Abstract: A noncontact power supply device provided with one or more coil units and a cover housing the coil units inside of it. The cover is formed by joining a first sheet arranged at one surface sides of front and back surfaces of the coil units and a second sheet arranged at the other surface sides, the first sheet is a sheet covering the one surface sides of the coil units, the second sheet is a sheet having another surface part covering the other surface sides of the coil units and side surface parts covering side surfaces, the side surface parts of the second sheet are made to abut against side surfaces of the coil units by bending boundaries with the other surface part, and outer edge parts of the side surface parts of the second sheet and outer edge parts of the first sheet are joined.

Abstract: A noncontact power supply device is comprised of a plurality of coil units each having a coil for transmitting power to an object for receiving power by noncontact. Furthermore, the coil units are joined together by a bonding agent having rubbery elasticity.

Abstract: A noncontact power supply apparatus includes a coil unit having a coil for transmitting electric power to a power supply target by noncontact and an electromagnetic shield for reducing a leakage magnetic field of the coil. The electromagnetic shield is the laminate body in which the metal plates are laminated. A lubricant having a predetermined viscosity is applied to a contacting surface between the metal plates.

Abstract: A power transmission coil unit provided with a board having at its back surface a component mounting part to which electronic components are mounted and a coil forming part at which a coil comprised of a conductor pattern is formed, a core arranged so as to abut against a back surface of the board and formed with a hole for housing the electronic components at a position facing the electronic components, and a protective member provided at a further front surface side of the power transmission coil unit than the component mounting part of the board and receiving a load applied to the power transmission coil unit. A space is formed on a back surface side of the facing portion of the protective member positioned at the location facing the component mounting part.

Abstract: A power transmitting coil unit includes a board on which a coil comprised of a conductor pattern is formed and to a back surface side of which capacitors are mounted, a core arranged at a back surface side of the board and formed with a hole at a position facing the capacitors, a bottom plate arranged at a back surface side of the core, a space formed defined by a back surface of the board, a front surface of the bottom plate, and an inner circumferential surface of the hole and in which the capacitors are housed, and support member arranged in the space and supporting the board.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: Disclosed is an electronic device comprising an IC element 10, a first circuit layer 20 on the surface of which is formed an antenna circuit 21 composed of a conductive layer, and a second circuit layer 30 on the surface of which is formed a conductive layer 31. The IC element 10 comprises a base substrate 11 composed of silicon, a semiconductor circuit layer 12 formed on one side of the base substrate 11 in which layer a semiconductor circuit is formed, and an electrode 13 formed on the semiconductor circuit layer 12. The first circuit layer 20 is connected to either the other side of the base substrate 11 or the electrode 13, and the second circuit layer 30 is electrically connected to either that same other side of the base substrate 11 or the electrode 13 which ever is not connected to the first circuit layer 20. Consequently the electronic device can be efficiently produced at low-cost while achieving good communications properties.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: A method of manufacturing an electronic device comprising IC elements 10, on a set of opposite faces of which a first electrode 12 and a second electrode 13 are formed, a first circuit layer 20 where an antenna circuit 21 having a slit 1 is formed, and a second circuit layer 30 for electrically connecting the IC elements 10 and the antenna circuit 21. The IC elements 10 are placed individually in cutouts 74, into each of which one IC element 10 can be inserted, the cutouts being formed in the outer circumference of a disk-like carrier 70. Thus, with the method, an electronic device that is inexpensive and is manufactured with high productivity, and has improved communication characteristics is manufactured.