Patents by Inventor Katsuya TSUNEOKA

Katsuya TSUNEOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210075169
    Abstract: An IC socket incudes a socket body having a housing portion for accommodating an IC package; a contact pin electrically connected to a solder ball of the IC package; an operating member provided movably up and down on the socket body; and a pad which is opened and closed by an up and down movement of the operating member and covers an upper side of the IC package in a closed state. The housing portion is provided with an annular portion surrounding a side periphery of an accommodating area of the IC package, an accommodating space for the electric component is formed when the pad is closed and abuts the annular portion, and the pad is configured to be spaced upwardly from an upper surface of the IC package which is accommodated in the accommodating space when the pad is closed and abuts the annular portion.
    Type: Application
    Filed: December 13, 2018
    Publication date: March 11, 2021
    Applicant: ENPLAS CORPORATION
    Inventors: Ryota Toyama, Katsuya Tsuneoka
  • Publication number: 20200251867
    Abstract: A socket for electrical component that can make it difficult to attach foreign matter to the top surface of the electrical component even in an open-top type. The solution is to provide a contact pin 50 which is electrically connected to a terminal 4 of the electrical component 2 in a socket body 20 having a housing portion 23 which houses the electrical component 2. A latch 40 is also provided for pressing the electrical component 2 while the electrical component 2 is closed by an opening/closing operation. An operating member 30 which activates the latch 40 is moveable up and down with respect to the socket body 20. The socket 10 is provided with a pressing portion 44, 48 which presses the electrical component 2 in the latch 40 and a covering portion 43, 47 which covers a predetermined portion 5 of the electrical component 2.
    Type: Application
    Filed: July 26, 2018
    Publication date: August 6, 2020
    Applicant: ENPLAS CORPORATION
    Inventor: Katsuya TSUNEOKA