Patents by Inventor Katsuya Okumura

Katsuya Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11413573
    Abstract: An air purifying system is a system for purifying air in a room, and the air purifying system includes: a carbon dioxide removing device including a first space and a second space that are divided from each other by a separation membrane that selectively allows carbon dioxide to permeate therethrough; a feed passage that leads the air in the room to the first space; a return passage that leads purified air from which carbon dioxide has been removed from the first space to the room; a supply passage that supplies sweep gas to the second space, the sweep gas having a carbon dioxide partial pressure that is lower than a carbon dioxide partial pressure in the air in the room; and a discharge passage that discharges the sweep gas from the second space after the sweep gas is mixed with the carbon dioxide that has permeated through the separation membrane.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: August 16, 2022
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Katsuya Umemoto, Teruo Kishimoto, Kazuhiro Okumura
  • Publication number: 20220187026
    Abstract: Provided is a heat storage unit having a simple configuration, capable of being attached to various objects, and capable of efficiently performing heat exchange. The heat storage unit has at least one inorganic fiber member configured by binding or entangling flexible inorganic fibers and having a desired shape; and a heat storage material in contact with the inorganic fibers.
    Type: Application
    Filed: April 17, 2020
    Publication date: June 16, 2022
    Inventors: Katsuya OKUMURA, Shuhei HATANO, Ritsu KAWASE, Hideki MORIUCHI
  • Patent number: 11291945
    Abstract: The invention of the present application provides a self-heating sheet-like material for moisture absorption and desorption which includes at least a self-heating layer and an adsorption layer in a laminate thereof, in which the self-heating layer and the adsorption layer are connected in a state in which heat conduction is enabled; a moisture absorption and desorption body formed of this material; and a moisture absorption and desorption device.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: April 5, 2022
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Katsuya Okumura, Minoru Tsuchida, Daisuke Muramatsu
  • Publication number: 20220026162
    Abstract: The present invention provides a temperature control unit capable of efficiently controlling a temperature of a specific object with reduced risk of failure of electronic components due to leakage of a temperature control medium. The temperature control unit (1), which controls a temperature of a specific object, contains a temperature control medium, and a metal fiber sheet (50) that is formed with a space serving as a channel of the temperature control medium. The latent heat of evaporation of the temperature control medium is within the range of from 70 to 200 kJ/kg when the temperature control medium changes the state from a liquid state to a gaseous state. The volume expansion rate of the temperature control medium is at most 250 times when the temperature control medium changes the state from a liquid state to a gaseous state under atmospheric pressure.
    Type: Application
    Filed: December 9, 2019
    Publication date: January 27, 2022
    Inventors: Shuhei Hatano, Hideki Moriuchi, Katsuya Okumura
  • Publication number: 20220026345
    Abstract: Provided is a seal material having high rigidity without deformation or breakage, excellent corrosion resistance to fluid, and low solubility when used under high sealing force, and to provide a flow cell, a detector, and an analyzer in which there is no fluid leakage, contamination of the seal material components is prevented, and the replacement frequency is low. Provided are a seal material for an analyzer, including a resin and at least one layer of fiber sheet embedded in the resin, wherein the at least one layer of fiber sheet is embedded between and in substantially parallel to two seal surfaces: a first seal surface, which is one resin surface of the seal material; and a second seal surface, which is the other resin surface substantially parallel to the former one, and a flow cell, a detector, and an analyzer using the seal material.
    Type: Application
    Filed: August 13, 2019
    Publication date: January 27, 2022
    Inventors: Minoru TSUCHIDA, Akiyasu OYAIZU, Yusuke NAGAI, Katsuya OKUMURA
  • Patent number: 10988876
    Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: April 27, 2021
    Assignee: Tomoegawa Co., Ltd
    Inventors: Katsuya Okumura, Hajime Tsuda
  • Patent number: 10636551
    Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: April 28, 2020
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Katsuya Okumura, Kazuhiro Eguchi, Daisuke Muramatsu
  • Publication number: 20200063302
    Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.
    Type: Application
    Filed: January 10, 2018
    Publication date: February 27, 2020
    Inventors: Katsuya Okumura, Hajime Tsuda
  • Publication number: 20190348200
    Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.
    Type: Application
    Filed: January 11, 2018
    Publication date: November 14, 2019
    Inventors: Katsuya Okumura, Kazuhiro Eguchi, Daisuke Muramatsu
  • Publication number: 20190308132
    Abstract: The invention of the present application provides a self-heating sheet-like material for moisture absorption and desorption which includes at least a self-heating layer and an adsorption layer in a laminate thereof, in which the self-heating layer and the adsorption layer are connected in a state in which heat conduction is enabled; a moisture absorption and desorption body formed of this material; and a moisture absorption and desorption device.
