded hydrogen in the silicon oxide product has reached .ltoreq.80% of the content of silicon-bonded hydrogen in the hydrogen silsesquioxane.

Abstract: Disclosed is a method for the formation of a thick silicon oxide film on the surface of a substrate. The method comprises forming a hydrogen silsesquioxane resin film on the surface of a substrate followed by converting the hydrogen silsesquioxane resin into silicon oxide ceramic by heating the resin film-bearing substrate in a mixed gas atmosphere of above 0 volume % up to 20 volume % oxygen and 80 volume % up to, but not including, 100 vol % inert gas until the content of silicon-bonded hydrogen in the silicon oxide product has reached .ltoreq.80% of the content of silicon-bonded hydrogen in the hydrogen silsesquioxane resin.

Abstract: Disclosed is a method for the preparation of high molecular-weight silicone resins that have excellent storage stability in solution form. The method comprises the hydrolysis and condensation of a disiloxane and an alkyl silicate in an aqueous solution which contains at least 30 weight % alcohol and at least 5 weight % inorganic acid followed by isolation of the resin with an organic solvent which is poorly soluble in water and which has a dielectric constant of at least 4.

Abstract: A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

Abstract: An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.

Abstract: An industrial measuring apparatus comprises first and second sensors having identical measuring characteristics and arranged close to each other and also close to a common subject of measurement, for measuring the same parameter, a transmitting unit having an adder and a first subtracter respectively connected the sensors through amplifiers, and a receiving unit having a second subtracter connected to the adder and the first subtracter through two transmission lines and constituting a noise canceling device in cooperation with the adder and the first subtracter. The second subtracter produces a receiving signal by subtracting the output of the subtracter representing the difference between the outputs of the first and second sensors from the output of the adder representing the sum of the outputs of the two sensors.