    Type: Application
    Filed: January 10, 2018
    Publication date: October 10, 2019
    Inventors: Katsuya Okumura, Minoru Tsuchida, Daisuke Muramatsu
  • Publication number: 20190257014
    Abstract: Provided is a copper fiber nonwoven fabric having a bonding portion between copper fibers, and in the relationship between compressive stress and strain, is provided with a first region exhibiting plastic deformation and a second region exhibiting elastic deformation in which compressive stress is higher than the first region. Alternatively, the copper fiber nonwoven fabric has a bonding portion between copper fibers, and in the relationship between compressive stress and strain, has a region exhibiting elastic deformation, wherein the region exhibiting elastic deformation has an elastic deformation region before an inflection portion a, the inflection portion a, and an elastic deformation region after the inflection portion a.
    Type: Application
    Filed: September 22, 2017
    Publication date: August 22, 2019
    Inventors: Katsuya Okumura, Minoru Tsuchida, Hajime Tsuda, Daisuke Muramatsu
  • Patent number: 10153181
    Abstract: Disclosed is a substrate treating apparatus including the following units: a supplying unit which supplies a process liquid including a sublimable substance in a melt state on a pattern-formed surface of a substrate W; a solidifying unit which solidifies the process liquid on the pattern-formed surface to produce a solidified body; and a sublimating unit which sublimates the solidified body to remove the solidified body from the pattern-formed surface. In this apparatus, the sublimable substance includes a fluorinated carbon compound.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: December 11, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuta Sasaki, Yosuke Hanawa, Soichi Nadahara, Dai Ueda, Hiroaki Kitagawa, Katsuya Okumura
  • Patent number: 10109501
    Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: October 23, 2018
    Assignees: FUJI ELECTRIC CO., LTD., Octec, Inc.
    Inventors: Koh Yoshikawa, Haruo Nakazawa, Kenichi Iguchi, Yasukazu Seki, Katsuya Okumura
  • Patent number: 9884350
    Abstract: According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: February 6, 2018
    Assignee: Toshiba Memory Corporation
    Inventors: Masamitsu Itoh, Katsuya Okumura, Taro Inada, Jun Watanabe
  • Publication number: 20180006125
    Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.
    Type: Application
    Filed: September 1, 2017
    Publication date: January 4, 2018
    Inventors: Koh YOSHIKAWA, Haruo NAKAZAWA, Kenichi IGUCHI, Yasukazu SEKI, Katsuya OKUMURA
  • Patent number: 9786749
    Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 10, 2017
    Assignees: FUJI ELECTRIC CO., LTD., Octec, Inc.
    Inventors: Koh Yoshikawa, Haruo Nakazawa, Kenichi Iguchi, Yasukazu Seki, Katsuya Okumura
  • Publication number: 20170148882
    Abstract: A semiconductor device having a voltage resistant structure in a first aspect of the present invention is provided, comprising a semiconductor substrate, a semiconductor layer on the semiconductor substrate, a front surface electrode above the semiconductor layer, a rear surface electrode below the semiconductor substrate, an extension section provided to a side surface of the semiconductor substrate, and a resistance section electrically connected to the front surface electrode and the rear surface electrode. The extension section may have a lower permittivity than the semiconductor substrate. The resistance section may be provided to at least one of the upper surface and the side surface of the extension section.
    Type: Application
    Filed: September 29, 2016
    Publication date: May 25, 2017
    Inventors: Koh YOSHIKAWA, Haruo NAKAZAWA, Kenichi IGUCHI, Yasukazu SEKI, Katsuya OKUMURA
  • Publication number: 20150190851
    Abstract: According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.
    Type: Application
    Filed: March 20, 2015
    Publication date: July 9, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Masamitsu ITOH, Katsuya OKUMURA, Taro INADA, Jun WATANABE
  • Patent number: 9034467
    Abstract: According to one embodiment, a reticle chuck cleaner for cleaning a reticle chuck of an EUV exposure apparatus includes a substrate having a shape to be carried to the reticle chuck of the EUV exposure apparatus, and an adhesive formed on one of the main surfaces of the substrate.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: May 19, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Masamitsu Itoh, Katsuya Okumura, Taro Inada, Jun Watanabe
  • Patent number: 9035453
    Abstract: A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: May 19, 2015
    Assignees: OCTEC, INC., FUJI ELECTRIC CO., LTD., KYOCERA CORPORATION
    Inventors: Katsuya Okumura, Yoshikazu Takahashi, Kazunori Takenouchi